USD880484S1 - Data processing equipment - Google Patents

Data processing equipment Download PDF

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Publication number
USD880484S1
USD880484S1 US29/655,423 US201829655423F USD880484S US D880484 S1 USD880484 S1 US D880484S1 US 201829655423 F US201829655423 F US 201829655423F US D880484 S USD880484 S US D880484S
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US
United States
Prior art keywords
data processing
processing equipment
view
ornamental design
equipment
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/655,423
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English (en)
Inventor
Zhengyang Li
Heng Zhang
Kouliu Lu
Jiamin Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Chipjet Technology Co Ltd
Original Assignee
Hangzhou Chipjet Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hangzhou Chipjet Technology Co Ltd filed Critical Hangzhou Chipjet Technology Co Ltd
Assigned to HANGZHOU CHIPJET TECHNOLOGY CO., LTD. reassignment HANGZHOU CHIPJET TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, Zhenyang, LU, KOUILIU, WANG, JIAMIN, ZHANG, HENG
Assigned to HANGZHOU CHIPJET TECHNOLOGY CO., LTD. reassignment HANGZHOU CHIPJET TECHNOLOGY CO., LTD. CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD ASSIGNOR NAME PREVIOUSLY RECORDED ON REEL 046487 FRAME 0852. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: LI, Zhenyang, LU, Kouliu, WANG, JIAMIN, ZHANG, HENG
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US29/655,423 2018-04-26 2018-07-03 Data processing equipment Active USD880484S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201830178033 2018-04-26
CN201830178033 2018-04-26

Publications (1)

Publication Number Publication Date
USD880484S1 true USD880484S1 (en) 2020-04-07

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ID=65997338

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/655,423 Active USD880484S1 (en) 2018-04-26 2018-07-03 Data processing equipment

Country Status (2)

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US (1) USD880484S1 (fr)
JP (1) JP1628923S (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD909319S1 (en) 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board
USD915310S1 (en) * 2019-02-12 2021-04-06 Analog Devices, Inc. Circuit board
USD933823S1 (en) * 2019-11-05 2021-10-19 Oyak Global Investments S.A. Tubing support plate
USD937230S1 (en) * 2019-12-20 2021-11-30 Fleece Performance Engineering, Inc. Circuit board
USD945008S1 (en) * 2019-11-05 2022-03-01 Oyak Global Investments S.A. Tubing support plate and microfluidic disc
USD951474S1 (en) * 2019-11-05 2022-05-10 Oyak Global Investments S.A. Tubing support plate
USD952178S1 (en) * 2019-11-05 2022-05-17 Oyak Global Investments S.A. Tubing support plate
USD965210S1 (en) * 2020-03-13 2022-09-27 Unilumin Group Co., Ltd LED display module
USD968344S1 (en) * 2019-11-22 2022-11-01 T-Worx Holdings, LLC Circuit board
USD995456S1 (en) 2021-06-18 2023-08-15 Fleece Performance Engineering, Inc. Circuit board
USD995457S1 (en) 2021-06-18 2023-08-15 Fleece Performance Engineering, Inc. Circuit board
USD1001753S1 (en) * 2019-09-09 2023-10-17 The Noco Company Circuit board
USD1003889S1 (en) * 2019-12-24 2023-11-07 Hangzhou Chipjet Technology Co., Ltd. Data processing chip

Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945725A (en) * 1996-12-04 1999-08-31 Ball Semiconductor, Inc. Spherical shaped integrated circuit utilizing an inductor
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
USD522978S1 (en) * 2004-06-25 2006-06-13 Matsushita Electric Industrial Co., Ltd. Information storage semiconductor element
USD524260S1 (en) * 2004-08-20 2006-07-04 Citizen Electronics Co., Ltd. Light emitting diode
USD525214S1 (en) * 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD528672S1 (en) * 2005-01-28 2006-09-19 Matsushita Electric Industrial Co., Ltd. LED module
USD535262S1 (en) * 2005-06-08 2007-01-16 Matsushita Electric Industrial Co., Ltd. Light emitting diode module
US20070205419A1 (en) * 2006-03-02 2007-09-06 Masato Ono Semiconductor device and its manufacturing method
USD552048S1 (en) * 2005-10-26 2007-10-02 Hon Hai Precision Industry Co., Ltd. Printed circuit board
US20080001160A1 (en) * 2006-06-29 2008-01-03 Cree, Inc. LED package with flexible polyimid circuit and method of manufacturing LED package
US20080054286A1 (en) * 2005-01-27 2008-03-06 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
USD576970S1 (en) * 2007-02-09 2008-09-16 Matsushita Electric Industrial Co., Ltd. Light source of light-emitting diode
USD591248S1 (en) * 2007-12-05 2009-04-28 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD592615S1 (en) * 2007-12-05 2009-05-19 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD605613S1 (en) * 2008-05-15 2009-12-08 Adc Gmbh Printed circuit board for electrical connector
USD607420S1 (en) * 2007-12-05 2010-01-05 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD624887S1 (en) * 2009-10-09 2010-10-05 Toshiba Lighting & Technology Corporation Light emitting diode module
USD625694S1 (en) * 2009-07-14 2010-10-19 Toshiba Lighting & Technology Corporation Light emitting diode module
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD634718S1 (en) * 2010-06-30 2011-03-22 Edison Opto Corporation LED package
USD645417S1 (en) * 2010-04-01 2011-09-20 Citizen Electronics Co., Ltd. Light-emitting diode
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD662479S1 (en) * 2011-02-09 2012-06-26 Toshiba Lighting & Technology Corporation Light emitting diode module
USD662902S1 (en) * 2007-12-14 2012-07-03 Cree Hong Kong Limited LED package
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD739565S1 (en) * 2013-06-27 2015-09-22 Cree, Inc. Light emitter unit
USD740453S1 (en) * 2013-06-27 2015-10-06 Cree, Inc. Light emitter unit
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD743400S1 (en) * 2010-06-11 2015-11-17 Ricoh Company, Ltd. Information storage device
US9203004B2 (en) * 2010-11-22 2015-12-01 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
US9300062B2 (en) * 2010-11-22 2016-03-29 Cree, Inc. Attachment devices and methods for light emitting devices
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD823492S1 (en) * 2016-10-04 2018-07-17 Cree, Inc. Light emitting device

