USD937229S1 - Piezoelectric element - Google Patents
Piezoelectric element Download PDFInfo
- Publication number
- USD937229S1 USD937229S1 US29/713,820 US201929713820F USD937229S US D937229 S1 USD937229 S1 US D937229S1 US 201929713820 F US201929713820 F US 201929713820F US D937229 S USD937229 S US D937229S
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-10846F JP1649916S (enrdf_load_stackoverflow) | 2019-05-20 | 2019-05-20 | |
JP2019-010846 | 2019-05-20 |
Publications (1)
Publication Number | Publication Date |
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USD937229S1 true USD937229S1 (en) | 2021-11-30 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/713,820 Active USD937229S1 (en) | 2019-05-20 | 2019-11-19 | Piezoelectric element |
Country Status (2)
Country | Link |
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US (1) | USD937229S1 (enrdf_load_stackoverflow) |
JP (1) | JP1649916S (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1012871S1 (en) * | 2020-06-30 | 2024-01-30 | Roche Molecular Systems, Inc. | Circuit board sensor pad |
Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD356778S (en) * | 1993-03-25 | 1995-03-28 | Seiko Epson Corporation | Piezoelectric semiconductor element |
USD390833S (en) * | 1996-09-09 | 1998-02-17 | Fujikura Ltd. | Piezolectric conversion type semiconductor device |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
USD436085S1 (en) * | 1999-06-18 | 2001-01-09 | Fujikura, Ltd. | Piezoelectric conversion type semiconductor device |
US20090200898A1 (en) * | 2007-02-07 | 2009-08-13 | Chiharu Sakaki | Piezoelectric Ceramic and Piezoelectric Element |
US20090243440A1 (en) * | 2006-12-26 | 2009-10-01 | Murata Manufacturing Co., Ltd. | Piezoelectric ceramic compositions and piezoelectric elements |
USD604693S1 (en) * | 2008-02-18 | 2009-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion element |
US7923905B2 (en) * | 2005-11-30 | 2011-04-12 | Fujitsu Limited | Piezoelectric element and method for manufacturing the same |
US20120176703A1 (en) * | 2011-01-07 | 2012-07-12 | Nhk Spring Co., Ltd. | Method of manufacturing piezoelectric element, piezoelectric element, piezoelectric actuator, and head suspension |
US8233245B2 (en) * | 2009-05-29 | 2012-07-31 | Nhk Spring Co., Ltd. | Piezoelectric element with electrode and head suspension |
US20120248940A1 (en) * | 2011-03-30 | 2012-10-04 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric device and manufacturing method of piezoelectric device |
US20130088119A1 (en) * | 2010-06-10 | 2013-04-11 | Canon Kabushiki Kaisha | Piezoelectric material, piezoelectric element, liquid discharge head, ultrasonic motor, and dust cleaning device |
US20130278114A1 (en) * | 2012-04-24 | 2013-10-24 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric device and method for fabricating the same |
US20130300261A1 (en) * | 2012-05-08 | 2013-11-14 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric vibration module |
US8754575B2 (en) * | 2010-10-14 | 2014-06-17 | Nhk Spring Co., Ltd. | Piezoelectric element fitting structure and head suspension |
US20150255704A1 (en) * | 2014-03-10 | 2015-09-10 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric element and piezoelectric vibrator having the same |
US20160067968A1 (en) * | 2014-09-08 | 2016-03-10 | Seiko Epson Corporation | Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus |
US20160337760A1 (en) * | 2014-01-30 | 2016-11-17 | Kyocera Corporation | Piezoelectric element, and piezoelectric vibrating apparatus, portable terminal, sound generator, sound generating apparatus, and electronic device comprising the piezoelectric element |
US20170018701A1 (en) * | 2012-08-27 | 2017-01-19 | Canon Kabushiki Kaisha | Piezoelectric material piezoelectric element and electronic apparatus |
US9755134B2 (en) * | 2013-04-25 | 2017-09-05 | Tdk Corporation | Piezoelectric device |
US20170288129A1 (en) * | 2016-03-30 | 2017-10-05 | Ngk Insulators, Ltd. | Piezoelectric element |
US20170288126A1 (en) * | 2016-03-30 | 2017-10-05 | Ngk Insulators, Ltd. | Piezoelectric element |
USD806044S1 (en) * | 2014-09-16 | 2017-12-26 | Daishinku Corporation | Piezoelectric vibration device |
US20180013056A1 (en) * | 2016-07-07 | 2018-01-11 | Tdk Corporation | Piezoelectric element |
US20180009003A1 (en) * | 2015-03-05 | 2018-01-11 | Jung-Hoon Kim | Piezoelectric element vibration apparatus that provides real-time vibration feedback |
US20180090667A1 (en) * | 2016-09-29 | 2018-03-29 | Tdk Corporation | Piezoelectric element |
US20190027677A1 (en) * | 2017-07-20 | 2019-01-24 | Taiyo Yuden Co., Ltd. | Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device |
US20190033340A1 (en) * | 2016-02-22 | 2019-01-31 | Murata Manufacturing Co., Ltd. | Piezoelectric device |
US20190044054A1 (en) * | 2017-08-02 | 2019-02-07 | Canon Kabushiki Kaisha | Piezoelectric material, piezoelectric element, vibration wave motor, optical apparatus, and electronic apparatus |
