USD917585S1

USD917585S1 - Wafer processing machine for producing semiconductors

Info

Publication number: USD917585S1
Application number: US29/689,281
Authority: US
Inventors: Junji Okuma; Takeshi Sakamoto
Original assignee: Hamamatsu Photonics KK
Current assignee: Hamamatsu Photonics KK
Priority date: 2018-10-31
Filing date: 2019-04-29
Publication date: 2021-04-27
Anticipated expiration: 2036-04-27

Description

FIG. 1 is a front view of the first embodiment of a wafer processing machine for producing semiconductors of the present invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a Front View of Opening/Closing Part in Open State thereof;

FIG. 8 is an enlarged view thereof defined by the lines 8-8 and 8′-8′ in FIG. 7;

FIG. 9 is an enlarged sectional view thereof taken along the line 9-9 in FIG. 5 of the portion defined by the line 9′-9′ in FIG. 7;

FIG. 10 is an enlarged sectional view thereof taken along the line 10-10 in FIG. 7 of the portion defined by the line 10′-10′ and 10″-10″ in FIG. 3;

FIG. 11 is an enlarged sectional view thereof taken along the line 11-11 in FIG. 7 of the portion defined by the line 11′-11′ and 11″-11″ in FIG. 3;

FIG. 12 is an enlarged perspective view showing the claimed part and surroundings;

FIG. 13 is an enlarged perspective view 1 of the left-side processing part in FIG. 7, which is shown symmetrical to the enlarged perspective view of the right-side processing part in FIG. 7;

FIG. 14 is an enlarged perspective view 2 of the left-side processing part in FIG. 7, which is shown symmetrical to the enlarged perspective view of the right-side processing part in FIG. 7;

FIG. 15 is an enlarged sectional view thereof taken along the line 15-15 in FIG. 11 of the portion defined by the line 15′-15′ in FIG. 11;

FIG. 16 is a front view of the second embodiment of a wafer processing machine for producing semiconductors of the present invention;

FIG. 17 is a rear view thereof;

FIG. 18 is a top plan view thereof;

FIG. 19 is a bottom plan view thereof;

FIG. 20 is a right side view thereof;

FIG. 21 is a left side view thereof;

FIG. 22 is a Front View of Opening/Closing Part in Open State thereof;

FIG. 23 is an enlarged view thereof defined by the lines 23-23 and 23′-23′ in FIG. 22;

FIG. 24 is an enlarged sectional view thereof taken along the line 24-24 in FIG. 20 of the portion defined by the line 24′-24′ in FIG. 22;

FIG. 25 is an enlarged sectional view thereof taken along the line 25-25 in FIG. 22 of the portion defined by the line 25′-25′ and 25″-25″ in FIG. 18;

FIG. 26 is an enlarged sectional view thereof taken along the line 26-26 in FIG. 22 of the portion defined by the line 26′-26′ and 26″-26″ in FIG. 18;

FIG. 27 is an enlarged perspective view showing the claimed part and surroundings;

FIG. 28 is an enlarged perspective view 1 of the left-side processing part in FIG. 22, which is shown symmetrical to the enlarged perspective view of the right-side processing part in FIG. 22;

FIG. 29 is an enlarged perspective view 2 of the left-side processing part in FIG. 22, which is shown symmetrical to the enlarged perspective view of the right-side processing part in FIG. 22;

FIG. 30 is an enlarged sectional view thereof taken along the line 30-30 in FIG. 26 of the portion defined by the line 30′-30′ in FIG. 26;

FIG. 31 is a front view of the third embodiment of a wafer processing machine for producing semiconductors of the present invention;

FIG. 32 is a rear view thereof;

FIG. 33 is a top plan view thereof;

FIG. 34 is a bottom plan view thereof;

FIG. 35 is a right side view thereof;

FIG. 36 is a left side view thereof;

FIG. 37 is a Front View of Opening/Closing Part in Open State thereof;

FIG. 38 is an enlarged view thereof defined by the lines 38-38 and 38′-38′ in FIG. 37;

FIG. 39 is an enlarged sectional view thereof taken along the line 39-39 in FIG. 35 of the portion defined by the line 39′-39′ in FIG. 37;

FIG. 40 is an enlarged sectional view thereof taken along the line 40-40 in FIG. 37 of the portion defined by the line 40′-40′ and 40″-40″ in FIG. 33;

FIG. 41 is an enlarged sectional view thereof taken along the line 41-41 in FIG. 37 of the portion defined by the line 41′-41′ and 41″-41″ in FIG. 33;

FIG. 42 is an enlarged perspective view showing the claimed part and surroundings;

FIG. 43 is an enlarged perspective view 1 of the left-side processing part in FIG. 37, which is shown symmetrical to the enlarged perspective view of the right-side processing part in FIG. 37;

FIG. 44 is an enlarged perspective view 2 of the left-side processing part in FIG. 37, which is shown symmetrical to the enlarged perspective view of the right-side processing part in FIG. 37; and,

FIG. 45 is an enlarged sectional view thereof taken along the line 45-45 in FIG. 26 of the portion defined by the line 45′-45′ in FIG. 41.

The broken lines showing of the laser processing machine is included for the purpose of illustrating portions of the article and forms no part of the claimed design.

The alternate long and short dash broken lines define the bounds of claim and form no part of the claimed design.

Claims

CLAIM

The ornamental design for a wafer processing machine for producing semiconductors, as shown and described.