USD998680S1 - Camera body - Google Patents

Camera body Download PDF

Info

Publication number
USD998680S1
USD998680S1 US29/752,302 US202029752302F USD998680S US D998680 S1 USD998680 S1 US D998680S1 US 202029752302 F US202029752302 F US 202029752302F US D998680 S USD998680 S US D998680S
Authority
US
United States
Prior art keywords
camera body
view
ornamental design
camera
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/752,302
Inventor
Li Niu
Hanxiao Xie
Bin Han
Zaichang Zhao
Jordan Renovato Bravo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pony AI Inc
Original Assignee
Pony AI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pony AI Inc filed Critical Pony AI Inc
Priority to US29/752,302 priority Critical patent/USD998680S1/en
Assigned to PONY AI INC. reassignment PONY AI INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAN, BIN, ZHAO, Zaichang, RENOVATO BRAVO, JORDAN, NIU, Li, XIE, HANXIAO
Application granted granted Critical
Publication of USD998680S1 publication Critical patent/USD998680S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Studio Devices (AREA)

Description

FIG. 1 is a front perspective view of a camera body showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a left-side view thereof;
FIG. 4 is a right-side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a rear view thereof; and,
FIG. 8 is a rear perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a camera body, as shown and described.
US29/752,302 2020-09-18 2020-09-25 Camera body Active USD998680S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/752,302 USD998680S1 (en) 2020-09-18 2020-09-25 Camera body

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/026,149 US11503699B2 (en) 2020-09-18 2020-09-18 Single PCB board camera with enhanced signal integrity and thermal conduction
US29/752,302 USD998680S1 (en) 2020-09-18 2020-09-25 Camera body

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US17/026,149 Continuation US11503699B2 (en) 2020-09-18 2020-09-18 Single PCB board camera with enhanced signal integrity and thermal conduction

Publications (1)

Publication Number Publication Date
USD998680S1 true USD998680S1 (en) 2023-09-12

Family

ID=80645402

Family Applications (4)

Application Number Title Priority Date Filing Date
US17/026,149 Active 2041-05-06 US11503699B2 (en) 2020-09-18 2020-09-18 Single PCB board camera with enhanced signal integrity and thermal conduction
US29/752,301 Active USD1073763S1 (en) 2020-09-18 2020-09-25 Camera device
US29/752,302 Active USD998680S1 (en) 2020-09-18 2020-09-25 Camera body
US17/987,806 Active US11832379B2 (en) 2020-09-18 2022-11-15 Single PCB board camera with enhanced signal integrity and thermal conduction

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US17/026,149 Active 2041-05-06 US11503699B2 (en) 2020-09-18 2020-09-18 Single PCB board camera with enhanced signal integrity and thermal conduction
US29/752,301 Active USD1073763S1 (en) 2020-09-18 2020-09-25 Camera device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US17/987,806 Active US11832379B2 (en) 2020-09-18 2022-11-15 Single PCB board camera with enhanced signal integrity and thermal conduction

Country Status (2)

Country Link
US (4) US11503699B2 (en)
CN (1) CN114205491A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1049628S1 (en) * 2024-04-13 2024-11-05 Feixiu (Shenzhen) Technology Co., Ltd. Camera case
USD1052894S1 (en) * 2023-05-10 2024-12-03 Shenzhen Hongao Electronic Co., Ltd. Camera case
USD1073763S1 (en) * 2020-09-18 2025-05-06 Pony Ai Inc. Camera device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12126884B1 (en) * 2021-06-02 2024-10-22 Apple Inc. Substrate to place components for camera size reduction
DE102021116319A1 (en) * 2021-06-24 2022-12-29 Valeo Schalter Und Sensoren Gmbh CAMERA DEVICE FOR A VEHICLE, VEHICLE AND METHOD OF MANUFACTURING A CAMERA DEVICE
EP4290851A1 (en) * 2022-06-09 2023-12-13 Veoneer Sweden AB Circuit board for a camera module of a motor vehicle
CN219181603U (en) * 2022-12-30 2023-06-13 三赢科技（深圳）有限公司 camera module
CN117373257B (en) * 2023-10-30 2024-06-21 人机互联网络(深圳)有限公司 Vehicle identification method, device and system based on movable camera
EP4572314B1 (en) * 2023-12-15 2025-09-10 Aptiv Technologies AG A pcb housing and assembly method therefor

Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD354925S (en) * 1994-01-31 1995-01-31 C & K Systems, Inc. Infra-red intruder detector
USD440502S1 (en) * 1999-10-15 2001-04-17 Smc Kabushiki Kaisha Regulator for a fluid apparatus
USD494989S1 (en) * 2002-07-30 2004-08-24 Mitsumi Electric Co., Ltd. Internet camera
USD591182S1 (en) * 2008-02-27 2009-04-28 Hansgrohe Ag Electronic shower control
USD616321S1 (en) * 2007-09-05 2010-05-25 Amx Llc Door bell
US7755668B1 (en) 1998-04-09 2010-07-13 Johnston Gregory E Mobile surveillance system
US8178395B2 (en) 2008-03-25 2012-05-15 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
US8310067B2 (en) 2000-12-22 2012-11-13 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
USD676461S1 (en) * 2011-11-09 2013-02-19 Governors America Corp. Governor
US20160191863A1 (en) 2014-12-31 2016-06-30 Gentex Corporation Rear vehicle camera
USD809406S1 (en) * 2016-05-31 2018-02-06 Smc Corporation Setting unit for pressure sensor with display
US20180175491A1 (en) 2016-12-20 2018-06-21 Autoliv Asp, Inc. Integrated camera and communication antenna
US10027865B1 (en) * 2017-03-23 2018-07-17 Largan Precision Co., Ltd. Plastic barrel, camera module, and electronic device
US20190124243A1 (en) 2017-10-23 2019-04-25 Magna Electronics Inc. Camera for vehicle vision system with enhanced heat removal
US20190199894A1 (en) * 2017-12-26 2019-06-27 Triple Win Technology(Shenzhen) Co.Ltd. Camera device
USD853865S1 (en) * 2017-10-03 2019-07-16 Johnson Controls Technology Company Controller housing
US10484587B2 (en) 2015-03-09 2019-11-19 Magna Electronics Inc. Vehicle camera with connector system for high speed transmission
USD868876S1 (en) * 2018-01-25 2019-12-03 Altia Systems, Inc. Camera carrier
US20200018919A1 (en) * 2018-07-11 2020-01-16 Tdk Corporation Lens drive device
JP1656732S (en) * 2019-10-09 2020-04-06
US20200244847A1 (en) * 2019-01-30 2020-07-30 Audio Technology Switzerland S.A. Miniature video recorder
US20200260011A1 (en) * 2015-11-16 2020-08-13 Mitsumi Electric Co., Ltd. Lens driving device, camera module and camera-mounted device
US10756000B2 (en) 2014-03-18 2020-08-25 Huawei Device Co., Ltd. Heat dissipation assembly and electronic device
US20210294068A1 (en) * 2018-08-07 2021-09-23 Ningbo Sunny Opotech Co., Ltd. Camera apparatus, sma driving device and manufacturing method, driving method and wiring method thereof
US20220150410A1 (en) * 2020-11-11 2022-05-12 Changzhou Aac Raytech Optronics Co., Ltd. Lens driving device
US11503699B2 (en) * 2020-09-18 2022-11-15 Pony Ai Inc. Single PCB board camera with enhanced signal integrity and thermal conduction
USD983854S1 (en) * 2021-04-12 2023-04-18 DeepView Corp. Optical sensor with illuminated brand identification