US20190044053A1 (en) * | 2017-08-07 | 2019-02-07 | Taiyo Yuden Co., Ltd. | Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device |
USD857020S1 (en) * | 2016-05-25 | 2019-08-20 | Tdk Corporation | Piezoelectric element |
USD857021S1 (en) * | 2016-05-25 | 2019-08-20 | Tdk Corporation | Piezoelectric element |
-
2019
- 2019-05-20 JP JPD2019-10846F patent/JP1649916S/ja active Active
- 2019-11-19 US US29/713,820 patent/USD937229S1/en active Active
Patent Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD356778S (en) * | 1993-03-25 | 1995-03-28 | Seiko Epson Corporation | Piezoelectric semiconductor element |
USD390833S (en) * | 1996-09-09 | 1998-02-17 | Fujikura Ltd. | Piezolectric conversion type semiconductor device |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
USD436085S1 (en) * | 1999-06-18 | 2001-01-09 | Fujikura, Ltd. | Piezoelectric conversion type semiconductor device |
US7923905B2 (en) * | 2005-11-30 | 2011-04-12 | Fujitsu Limited | Piezoelectric element and method for manufacturing the same |
US20090243440A1 (en) * | 2006-12-26 | 2009-10-01 | Murata Manufacturing Co., Ltd. | Piezoelectric ceramic compositions and piezoelectric elements |
US20090200898A1 (en) * | 2007-02-07 | 2009-08-13 | Chiharu Sakaki | Piezoelectric Ceramic and Piezoelectric Element |
USD604693S1 (en) * | 2008-02-18 | 2009-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion element |
US8233245B2 (en) * | 2009-05-29 | 2012-07-31 | Nhk Spring Co., Ltd. | Piezoelectric element with electrode and head suspension |
US20130088119A1 (en) * | 2010-06-10 | 2013-04-11 | Canon Kabushiki Kaisha | Piezoelectric material, piezoelectric element, liquid discharge head, ultrasonic motor, and dust cleaning device |
US8754575B2 (en) * | 2010-10-14 | 2014-06-17 | Nhk Spring Co., Ltd. | Piezoelectric element fitting structure and head suspension |
US20120176703A1 (en) * | 2011-01-07 | 2012-07-12 | Nhk Spring Co., Ltd. | Method of manufacturing piezoelectric element, piezoelectric element, piezoelectric actuator, and head suspension |
US20120248940A1 (en) * | 2011-03-30 | 2012-10-04 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric device and manufacturing method of piezoelectric device |
US20130278114A1 (en) * | 2012-04-24 | 2013-10-24 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric device and method for fabricating the same |
US20130300261A1 (en) * | 2012-05-08 | 2013-11-14 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric vibration module |
US20170018701A1 (en) * | 2012-08-27 | 2017-01-19 | Canon Kabushiki Kaisha | Piezoelectric material piezoelectric element and electronic apparatus |
US9755134B2 (en) * | 2013-04-25 | 2017-09-05 | Tdk Corporation | Piezoelectric device |
US20160337760A1 (en) * | 2014-01-30 | 2016-11-17 | Kyocera Corporation | Piezoelectric element, and piezoelectric vibrating apparatus, portable terminal, sound generator, sound generating apparatus, and electronic device comprising the piezoelectric element |
US20150255704A1 (en) * | 2014-03-10 | 2015-09-10 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric element and piezoelectric vibrator having the same |
US20160067968A1 (en) * | 2014-09-08 | 2016-03-10 | Seiko Epson Corporation | Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus |
USD806044S1 (en) * | 2014-09-16 | 2017-12-26 | Daishinku Corporation | Piezoelectric vibration device |
US20180009003A1 (en) * | 2015-03-05 | 2018-01-11 | Jung-Hoon Kim | Piezoelectric element vibration apparatus that provides real-time vibration feedback |
US20190033340A1 (en) * | 2016-02-22 | 2019-01-31 | Murata Manufacturing Co., Ltd. | Piezoelectric device |
US20170288129A1 (en) * | 2016-03-30 | 2017-10-05 | Ngk Insulators, Ltd. | Piezoelectric element |
US20170288126A1 (en) * | 2016-03-30 | 2017-10-05 | Ngk Insulators, Ltd. | Piezoelectric element |
USD857020S1 (en) * | 2016-05-25 | 2019-08-20 | Tdk Corporation | Piezoelectric element |
USD857021S1 (en) * | 2016-05-25 | 2019-08-20 | Tdk Corporation | Piezoelectric element |
US20180013056A1 (en) * | 2016-07-07 | 2018-01-11 | Tdk Corporation | Piezoelectric element |
US20180090667A1 (en) * | 2016-09-29 | 2018-03-29 | Tdk Corporation | Piezoelectric element |
US20190027677A1 (en) * | 2017-07-20 | 2019-01-24 | Taiyo Yuden Co., Ltd. | Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device |
US20190044054A1 (en) * | 2017-08-02 | 2019-02-07 | Canon Kabushiki Kaisha | Piezoelectric material, piezoelectric element, vibration wave motor, optical apparatus, and electronic apparatus |
US20190044053A1 (en) * | 2017-08-07 | 2019-02-07 | Taiyo Yuden Co., Ltd. | Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1012871S1 (en) * | 2020-06-30 | 2024-01-30 | Roche Molecular Systems, Inc. | Circuit board sensor pad |
Also Published As
Publication number | Publication date |
---|---|
JP1649916S (enrdf_load_stackoverflow) | 2020-01-20 |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |