USD873225S1 - Heatsink - Google Patents
Heatsink Download PDFInfo
- Publication number
- USD873225S1 USD873225S1 US29/650,237 US201829650237F USD873225S US D873225 S1 USD873225 S1 US D873225S1 US 201829650237 F US201829650237 F US 201829650237F US D873225 S USD873225 S US D873225S
- Authority
- US
- United States
- Prior art keywords
- heatsink
- view
- ornamental design
- side perspective
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EM45378430001 | 2017-12-06 | ||
EM004537843 | 2017-12-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD873225S1 true USD873225S1 (en) | 2020-01-21 |
Family
ID=64899804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/650,237 Active USD873225S1 (en) | 2017-12-06 | 2018-06-05 | Heatsink |
Country Status (2)
Country | Link |
---|---|
US (1) | USD873225S1 (enrdf_load_stackoverflow) |
JP (1) | JP1621290S (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1056919S1 (en) * | 2021-03-23 | 2025-01-07 | Chenbro Micom Co., Ltd. | Case panel |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD375725S (en) * | 1996-02-28 | 1996-11-19 | Dodson Douglas A | Cooling device |
USD398589S (en) * | 1997-05-27 | 1998-09-22 | Dodson Douglas A | Cooling device |
USD403666S (en) * | 1998-04-01 | 1999-01-05 | Rockford Corporation | Heat sink |
USD407714S (en) * | 1998-01-21 | 1999-04-06 | Ming Hsin Yeh | Cooling device for the CPU of computer |
USD428892S (en) * | 1999-03-25 | 2000-08-01 | Avcom Technologies, Inc. | Equipment face |
USD449587S1 (en) * | 2001-02-28 | 2001-10-23 | Andrew Corporation | Heat sink |
USD483019S1 (en) * | 2002-12-10 | 2003-12-02 | Vanner, Inc. | Heat sink for electronic equipment |
USD490785S1 (en) * | 2002-04-11 | 2004-06-01 | Innoveta Technologies | Converter |
USD496939S1 (en) * | 2003-05-05 | 2004-10-05 | Motorola, Inc. | Sealed central processing unit cooling apparatus |
USD508047S1 (en) * | 2004-01-06 | 2005-08-02 | Pfu Limited | Computing device |
USD606017S1 (en) * | 2006-08-21 | 2009-12-15 | Siemens Aktiengesellschaft | Convection cooled frequency converter |
US8605434B2 (en) * | 2012-05-01 | 2013-12-10 | Adlink Technology Inc. | Wall-mounting structure for wall-mounted electronic device |
USD727920S1 (en) * | 2013-04-02 | 2015-04-28 | Nec Corporation | Front panel for a computer |
DE202016101176U1 (de) | 2016-03-04 | 2016-06-03 | Omron Corporation | Gehäuse für einen Monitor eines Industriecomputers, Monitor für einen Industriecomputer und Industriecomputer |
USD794628S1 (en) * | 2015-10-23 | 2017-08-15 | Omron Corporation | Computer |
USD807872S1 (en) * | 2016-04-15 | 2018-01-16 | Fanuc Corporation | Computer |
USD808381S1 (en) * | 2016-07-26 | 2018-01-23 | Omron Corporation | Computer |
-
2018
- 2018-05-31 JP JPD2018-12018F patent/JP1621290S/ja active Active
- 2018-06-05 US US29/650,237 patent/USD873225S1/en active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD375725S (en) * | 1996-02-28 | 1996-11-19 | Dodson Douglas A | Cooling device |
USD398589S (en) * | 1997-05-27 | 1998-09-22 | Dodson Douglas A | Cooling device |
USD407714S (en) * | 1998-01-21 | 1999-04-06 | Ming Hsin Yeh | Cooling device for the CPU of computer |
USD403666S (en) * | 1998-04-01 | 1999-01-05 | Rockford Corporation | Heat sink |
USD428892S (en) * | 1999-03-25 | 2000-08-01 | Avcom Technologies, Inc. | Equipment face |
USD449587S1 (en) * | 2001-02-28 | 2001-10-23 | Andrew Corporation | Heat sink |
USD490785S1 (en) * | 2002-04-11 | 2004-06-01 | Innoveta Technologies | Converter |
USD483019S1 (en) * | 2002-12-10 | 2003-12-02 | Vanner, Inc. | Heat sink for electronic equipment |
USD496939S1 (en) * | 2003-05-05 | 2004-10-05 | Motorola, Inc. | Sealed central processing unit cooling apparatus |
USD508047S1 (en) * | 2004-01-06 | 2005-08-02 | Pfu Limited | Computing device |
USD606017S1 (en) * | 2006-08-21 | 2009-12-15 | Siemens Aktiengesellschaft | Convection cooled frequency converter |
US8605434B2 (en) * | 2012-05-01 | 2013-12-10 | Adlink Technology Inc. | Wall-mounting structure for wall-mounted electronic device |
USD727920S1 (en) * | 2013-04-02 | 2015-04-28 | Nec Corporation | Front panel for a computer |
USD794628S1 (en) * | 2015-10-23 | 2017-08-15 | Omron Corporation | Computer |
DE202016101176U1 (de) | 2016-03-04 | 2016-06-03 | Omron Corporation | Gehäuse für einen Monitor eines Industriecomputers, Monitor für einen Industriecomputer und Industriecomputer |
US9927848B2 (en) * | 2016-03-04 | 2018-03-27 | Omron Corporation | Housing used in monitor of industrial computer, monitor used in industrial computer, and industrial computer |
USD807872S1 (en) * | 2016-04-15 | 2018-01-16 | Fanuc Corporation | Computer |
USD808381S1 (en) * | 2016-07-26 | 2018-01-23 | Omron Corporation | Computer |
Non-Patent Citations (1)
Title |
---|
OMRON, "Industrial PC Platform> NYB", Accessed Oct. 9, 2019. (http://www.omron-ap.co.nz/products/family/3631/dimension.html) (Year: 2019). * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1056919S1 (en) * | 2021-03-23 | 2025-01-07 | Chenbro Micom Co., Ltd. | Case panel |
Also Published As
Publication number | Publication date |
---|---|
JP1621290S (enrdf_load_stackoverflow) | 2019-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |