USD998680S1 - Camera body - Google Patents
Camera body Download PDFInfo
- Publication number
- USD998680S1 USD998680S1 US29/752,302 US202029752302F USD998680S US D998680 S1 USD998680 S1 US D998680S1 US 202029752302 F US202029752302 F US 202029752302F US D998680 S USD998680 S US D998680S
- Authority
- US
- United States
- Prior art keywords
- camera body
- view
- ornamental design
- camera
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
Description
Claims (1)
- The ornamental design for a camera body, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/752,302 USD998680S1 (en) | 2020-09-18 | 2020-09-25 | Camera body |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/026,149 US11503699B2 (en) | 2020-09-18 | 2020-09-18 | Single PCB board camera with enhanced signal integrity and thermal conduction |
US29/752,302 USD998680S1 (en) | 2020-09-18 | 2020-09-25 | Camera body |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/026,149 Continuation US11503699B2 (en) | 2020-09-18 | 2020-09-18 | Single PCB board camera with enhanced signal integrity and thermal conduction |
Publications (1)
Publication Number | Publication Date |
---|---|
USD998680S1 true USD998680S1 (en) | 2023-09-12 |
Family
ID=80645402
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/026,149 Active 2041-05-06 US11503699B2 (en) | 2020-09-18 | 2020-09-18 | Single PCB board camera with enhanced signal integrity and thermal conduction |
US29/752,302 Active USD998680S1 (en) | 2020-09-18 | 2020-09-25 | Camera body |
US17/987,806 Active US11832379B2 (en) | 2020-09-18 | 2022-11-15 | Single PCB board camera with enhanced signal integrity and thermal conduction |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/026,149 Active 2041-05-06 US11503699B2 (en) | 2020-09-18 | 2020-09-18 | Single PCB board camera with enhanced signal integrity and thermal conduction |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/987,806 Active US11832379B2 (en) | 2020-09-18 | 2022-11-15 | Single PCB board camera with enhanced signal integrity and thermal conduction |
Country Status (2)
Country | Link |
---|---|
US (3) | US11503699B2 (en) |
CN (1) | CN114205491A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11503699B2 (en) | 2020-09-18 | 2022-11-15 | Pony Ai Inc. | Single PCB board camera with enhanced signal integrity and thermal conduction |
EP4290851A1 (en) * | 2022-06-09 | 2023-12-13 | Veoneer Sweden AB | Circuit board for a camera module of a motor vehicle |
CN117373257B (en) * | 2023-10-30 | 2024-06-21 | 人机互联网络(深圳)有限公司 | Vehicle identification method, device and system based on movable camera |
Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD354925S (en) * | 1994-01-31 | 1995-01-31 | C & K Systems, Inc. | Infra-red intruder detector |
USD440502S1 (en) * | 1999-10-15 | 2001-04-17 | Smc Kabushiki Kaisha | Regulator for a fluid apparatus |
USD494989S1 (en) * | 2002-07-30 | 2004-08-24 | Mitsumi Electric Co., Ltd. | Internet camera |
USD591182S1 (en) * | 2008-02-27 | 2009-04-28 | Hansgrohe Ag | Electronic shower control |
USD616321S1 (en) * | 2007-09-05 | 2010-05-25 | Amx Llc | Door bell |
US7755668B1 (en) | 1998-04-09 | 2010-07-13 | Johnston Gregory E | Mobile surveillance system |
US8178395B2 (en) | 2008-03-25 | 2012-05-15 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via |
US8310067B2 (en) | 2000-12-22 | 2012-11-13 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
USD676461S1 (en) * | 2011-11-09 | 2013-02-19 | Governors America Corp. | Governor |
US20160191863A1 (en) | 2014-12-31 | 2016-06-30 | Gentex Corporation | Rear vehicle camera |
USD809406S1 (en) * | 2016-05-31 | 2018-02-06 | Smc Corporation | Setting unit for pressure sensor with display |
US20180175491A1 (en) | 2016-12-20 | 2018-06-21 | Autoliv Asp, Inc. | Integrated camera and communication antenna |
US10027865B1 (en) * | 2017-03-23 | 2018-07-17 | Largan Precision Co., Ltd. | Plastic barrel, camera module, and electronic device |
US20190124243A1 (en) | 2017-10-23 | 2019-04-25 | Magna Electronics Inc. | Camera for vehicle vision system with enhanced heat removal |
US20190199894A1 (en) * | 2017-12-26 | 2019-06-27 | Triple Win Technology(Shenzhen) Co.Ltd. | Camera device |
USD853865S1 (en) * | 2017-10-03 | 2019-07-16 | Johnson Controls Technology Company | Controller housing |
US10484587B2 (en) | 2015-03-09 | 2019-11-19 | Magna Electronics Inc. | Vehicle camera with connector system for high speed transmission |
USD868876S1 (en) * | 2018-01-25 | 2019-12-03 | Altia Systems, Inc. | Camera carrier |
US20200018919A1 (en) * | 2018-07-11 | 2020-01-16 | Tdk Corporation | Lens drive device |
JP1656732S (en) * | 2019-10-09 | 2020-04-06 | ||
US20200244847A1 (en) * | 2019-01-30 | 2020-07-30 | Audio Technology Switzerland S.A. | Miniature video recorder |
US20200260011A1 (en) * | 2015-11-16 | 2020-08-13 | Mitsumi Electric Co., Ltd. | Lens driving device, camera module and camera-mounted device |
US10756000B2 (en) | 2014-03-18 | 2020-08-25 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
US20210294068A1 (en) * | 2018-08-07 | 2021-09-23 | Ningbo Sunny Opotech Co., Ltd. | Camera apparatus, sma driving device and manufacturing method, driving method and wiring method thereof |
US20220150410A1 (en) * | 2020-11-11 | 2022-05-12 | Changzhou Aac Raytech Optronics Co., Ltd. | Lens driving device |
US11503699B2 (en) * | 2020-09-18 | 2022-11-15 | Pony Ai Inc. | Single PCB board camera with enhanced signal integrity and thermal conduction |
USD983854S1 (en) * | 2021-04-12 | 2023-04-18 | DeepView Corp. | Optical sensor with illuminated brand identification |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD787580S1 (en) | 2015-09-14 | 2017-05-23 | Jaunt Inc. | Camera module |
CN113259567B (en) | 2021-05-20 | 2023-02-07 | 昆山联滔电子有限公司 | Optical image stabilization imaging device |
-
2020
- 2020-09-18 US US17/026,149 patent/US11503699B2/en active Active
- 2020-09-25 US US29/752,302 patent/USD998680S1/en active Active
- 2020-12-24 CN CN202011544569.6A patent/CN114205491A/en active Pending
-
2022
- 2022-11-15 US US17/987,806 patent/US11832379B2/en active Active
Patent Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD354925S (en) * | 1994-01-31 | 1995-01-31 | C & K Systems, Inc. | Infra-red intruder detector |
US7755668B1 (en) | 1998-04-09 | 2010-07-13 | Johnston Gregory E | Mobile surveillance system |
USD440502S1 (en) * | 1999-10-15 | 2001-04-17 | Smc Kabushiki Kaisha | Regulator for a fluid apparatus |
US8310067B2 (en) | 2000-12-22 | 2012-11-13 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
USD494989S1 (en) * | 2002-07-30 | 2004-08-24 | Mitsumi Electric Co., Ltd. | Internet camera |
USD616321S1 (en) * | 2007-09-05 | 2010-05-25 | Amx Llc | Door bell |
USD591182S1 (en) * | 2008-02-27 | 2009-04-28 | Hansgrohe Ag | Electronic shower control |
US8178395B2 (en) | 2008-03-25 | 2012-05-15 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via |
USD676461S1 (en) * | 2011-11-09 | 2013-02-19 | Governors America Corp. | Governor |
US10756000B2 (en) | 2014-03-18 | 2020-08-25 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
US20160191863A1 (en) | 2014-12-31 | 2016-06-30 | Gentex Corporation | Rear vehicle camera |
US10484587B2 (en) | 2015-03-09 | 2019-11-19 | Magna Electronics Inc. | Vehicle camera with connector system for high speed transmission |