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19527702A1 (en) * 1995-07-28 1997-01-30 Kundo Systemtechnik Gmbh Measurement data processing computer for through-flow or heat amount units - has unit assembly in own housing arranged by measurement value transmitter for flow or for flow and temp. difference with housing structurely separated
CN103780847A (en) * 2012-10-24 2014-05-07 霍尼韦尔国际公司 Chip on board-based highly-integrated imager
WO2015057257A1 (en) * 2013-10-15 2015-04-23 Jil Holdings Llc Miniature high definition camera system
EP3691244B1 (en) * 2015-04-10 2021-06-09 Blackmagic Design Pty Ltd Digital video camera
USD787580S1 (en) * 2015-09-14 2017-05-23 Jaunt Inc. Camera module
US10235523B1 (en) * 2016-05-10 2019-03-19 Nokomis, Inc. Avionics protection apparatus and method
CN106097851A (en) * 2016-08-22 2016-11-09 江苏师范大学 A kind of transducing signal detection transition experiment case and sensor pocket case
CN106725354A (en) * 2016-12-06 2017-05-31 东莞市宇朔泰合健康科技有限公司 A kind of body temperature trans structure of the built-in AD conversion of quick thermal balance
CN206852597U (en) * 2017-01-12 2018-01-09 成都圣成通幽科技有限公司 Intelligent cardiac monitoring encapsulation paster based on NFC
US11069952B2 (en) * 2017-04-26 2021-07-20 Nokomis, Inc. Electronics card insitu testing apparatus and method utilizing unintended RF emission features
CN111465263B (en) * 2020-03-27 2022-08-05 惠州Tcl移动通信有限公司 Heat dissipation device and mobile terminal
US11252313B1 (en) * 2020-09-18 2022-02-15 Pony Ai Inc. Camera with improved mechanical stability
CN113259567B (en) * 2021-05-20 2023-02-07 昆山联滔电子有限公司 Optical image stabilization imaging device

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD354925S (en) * 1994-01-31 1995-01-31 C & K Systems, Inc. Infra-red intruder detector
US7755668B1 (en) 1998-04-09 2010-07-13 Johnston Gregory E Mobile surveillance system
USD440502S1 (en) * 1999-10-15 2001-04-17 Smc Kabushiki Kaisha Regulator for a fluid apparatus
US8310067B2 (en) 2000-12-22 2012-11-13 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
USD494989S1 (en) * 2002-07-30 2004-08-24 Mitsumi Electric Co., Ltd. Internet camera
USD616321S1 (en) * 2007-09-05 2010-05-25 Amx Llc Door bell
USD591182S1 (en) * 2008-02-27 2009-04-28 Hansgrohe Ag Electronic shower control
US8178395B2 (en) 2008-03-25 2012-05-15 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
USD676461S1 (en) * 2011-11-09 2013-02-19 Governors America Corp. Governor
US10756000B2 (en) 2014-03-18 2020-08-25 Huawei Device Co., Ltd. Heat dissipation assembly and electronic device
US20160191863A1 (en) 2014-12-31 2016-06-30 Gentex Corporation Rear vehicle camera
US10484587B2 (en) 2015-03-09 2019-11-19 Magna Electronics Inc. Vehicle camera with connector system for high speed transmission
US20200260011A1 (en) * 2015-11-16 2020-08-13 Mitsumi Electric Co., Ltd. Lens driving device, camera module and camera-mounted device
USD809406S1 (en) * 2016-05-31 2018-02-06 Smc Corporation Setting unit for pressure sensor with display
US20180175491A1 (en) 2016-12-20 2018-06-21 Autoliv Asp, Inc. Integrated camera and communication antenna
US10027865B1 (en) * 2017-03-23 2018-07-17 Largan Precision Co., Ltd. Plastic barrel, camera module, and electronic device
USD853865S1 (en) * 2017-10-03 2019-07-16 Johnson Controls Technology Company Controller housing
US20190124243A1 (en) 2017-10-23 2019-04-25 Magna Electronics Inc. Camera for vehicle vision system with enhanced heat removal
US20190199894A1 (en) * 2017-12-26 2019-06-27 Triple Win Technology(Shenzhen) Co.Ltd. Camera device
USD868876S1 (en) * 2018-01-25 2019-12-03 Altia Systems, Inc. Camera carrier
US20200018919A1 (en) * 2018-07-11 2020-01-16 Tdk Corporation Lens drive device
US20210294068A1 (en) * 2018-08-07 2021-09-23 Ningbo Sunny Opotech Co., Ltd. Camera apparatus, sma driving device and manufacturing method, driving method and wiring method thereof
US20200244847A1 (en) * 2019-01-30 2020-07-30 Audio Technology Switzerland S.A. Miniature video recorder
JP1656732S (en) * 2019-10-09 2020-04-06
US11503699B2 (en) * 2020-09-18 2022-11-15 Pony Ai Inc. Single PCB board camera with enhanced signal integrity and thermal conduction
US20220150410A1 (en) * 2020-11-11 2022-05-12 Changzhou Aac Raytech Optronics Co., Ltd. Lens driving device
USD983854S1 (en) * 2021-04-12 2023-04-18 DeepView Corp. Optical sensor with illuminated brand identification

