USD871374S1 - Headphone - Google Patents

Headphone Download PDF

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Publication number
USD871374S1
USD871374S1 US29/631,217 US201729631217F USD871374S US D871374 S1 USD871374 S1 US D871374S1 US 201729631217 F US201729631217 F US 201729631217F US D871374 S USD871374 S US D871374S
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US
United States
Prior art keywords
headphone
view
elevational view
side elevational
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/631,217
Inventor
Effrosini A. Karayiannis
Ryan Ott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harman International Industries Inc
Original Assignee
Harman International Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harman International Industries Inc filed Critical Harman International Industries Inc
Priority to US29/631,217 priority Critical patent/USD871374S1/en
Assigned to HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED reassignment HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KARAYIANNIS, EFFROSINI A., OTT, RYAN
Priority to US29/674,293 priority patent/USD870711S1/en
Application granted granted Critical
Publication of USD871374S1 publication Critical patent/USD871374S1/en
Active legal-status Critical Current
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Description

FIG. 1 is a perspective view of a headphone showing the new design in a first embodiment;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof;
FIG. 5 is an opposite side elevational view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a perspective view of a headphone showing the new design in a second embodiment;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a side elevational view thereof;
FIG. 12 is an opposite side elevational view thereof;
FIG. 13 is a top view thereof; and,
FIG. 14 is a bottom view thereof.
The broken lines shown in the drawings depict portions of the headphone that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a headphone, as shown and described.
US29/631,217 2017-12-28 2017-12-28 Headphone Active USD871374S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/631,217 USD871374S1 (en) 2017-12-28 2017-12-28 Headphone
US29/674,293 USD870711S1 (en) 2017-12-28 2018-12-20 Headphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/631,217 USD871374S1 (en) 2017-12-28 2017-12-28 Headphone

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/674,293 Continuation-In-Part USD870711S1 (en) 2017-12-28 2018-12-20 Headphone

Publications (1)

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USD871374S1 true USD871374S1 (en) 2019-12-31

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ID=69057184

Family Applications (1)

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US29/631,217 Active USD871374S1 (en) 2017-12-28 2017-12-28 Headphone

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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD883262S1 (en) * 2019-12-06 2020-05-05 Shenzhen Xinzhengyu Technology Co., Ltd Earphones
USD883959S1 (en) * 2020-01-03 2020-05-12 elago CO. LTD Earphone protective cover
USD892089S1 (en) 2017-12-28 2020-08-04 Harman International Industries, Incorporated Headphone
USD892085S1 (en) * 2018-12-28 2020-08-04 Harman International Industries, Incorporated Headphone
USD895581S1 (en) * 2020-05-27 2020-09-08 Shenzhen Xinzhengyu Technology Co., Ltd. Earphone component
USD909998S1 (en) * 2020-04-09 2021-02-09 Dongguan Pinmi Electronic Technology Co., Ltd Earphones
USD922985S1 (en) * 2019-11-25 2021-06-22 Panasonic Intellectual Property Management Co., Ltd. Earphone
USD925493S1 (en) * 2019-11-25 2021-07-20 Decibullz Llc Intra-auricular earbud support
USD930620S1 (en) 2020-01-01 2021-09-14 Harman International Industries, Incorporated Headphone
USD930619S1 (en) 2019-12-31 2021-09-14 Harman International Industries, Incorporated Headphone
USD930618S1 (en) 2019-12-31 2021-09-14 Harman International Industries, Incorporated Headphone
USD932467S1 (en) * 2021-01-11 2021-10-05 Shenzhen Humboldt Technology Co., Ltd Earphone support
USD940107S1 (en) 2019-12-19 2022-01-04 Harman International Industries, Incorporated Headphone
USD948481S1 (en) 2020-01-03 2022-04-12 Harman International Industries, Incorporated Headphone
US11303986B2 (en) 2012-02-08 2022-04-12 Decibullz Llc Moldable earpiece system
USD949831S1 (en) 2017-12-28 2022-04-26 Harman International Industries, Incorporated Headphone
US11381902B2 (en) 2017-01-20 2022-07-05 Decibullz Llc Earpiece intra-auricular support system
USD957365S1 (en) 2020-01-03 2022-07-12 Harman International Industries, Incorporated Headphone
USD967396S1 (en) * 2022-01-25 2022-10-18 Olins (Shenzhen) Technology Co., Ltd. Pair of noise reduction earplugs
US11490189B2 (en) 2017-08-23 2022-11-01 Decibullz Llc Reconfigurable intra-auricular support
USD971886S1 (en) 2020-09-10 2022-12-06 Harman International Industries, Incorporated Headphone
USD976870S1 (en) 2020-10-13 2023-01-31 Harman International Industries, Incorporated Headphone
USD1013663S1 (en) 2021-08-19 2024-02-06 Harman International Industries, Incorporated Headphone

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