USD844577S1 - Conductor pad - Google Patents

Conductor pad Download PDF

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Publication number
USD844577S1
USD844577S1 US29/584,216 US201629584216F USD844577S US D844577 S1 USD844577 S1 US D844577S1 US 201629584216 F US201629584216 F US 201629584216F US D844577 S USD844577 S US D844577S
Authority
US
United States
Prior art keywords
conductor pad
conductor
pad
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/584,216
Inventor
Sridharan Venk
Earl Alfred Picard, JR.
Qi Dai
Richard Garner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABL IP Holding LLC
Original Assignee
Osram Sylvania Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Sylvania Inc filed Critical Osram Sylvania Inc
Priority to US29/584,216 priority Critical patent/USD844577S1/en
Priority to US29/680,129 priority patent/USD877103S1/en
Assigned to OSRAM SYLVANIA INC. reassignment OSRAM SYLVANIA INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DAI, QI, GARNER, RICHARD, PICARD, EARL ALFRED, JR, VENK, SRIDHARAN
Application granted granted Critical
Publication of USD844577S1 publication Critical patent/USD844577S1/en
Assigned to ACUITY BRANDS LIGHTING, INC. reassignment ACUITY BRANDS LIGHTING, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OSRAM SYLVANIA INC.
Assigned to ABL IP HOLDING LLC reassignment ABL IP HOLDING LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ACUITY BRANDS LIGHTING, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top plan view of a first embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof; and,
FIG. 2 is a top plan view of a second embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.
All surfaces not shown form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a conductor pad, as shown and described.
US29/584,216 2014-03-28 2016-11-12 Conductor pad Active USD844577S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/584,216 USD844577S1 (en) 2014-03-28 2016-11-12 Conductor pad
US29/680,129 USD877103S1 (en) 2014-03-28 2019-02-13 Conductor pad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/486,410 USD774477S1 (en) 2014-03-28 2014-03-28 Conductor pads
US29/584,216 USD844577S1 (en) 2014-03-28 2016-11-12 Conductor pad

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/486,410 Division USD774477S1 (en) 2014-03-28 2014-03-28 Conductor pads

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/680,129 Division USD877103S1 (en) 2014-03-28 2019-02-13 Conductor pad

Publications (1)

Publication Number Publication Date
USD844577S1 true USD844577S1 (en) 2019-04-02

Family

ID=54205361

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/486,410 Active USD774477S1 (en) 2014-03-28 2014-03-28 Conductor pads
US29/584,216 Active USD844577S1 (en) 2014-03-28 2016-11-12 Conductor pad
US29/680,129 Active USD877103S1 (en) 2014-03-28 2019-02-13 Conductor pad

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/486,410 Active USD774477S1 (en) 2014-03-28 2014-03-28 Conductor pads

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/680,129 Active USD877103S1 (en) 2014-03-28 2019-02-13 Conductor pad

Country Status (3)

Country Link
US (3) USD774477S1 (en)
JP (8) JP1539562S (en)
CA (5) CA157972S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD774477S1 (en) * 2014-03-28 2016-12-20 Osram Sylvania Inc. Conductor pads

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD327883S (en) * 1990-02-09 1992-07-14 Gemplus Card International Connecting terminal for chip cards
USD328599S (en) * 1990-04-10 1992-08-11 Gemplus Card International Connecting terminal for chip cards
US6803582B2 (en) * 2002-11-29 2004-10-12 Oregon Health & Science University One dimensional beam blanker array
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD613690S1 (en) * 2008-12-09 2010-04-13 Fujifilm Corporation Conductive sheet
USD615927S1 (en) * 2008-05-09 2010-05-18 Fujifilm Corporation Conductive sheet
US8791560B2 (en) * 2006-01-10 2014-07-29 International Rectifier Corporation Interdigitated conductive support for GaN semiconductor die
US9082626B2 (en) * 2013-07-26 2015-07-14 Infineon Technologies Ag Conductive pads and methods of formation thereof
USD774477S1 (en) * 2014-03-28 2016-12-20 Osram Sylvania Inc. Conductor pads

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD327883S (en) * 1990-02-09 1992-07-14 Gemplus Card International Connecting terminal for chip cards
USD328599S (en) * 1990-04-10 1992-08-11 Gemplus Card International Connecting terminal for chip cards
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6803582B2 (en) * 2002-11-29 2004-10-12 Oregon Health & Science University One dimensional beam blanker array
US8791560B2 (en) * 2006-01-10 2014-07-29 International Rectifier Corporation Interdigitated conductive support for GaN semiconductor die
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD615927S1 (en) * 2008-05-09 2010-05-18 Fujifilm Corporation Conductive sheet
USD613690S1 (en) * 2008-12-09 2010-04-13 Fujifilm Corporation Conductive sheet
US9082626B2 (en) * 2013-07-26 2015-07-14 Infineon Technologies Ag Conductive pads and methods of formation thereof
USD774477S1 (en) * 2014-03-28 2016-12-20 Osram Sylvania Inc. Conductor pads

Also Published As

Publication number Publication date
JP1531438S (en) 2015-08-17
CA157972S (en) 2016-04-11
JP1539562S (en) 2015-12-07
JP1539561S (en) 2015-12-07
JP1532079S (en) 2015-08-24
CA164027S (en) 2016-04-11
JP1532082S (en) 2015-08-24
JP1539563S (en) 2015-12-07
JP1539560S (en) 2015-12-07
USD774477S1 (en) 2016-12-20
CA164028S (en) 2016-04-11
CA162211S (en) 2016-04-11
USD877103S1 (en) 2020-03-03
JP1539559S (en) 2015-12-07
CA166477S (en) 2016-04-11

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