USD837170S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD837170S1
USD837170S1 US29/613,020 US201729613020F USD837170S US D837170 S1 USD837170 S1 US D837170S1 US 201729613020 F US201729613020 F US 201729613020F US D837170 S USD837170 S US D837170S
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United States
Prior art keywords
heat sink
view
ornamental design
taken
section
Prior art date
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Active
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US29/613,020
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English (en)
Inventor
Naoki Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saijoinx Co Ltd
Original Assignee
Saijoinx Co Ltd
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Publication date
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Assigned to SAIJOINX Co., Ltd. reassignment SAIJOINX Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: UEDA, NAOKI
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US29/613,020 2017-02-15 2017-08-07 Heat sink Active USD837170S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-002911 2017-02-15
JPD2017-2911F JP1588722S (enExample) 2017-02-15 2017-02-15

Publications (1)

Publication Number Publication Date
USD837170S1 true USD837170S1 (en) 2019-01-01

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ID=60118054

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Application Number Title Priority Date Filing Date
US29/613,020 Active USD837170S1 (en) 2017-02-15 2017-08-07 Heat sink

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US (1) USD837170S1 (enExample)
JP (1) JP1588722S (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942959S1 (en) * 2020-01-29 2022-02-08 Veea Inc. Heat sink
USD1019580S1 (en) * 2022-09-08 2024-03-26 Traxxas, L.P. Heat sink for model vehicle motor
USD1033417S1 (en) * 2021-10-15 2024-07-02 Siemens Aktiengesellschaft Computer
USD1038110S1 (en) 2021-10-15 2024-08-06 Siemens Aktiengesellschaft Computer
USD1046842S1 (en) * 2021-09-28 2024-10-15 Siemens Aktiengesellschaft Computer
USD1055906S1 (en) * 2021-10-15 2024-12-31 Siemens Aktiengesellschaft Computer

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD315832S (en) * 1988-10-24 1991-04-02 Rockford Corporation Heat sink
USD338449S (en) * 1991-07-25 1993-08-17 Sahyoun Youssef Y Exterior surface of a heat sink
US20030188848A1 (en) * 2002-04-08 2003-10-09 Yu-Chen Kuo Complex heat-radiator
USD571037S1 (en) * 2005-09-30 2008-06-10 Fangshou Lou Double-edged HID electronic ballast
USD619550S1 (en) * 2009-07-21 2010-07-13 Foxsemicon Integrated Technology, Inc. Heat dissipation device
US20110024160A1 (en) * 2009-07-31 2011-02-03 Clifton Quan Multi-layer microwave corrugated printed circuit board and method
USD645829S1 (en) * 2010-12-27 2011-09-27 Hon Hai Precision Industry Co., Ltd. Heat sink
USD669046S1 (en) * 2010-05-19 2012-10-16 Nippon Mektron, Ltd Flexible printed circuit board
USD672730S1 (en) * 2012-03-13 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD687397S1 (en) * 2010-05-19 2013-08-06 Nippon Mektron, Ltd. Flexible printed circuit board
USD790760S1 (en) * 2015-10-06 2017-06-27 Sylwester Klus Housing for LED-based lighting apparatus
USD810034S1 (en) * 2016-02-22 2018-02-13 Heatscape.Com, Inc. Flexible folded fin heatsink with straight and radial fin patterns

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD315832S (en) * 1988-10-24 1991-04-02 Rockford Corporation Heat sink
USD338449S (en) * 1991-07-25 1993-08-17 Sahyoun Youssef Y Exterior surface of a heat sink
US20030188848A1 (en) * 2002-04-08 2003-10-09 Yu-Chen Kuo Complex heat-radiator
USD571037S1 (en) * 2005-09-30 2008-06-10 Fangshou Lou Double-edged HID electronic ballast
USD619550S1 (en) * 2009-07-21 2010-07-13 Foxsemicon Integrated Technology, Inc. Heat dissipation device
US20110024160A1 (en) * 2009-07-31 2011-02-03 Clifton Quan Multi-layer microwave corrugated printed circuit board and method
USD669046S1 (en) * 2010-05-19 2012-10-16 Nippon Mektron, Ltd Flexible printed circuit board
USD687397S1 (en) * 2010-05-19 2013-08-06 Nippon Mektron, Ltd. Flexible printed circuit board
USD645829S1 (en) * 2010-12-27 2011-09-27 Hon Hai Precision Industry Co., Ltd. Heat sink
USD672730S1 (en) * 2012-03-13 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD790760S1 (en) * 2015-10-06 2017-06-27 Sylwester Klus Housing for LED-based lighting apparatus
USD810034S1 (en) * 2016-02-22 2018-02-13 Heatscape.Com, Inc. Flexible folded fin heatsink with straight and radial fin patterns

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ECVV, "Precision machining aluminum extrusion heat sink, front panel", Accessed Jun. 5, 2018. (https://www.ecvv.com/product/3075709.html). *
Original Twist Blog, "Silent gaming PC", Posted May 7, 2018. (https://originaltwist.com/2018/05/07/silent-gaming-pc/). *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942959S1 (en) * 2020-01-29 2022-02-08 Veea Inc. Heat sink
USD1046842S1 (en) * 2021-09-28 2024-10-15 Siemens Aktiengesellschaft Computer
USD1033417S1 (en) * 2021-10-15 2024-07-02 Siemens Aktiengesellschaft Computer
USD1038110S1 (en) 2021-10-15 2024-08-06 Siemens Aktiengesellschaft Computer
USD1055906S1 (en) * 2021-10-15 2024-12-31 Siemens Aktiengesellschaft Computer
USD1061508S1 (en) * 2021-10-15 2025-02-11 Siemens Aktiengesellschaft Computer
USD1019580S1 (en) * 2022-09-08 2024-03-26 Traxxas, L.P. Heat sink for model vehicle motor

Also Published As

Publication number Publication date
JP1588722S (enExample) 2017-10-23

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