USD823814S1 - Contact wafer - Google Patents

Contact wafer Download PDF

Info

Publication number
USD823814S1
USD823814S1 US29/611,655 US201729611655F USD823814S US D823814 S1 USD823814 S1 US D823814S1 US 201729611655 F US201729611655 F US 201729611655F US D823814 S USD823814 S US D823814S
Authority
US
United States
Prior art keywords
contact wafer
wafer
contact
view
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/611,655
Inventor
Jonathan E. Buck
John A. MONGOLD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samtec Inc
Original Assignee
Samtec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samtec Inc filed Critical Samtec Inc
Priority to US29/611,655 priority Critical patent/USD823814S1/en
Assigned to SAMTEC, INC. reassignment SAMTEC, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MONGOLD, JOHN A., BUCK, JONATHAN E.
Application granted granted Critical
Publication of USD823814S1 publication Critical patent/USD823814S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

FIG. 2 is a top, back, and left side perspective view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a back elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for contact wafer, as shown and described.
US29/611,655 2017-07-24 2017-07-24 Contact wafer Active USD823814S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/611,655 USD823814S1 (en) 2017-07-24 2017-07-24 Contact wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US29/611,655 USD823814S1 (en) 2017-07-24 2017-07-24 Contact wafer
JPD2017-26976F JP1603925S (en) 2017-07-24 2017-12-01
JPD2018-4516F JP1611064S (en) 2017-07-24 2017-12-01
US29/647,260 USD879724S1 (en) 2017-07-24 2018-05-11 Contact wafer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/647,260 Division USD879724S1 (en) 2017-07-24 2018-05-11 Contact wafer

Publications (1)

Publication Number Publication Date
USD823814S1 true USD823814S1 (en) 2018-07-24

Family

ID=62104596

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/611,655 Active USD823814S1 (en) 2017-07-24 2017-07-24 Contact wafer
US29/647,260 Active USD879724S1 (en) 2017-07-24 2018-05-11 Contact wafer

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/647,260 Active USD879724S1 (en) 2017-07-24 2018-05-11 Contact wafer

Country Status (2)

Country Link
US (2) USD823814S1 (en)
JP (2) JP1611064S (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD877084S1 (en) * 2017-07-17 2020-03-03 Samtec, Inc. Electrical connector
USD877700S1 (en) * 2017-07-17 2020-03-10 Samtec, Inc. Electrical connector
USD879724S1 (en) * 2017-07-24 2020-03-31 Samtec, Inc. Contact wafer
USD881133S1 (en) * 2018-12-20 2020-04-14 Samtec, Inc. Contact wafer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7404740B1 (en) * 2007-11-30 2008-07-29 Chief Land Electronic Co., Ltd. Female connector
US20080280491A1 (en) * 2007-05-11 2008-11-13 Chief Land Electronic Co., Ltd. Grounding Terminal for Electrical Connector
US20140273651A1 (en) * 2013-03-14 2014-09-18 Chief Land Electronic Co., Ltd. Coupling terminal structure and electrical connector using the same
USD768089S1 (en) * 2014-11-26 2016-10-04 Triple Win Precision Technology Co., Ltd. Terminal of electric connector
US20180097326A1 (en) * 2013-11-26 2018-04-05 Samtec, Inc. Direct-attach connector

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462957B1 (en) 1999-11-18 2002-10-08 Nortel Networks Limited High performance orthogonal interconnect architecture without midplane
JP3609379B2 (en) 2002-01-31 2005-01-12 日本圧着端子製造株式会社 Electrical connector with locking mechanism
US6652318B1 (en) 2002-05-24 2003-11-25 Fci Americas Technology, Inc. Cross-talk canceling technique for high speed electrical connectors
US20050101176A1 (en) 2003-11-10 2005-05-12 Kachlic Jerry D. Latch for electrical connector
US7331717B2 (en) 2004-07-01 2008-02-19 Amphenol Corporation Flexible optical interconnection system
US7083459B1 (en) 2005-04-20 2006-08-01 Bizlink Technology, Inc. Latching connector assembly
US7654870B2 (en) 2008-02-11 2010-02-02 Z-Plane, Inc. Interconnection assembly for printed circuit boards
JP5155700B2 (en) 2008-03-11 2013-03-06 富士通コンポーネント株式会社 connector
US7988456B2 (en) 2009-01-14 2011-08-02 Tyco Electronics Corporation Orthogonal connector system
US8585426B2 (en) 2010-07-27 2013-11-19 Fci Americas Technology Llc Electrical connector including latch assembly
US8398429B2 (en) 2010-11-11 2013-03-19 Tyco Electronics Corporation Cable assembly for a connector system
US8998645B2 (en) 2011-10-21 2015-04-07 Ohio Associated Enterprises, Llc Hermaphroditic interconnect system
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
US8842441B2 (en) 2013-02-05 2014-09-23 Huawei Technologies Co., Ltd. Electronic device, electronic system, and circuit board interconnection architecture of the same
US9142921B2 (en) 2013-02-27 2015-09-22 Molex Incorporated High speed bypass cable for use with backplanes
DE102013218441A1 (en) 2013-09-13 2015-04-02 Würth Elektronik Ics Gmbh & Co. Kg Direct plug-in device with Vorjustiereinrichtung and relative to this sliding locking device
WO2015116407A1 (en) 2014-01-31 2015-08-06 Fci Asia Pte. Ltd Electrical terminals
US9362641B2 (en) 2014-07-01 2016-06-07 Telefonaktiebolaget L M Ericsson (Publ) Orthogonal backplane design with reduced chassis depth
TWI689136B (en) * 2016-06-15 2020-03-21 美商山姆科技公司 Overmolded lead frame providing contact support and impedance matching properties
USD823814S1 (en) * 2017-07-24 2018-07-24 Samtec, Inc. Contact wafer
US10283889B2 (en) * 2017-09-14 2019-05-07 Lear Corporation Electrical terminal with balanced front end protection
US10381770B1 (en) * 2018-02-27 2019-08-13 Ohio Associated Enterprises, Llc Protective grid for linear electrical contact array

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080280491A1 (en) * 2007-05-11 2008-11-13 Chief Land Electronic Co., Ltd. Grounding Terminal for Electrical Connector
US7404740B1 (en) * 2007-11-30 2008-07-29 Chief Land Electronic Co., Ltd. Female connector
US20140273651A1 (en) * 2013-03-14 2014-09-18 Chief Land Electronic Co., Ltd. Coupling terminal structure and electrical connector using the same
US20180097326A1 (en) * 2013-11-26 2018-04-05 Samtec, Inc. Direct-attach connector
USD768089S1 (en) * 2014-11-26 2016-10-04 Triple Win Precision Technology Co., Ltd. Terminal of electric connector

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Buck et al., "Contact Wafer", U.S. Appl. No. 29/647,260, filed May 11, 2018.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD877084S1 (en) * 2017-07-17 2020-03-03 Samtec, Inc. Electrical connector
USD877700S1 (en) * 2017-07-17 2020-03-10 Samtec, Inc. Electrical connector
USD879724S1 (en) * 2017-07-24 2020-03-31 Samtec, Inc. Contact wafer
USD881133S1 (en) * 2018-12-20 2020-04-14 Samtec, Inc. Contact wafer

Also Published As

Publication number Publication date
USD879724S1 (en) 2020-03-31
JP1611064S (en) 2018-08-13
JP1603925S (en) 2018-05-14

Similar Documents

Publication Publication Date Title
USD873798S1 (en) Communication device
USD832037S1 (en) Bottle dispenser base
USD797412S1 (en) Shoe
USD814385S1 (en) Quadcopter
USD801011S1 (en) Footwear
USD817194S1 (en) Watch case
USD828508S1 (en) Faucet
USD771364S1 (en) Insole
USD798934S1 (en) Dome camera
USD809876S1 (en) Snack cup with bear shape
USD814436S1 (en) Wireless conference device
USD797496S1 (en) Blender base
USD798933S1 (en) Dome camera
USD841627S1 (en) Earphone
USD806228S1 (en) Water pick
USD771365S1 (en) Insole
USD770417S1 (en) Speaker
USD805741S1 (en) Aqua shoe
USD768116S1 (en) Antenna
USD796190S1 (en) Bag
USD878329S1 (en) Headset
USD789347S1 (en) Cellular phone case
USD785184S1 (en) Massage cushion
USD768121S1 (en) Case accessory
USD846982S1 (en) Packaging