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945725A (en) * 1996-12-04 1999-08-31 Ball Semiconductor, Inc. Spherical shaped integrated circuit utilizing an inductor
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
USD522978S1 (en) * 2004-06-25 2006-06-13 Matsushita Electric Industrial Co., Ltd. Information storage semiconductor element
USD525214S1 (en) * 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD524260S1 (en) * 2004-08-20 2006-07-04 Citizen Electronics Co., Ltd. Light emitting diode
US20080054286A1 (en) * 2005-01-27 2008-03-06 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
USD528672S1 (en) * 2005-01-28 2006-09-19 Matsushita Electric Industrial Co., Ltd. LED module
USD535262S1 (en) * 2005-06-08 2007-01-16 Matsushita Electric Industrial Co., Ltd. Light emitting diode module
USD552048S1 (en) * 2005-10-26 2007-10-02 Hon Hai Precision Industry Co., Ltd. Printed circuit board
US20070205419A1 (en) * 2006-03-02 2007-09-06 Masato Ono Semiconductor device and its manufacturing method
US20080001160A1 (en) * 2006-06-29 2008-01-03 Cree, Inc. LED package with flexible polyimid circuit and method of manufacturing LED package
USD576970S1 (en) * 2007-02-09 2008-09-16 Matsushita Electric Industrial Co., Ltd. Light source of light-emitting diode
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD618635S1 (en) * 2007-12-05 2010-06-29 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD607420S1 (en) * 2007-12-05 2010-01-05 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD591248S1 (en) * 2007-12-05 2009-04-28 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD592615S1 (en) * 2007-12-05 2009-05-19 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD662902S1 (en) * 2007-12-14 2012-07-03 Cree Hong Kong Limited LED package
USD605613S1 (en) * 2008-05-15 2009-12-08 Adc Gmbh Printed circuit board for electrical connector
USD625694S1 (en) * 2009-07-14 2010-10-19 Toshiba Lighting & Technology Corporation Light emitting diode module
USD624887S1 (en) * 2009-10-09 2010-10-05 Toshiba Lighting & Technology Corporation Light emitting diode module
USD645417S1 (en) * 2010-04-01 2011-09-20 Citizen Electronics Co., Ltd. Light-emitting diode
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD743400S1 (en) * 2010-06-11 2015-11-17 Ricoh Company, Ltd. Information storage device
USD634718S1 (en) * 2010-06-30 2011-03-22 Edison Opto Corporation LED package
US9300062B2 (en) * 2010-11-22 2016-03-29 Cree, Inc. Attachment devices and methods for light emitting devices
US9203004B2 (en) * 2010-11-22 2015-12-01 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD662479S1 (en) * 2011-02-09 2012-06-26 Toshiba Lighting & Technology Corporation Light emitting diode module
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD740453S1 (en) * 2013-06-27 2015-10-06 Cree, Inc. Light emitter unit
USD739565S1 (en) * 2013-06-27 2015-09-22 Cree, Inc. Light emitter unit
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD823492S1 (en) * 2016-10-04 2018-07-17 Cree, Inc. Light emitting device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD915310S1 (en) * 2019-02-12 2021-04-06 Analog Devices, Inc. Circuit board
USD1001753S1 (en) * 2019-09-09 2023-10-17 The Noco Company Circuit board
USD933823S1 (en) * 2019-11-05 2021-10-19 Oyak Global Investments S.A. Tubing support plate
USD945008S1 (en) * 2019-11-05 2022-03-01 Oyak Global Investments S.A. Tubing support plate and microfluidic disc
USD951474S1 (en) * 2019-11-05 2022-05-10 Oyak Global Investments S.A. Tubing support plate
USD952178S1 (en) * 2019-11-05 2022-05-17 Oyak Global Investments S.A. Tubing support plate
USD968344S1 (en) * 2019-11-22 2022-11-01 T-Worx Holdings, LLC Circuit board
USD937230S1 (en) * 2019-12-20 2021-11-30 Fleece Performance Engineering, Inc. Circuit board
USD1003889S1 (en) * 2019-12-24 2023-11-07 Hangzhou Chipjet Technology Co., Ltd. Data processing chip
USD965210S1 (en) * 2020-03-13 2022-09-27 Unilumin Group Co., Ltd LED display module
USD909319S1 (en) 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board
USD995456S1 (en) 2021-06-18 2023-08-15 Fleece Performance Engineering, Inc. Circuit board
USD995457S1 (en) 2021-06-18 2023-08-15 Fleece Performance Engineering, Inc. Circuit board

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Publication number Publication date
JP1628923S (fr) 2019-04-08

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