USD915308S1 - Light emitting diode chip - Google Patents

Light emitting diode chip Download PDF

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Publication number
USD915308S1
USD915308S1 US29/713,752 US201929713752F USD915308S US D915308 S1 USD915308 S1 US D915308S1 US 201929713752 F US201929713752 F US 201929713752F US D915308 S USD915308 S US D915308S
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United States
Prior art keywords
light emitting
emitting diode
diode chip
view
design
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US29/713,752
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English (en)
Inventor
Tsukasa Maruyama
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Dowa Electronics Materials Co Ltd
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Dowa Electronics Materials Co Ltd
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Assigned to DOWA ELECTRONICS MATERIALS CO., LTD. reassignment DOWA ELECTRONICS MATERIALS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MARUYAMA, TSUKASA
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US29/713,752 2019-06-04 2019-11-19 Light emitting diode chip Active USD915308S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-012240 2019-06-04
JPD2019-12240F JP1655194S (enrdf_load_stackoverflow) 2019-06-04 2019-06-04

Publications (1)

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USD915308S1 true USD915308S1 (en) 2021-04-06

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US (1) USD915308S1 (enrdf_load_stackoverflow)
JP (1) JP1655194S (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
USD996377S1 (en) 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1057674S1 (en) * 2023-02-08 2025-01-14 Autosystems, A Division Of Magna Exteriors Inc. Light emitting chip scale package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050173721A1 (en) * 2004-02-05 2005-08-11 Citizen Electronics Co. Ltd. Surface-mount type light emitting diode and method for manufacturing it
USD521948S1 (en) * 2004-10-19 2006-05-30 Rohm Co., Ltd. Light emitting diode
US20100155752A1 (en) * 2008-12-24 2010-06-24 Lim Woo Sik Semiconductor light emitting device
US20130049565A1 (en) * 2011-08-26 2013-02-28 Su Jung JUNG Light emitting device package
US20130141920A1 (en) * 2011-12-06 2013-06-06 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
US20150171274A1 (en) * 2013-12-17 2015-06-18 Industrial Technology Research Institute Led structure
US20150340581A1 (en) * 2012-11-30 2015-11-26 Seoul Semiconductor Co., Ltd. Light emitting diode and method of manufacturing the same
US20160079478A1 (en) * 2014-09-15 2016-03-17 Samsung Electronics Co., Ltd. Semiconductor light emitting device package
USD778849S1 (en) * 2015-11-05 2017-02-14 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
US20170069606A1 (en) * 2014-12-18 2017-03-09 Cree, Inc. Light emitting diodes, components and related methods
US20170179352A1 (en) * 2015-12-16 2017-06-22 Samsung Electronics Co., Ltd. Circuit board for mounting of semiconductor light emitting device and semiconductor light emitting device package using the same
US20180151790A1 (en) * 2016-11-25 2018-05-31 Lg Innotek Co., Ltd. Semiconductor device package
USD857638S1 (en) 2017-08-23 2019-08-27 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
US20200013759A1 (en) * 2017-08-28 2020-01-09 Lumens Co., Ltd. Light emitting element for pixel and led display module
US20200350468A1 (en) * 2017-12-22 2020-11-05 Lg Innotek Co., Ltd. Semiconductor device package

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050173721A1 (en) * 2004-02-05 2005-08-11 Citizen Electronics Co. Ltd. Surface-mount type light emitting diode and method for manufacturing it
USD521948S1 (en) * 2004-10-19 2006-05-30 Rohm Co., Ltd. Light emitting diode
US20100155752A1 (en) * 2008-12-24 2010-06-24 Lim Woo Sik Semiconductor light emitting device
US20130049565A1 (en) * 2011-08-26 2013-02-28 Su Jung JUNG Light emitting device package
US20130141920A1 (en) * 2011-12-06 2013-06-06 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
US20150340581A1 (en) * 2012-11-30 2015-11-26 Seoul Semiconductor Co., Ltd. Light emitting diode and method of manufacturing the same
US20150171274A1 (en) * 2013-12-17 2015-06-18 Industrial Technology Research Institute Led structure
US20160079478A1 (en) * 2014-09-15 2016-03-17 Samsung Electronics Co., Ltd. Semiconductor light emitting device package
US20170069606A1 (en) * 2014-12-18 2017-03-09 Cree, Inc. Light emitting diodes, components and related methods
USD778849S1 (en) * 2015-11-05 2017-02-14 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
US20170179352A1 (en) * 2015-12-16 2017-06-22 Samsung Electronics Co., Ltd. Circuit board for mounting of semiconductor light emitting device and semiconductor light emitting device package using the same
US20180151790A1 (en) * 2016-11-25 2018-05-31 Lg Innotek Co., Ltd. Semiconductor device package
USD857638S1 (en) 2017-08-23 2019-08-27 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
US20200013759A1 (en) * 2017-08-28 2020-01-09 Lumens Co., Ltd. Light emitting element for pixel and led display module
US20200350468A1 (en) * 2017-12-22 2020-11-05 Lg Innotek Co., Ltd. Semiconductor device package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD996377S1 (en) 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) * 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods
USD1057674S1 (en) * 2023-02-08 2025-01-14 Autosystems, A Division Of Magna Exteriors Inc. Light emitting chip scale package

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