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
"Charmed Labs Pixy2 Smart Vision Sensor - Object Tracking Camera for Arduino, Raspberry Pi, BeagleBone Black" from Amazon.com, first available 5-11-18 from the internet <https://www.amazon.com/Charmed-Labs-Pixy2-Vision-Sensor/dp/B07D1CLYD2/> (Year: 2018) *
"MakerFocus ESP32 Camera Module WiFi Board: 3MP OV3660 Timer Webcam ESP32-cam Development Board Image Transmission Supports UART Communication Programmable M5Burner Firmware Burning Tool, black" from Amazon.com, first available 4-2-22 from the internet <https://www.amazon.com/MakerFocus-ESP32-Camera- (Year: 2022) *
"OpenMV Cam H7 R2" from Openmv.io, retrieved 11-9-22 from the internet <https://openmv.io/products/openmv-cam-h7-r2> (Year: 2022) *
[item V continued] Module-Board/dp/B09W2RSPGL/> *
"Charmed Labs Pixy2 Smart Vision Sensor—Object Tracking Camera for Arduino, Raspberry Pi, BeagleBone Black" from Amazon.com, first available May 11, 2018 from the internet <https://www.amazon.com/Charmed-Labs-Pixy2-Vision-Sensor/dp/B07D1CLYD2/> (Year: 2018). *
"MakerFocus ESP32 Camera Module WiFi Board: 3MP OV3660 Timer Webcam ESP32-cam Development Board Image Transmission Supports UART Communication Programmable M5Burner Firmware Burning Tool, black" from Amazon.com, first available Apr. 2, 2022 from the internet <https://www.amazon.com/MakerFocus-ESP32-Camera-Module-Board/dp/B09W2RSPGL/>. *
"OpenMV Cam H7 R2" from Openmv.io, retrieved Nov. 9, 2022 from the internet <https://openmv.io/products/openmv-cam-h7-r2> (Year: 2022). *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1073763S1 (en) * 2020-09-18 2025-05-06 Pony Ai Inc. Camera device
USD1052894S1 (en) * 2023-05-10 2024-12-03 Shenzhen Hongao Electronic Co., Ltd. Camera case
USD1049628S1 (en) * 2024-04-13 2024-11-05 Feixiu (Shenzhen) Technology Co., Ltd. Camera case

Also Published As

Publication number Publication date
CN114205491A (en) 2022-03-18
USD1073763S1 (en) 2025-05-06
US20220095448A1 (en) 2022-03-24
US20230074986A1 (en) 2023-03-09
US11832379B2 (en) 2023-11-28
US11503699B2 (en) 2022-11-15

Similar Documents

Publication Publication Date Title
USD989155S1 (en) Camera
USD950198S1 (en) Hoodie
USD1011446S1 (en) Doll
USD946074S1 (en) Camera
USD998680S1 (en) Camera body
USD1040868S1 (en) Retention component
USD1014077S1 (en) Handbag
USD949943S1 (en) Camera
USD1069723S1 (en) Connector
USD1067190S1 (en) Connector
USD1067883S1 (en) Connector
USD992492S1 (en) Sliding connection part
USD985842S1 (en) Crown
USD1003514S1 (en) Crown
USD1069720S1 (en) Connector
USD1067884S1 (en) Connector
USD1069726S1 (en) Connector
USD1067197S1 (en) Connector
USD996372S1 (en) Trough
USD1069722S1 (en) Connector
USD1067194S1 (en) Connector
USD1016001S1 (en) Battery
USD1067881S1 (en) Connector
USD1012276S1 (en) Mask
USD1069725S1 (en) Connector

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY