USD837752S1 - Heatsink - Google Patents

Heatsink Download PDF

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Publication number
USD837752S1
USD837752S1 US29/592,512 US201729592512F USD837752S US D837752 S1 USD837752 S1 US D837752S1 US 201729592512 F US201729592512 F US 201729592512F US D837752 S USD837752 S US D837752S
Authority
US
United States
Prior art keywords
heatsink
view
design
broken lines
short
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/592,512
Inventor
Dylan James Sievers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US29/592,512 priority Critical patent/USD837752S1/en
Application granted granted Critical
Publication of USD837752S1 publication Critical patent/USD837752S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of the heatsink showing my new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a bottom view thereof; and,
FIG. 6 is a right side view thereof; the left side being a mirror image thereof.
The consistently broken lines shown in the drawings illustrate portions of the heatsink that form no part of the claimed design.
The heatsink is shown with a symbolic break in its length illustrated in long-short-short dashed lines. The appearance of any portion of the article between the broken lines forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heatsink, as shown and described.
US29/592,512 2017-01-31 2017-01-31 Heatsink Active USD837752S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/592,512 USD837752S1 (en) 2017-01-31 2017-01-31 Heatsink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/592,512 USD837752S1 (en) 2017-01-31 2017-01-31 Heatsink

Publications (1)

Publication Number Publication Date
USD837752S1 true USD837752S1 (en) 2019-01-08

Family

ID=64872640

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/592,512 Active USD837752S1 (en) 2017-01-31 2017-01-31 Heatsink

Country Status (1)

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US (1) USD837752S1 (en)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20080266810A1 (en) * 2007-04-30 2008-10-30 Watlow Electric Manufacturing Company Heat management system for a power switching device
US20100134046A1 (en) * 2008-12-03 2010-06-03 Illumination Management Solutions, Inc. Led replacement lamp and a method of replacing preexisting luminaires with led lighting assemblies
USD639467S1 (en) 2010-07-28 2011-06-07 Ecofit Lighting Llc LED light engine with optics
US8310158B2 (en) 2009-09-23 2012-11-13 Ecofit Lighting, LLC LED light engine apparatus
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
US20160165115A1 (en) * 2013-09-27 2016-06-09 Hitachi Kokusai Electric Inc. Image pickup element unit and image pickup apparatus
US20160309618A1 (en) * 2015-04-17 2016-10-20 Cooler Master Co., Ltd. Liquid cooling heat dissipation structure and method of manufacturing the same
USD786811S1 (en) * 2015-09-15 2017-05-16 Shenzhen coleder opto-electronics co, ltd LED electronic display
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20080266810A1 (en) * 2007-04-30 2008-10-30 Watlow Electric Manufacturing Company Heat management system for a power switching device
US20100134046A1 (en) * 2008-12-03 2010-06-03 Illumination Management Solutions, Inc. Led replacement lamp and a method of replacing preexisting luminaires with led lighting assemblies
US8310158B2 (en) 2009-09-23 2012-11-13 Ecofit Lighting, LLC LED light engine apparatus
USD639467S1 (en) 2010-07-28 2011-06-07 Ecofit Lighting Llc LED light engine with optics
US20160165115A1 (en) * 2013-09-27 2016-06-09 Hitachi Kokusai Electric Inc. Image pickup element unit and image pickup apparatus
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
US20160309618A1 (en) * 2015-04-17 2016-10-20 Cooler Master Co., Ltd. Liquid cooling heat dissipation structure and method of manufacturing the same
USD786811S1 (en) * 2015-09-15 2017-05-16 Shenzhen coleder opto-electronics co, ltd LED electronic display
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module

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