US20200260011A1 (en) * | 2015-11-16 | 2020-08-13 | Mitsumi Electric Co., Ltd. | Lens driving device, camera module and camera-mounted device |
USD809406S1 (en) * | 2016-05-31 | 2018-02-06 | Smc Corporation | Setting unit for pressure sensor with display |
US20180175491A1 (en) | 2016-12-20 | 2018-06-21 | Autoliv Asp, Inc. | Integrated camera and communication antenna |
US10027865B1 (en) * | 2017-03-23 | 2018-07-17 | Largan Precision Co., Ltd. | Plastic barrel, camera module, and electronic device |
USD853865S1 (en) * | 2017-10-03 | 2019-07-16 | Johnson Controls Technology Company | Controller housing |
US20190124243A1 (en) | 2017-10-23 | 2019-04-25 | Magna Electronics Inc. | Camera for vehicle vision system with enhanced heat removal |
US20190199894A1 (en) * | 2017-12-26 | 2019-06-27 | Triple Win Technology(Shenzhen) Co.Ltd. | Camera device |
USD868876S1 (en) * | 2018-01-25 | 2019-12-03 | Altia Systems, Inc. | Camera carrier |
US20200018919A1 (en) * | 2018-07-11 | 2020-01-16 | Tdk Corporation | Lens drive device |
US20210294068A1 (en) * | 2018-08-07 | 2021-09-23 | Ningbo Sunny Opotech Co., Ltd. | Camera apparatus, sma driving device and manufacturing method, driving method and wiring method thereof |
US20200244847A1 (en) * | 2019-01-30 | 2020-07-30 | Audio Technology Switzerland S.A. | Miniature video recorder |
JP1656732S (en) * | 2019-10-09 | 2020-04-06 | ||
US11503699B2 (en) * | 2020-09-18 | 2022-11-15 | Pony Ai Inc. | Single PCB board camera with enhanced signal integrity and thermal conduction |
US20220150410A1 (en) * | 2020-11-11 | 2022-05-12 | Changzhou Aac Raytech Optronics Co., Ltd. | Lens driving device |
USD983854S1 (en) * | 2021-04-12 | 2023-04-18 | DeepView Corp. | Optical sensor with illuminated brand identification |
Non-Patent Citations (7)
Title |
---|
"Charmed Labs Pixy2 Smart Vision Sensor - Object Tracking Camera for Arduino, Raspberry Pi, BeagleBone Black" from Amazon.com, first available 5-11-18 from the internet <https://www.amazon.com/Charmed-Labs-Pixy2-Vision-Sensor/dp/B07D1CLYD2/> (Year: 2018) * |
"MakerFocus ESP32 Camera Module WiFi Board: 3MP OV3660 Timer Webcam ESP32-cam Development Board Image Transmission Supports UART Communication Programmable M5Burner Firmware Burning Tool, black" from Amazon.com, first available 4-2-22 from the internet <https://www.amazon.com/MakerFocus-ESP32-Camera- (Year: 2022) * |
"OpenMV Cam H7 R2" from Openmv.io, retrieved 11-9-22 from the internet <https://openmv.io/products/openmv-cam-h7-r2> (Year: 2022) * |
[item V continued] Module-Board/dp/B09W2RSPGL/> * |
"Charmed Labs Pixy2 Smart Vision Sensor—Object Tracking Camera for Arduino, Raspberry Pi, BeagleBone Black" from Amazon.com, first available May 11, 2018 from the internet <https://www.amazon.com/Charmed-Labs-Pixy2-Vision-Sensor/dp/B07D1CLYD2/> (Year: 2018). * |
"MakerFocus ESP32 Camera Module WiFi Board: 3MP OV3660 Timer Webcam ESP32-cam Development Board Image Transmission Supports UART Communication Programmable M5Burner Firmware Burning Tool, black" from Amazon.com, first available Apr. 2, 2022 from the internet <https://www.amazon.com/MakerFocus-ESP32-Camera-Module-Board/dp/B09W2RSPGL/>. * |
"OpenMV Cam H7 R2" from Openmv.io, retrieved Nov. 9, 2022 from the internet <https://openmv.io/products/openmv-cam-h7-r2> (Year: 2022). * |
Also Published As
Publication number | Publication date |
---|---|
US20230074986A1 (en) | 2023-03-09 |
US20220095448A1 (en) | 2022-03-24 |
US11832379B2 (en) | 2023-11-28 |
US11503699B2 (en) | 2022-11-15 |
CN114205491A (en) | 2022-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |