USD787457S1 - Substrate for an electronic circuit - Google Patents
Substrate for an electronic circuit Download PDFInfo
- Publication number
- USD787457S1 USD787457S1 US29/533,047 US201529533047F USD787457S US D787457 S1 USD787457 S1 US D787457S1 US 201529533047 F US201529533047 F US 201529533047F US D787457 S USD787457 S US D787457S
- Authority
- US
- United States
- Prior art keywords
- substrate
- electronic circuit
- view
- ornamental design
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken line portion of the figure drawings is included to show portions of the article that form no part of the claimed design.
Claims (1)
- The ornamental design for a substrate for an electronic circuit, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-000435 | 2015-01-14 | ||
JPD2015-435F JP1528484S (en) | 2015-01-14 | 2015-01-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD787457S1 true USD787457S1 (en) | 2017-05-23 |
Family
ID=53778800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/533,047 Active USD787457S1 (en) | 2015-01-14 | 2015-07-14 | Substrate for an electronic circuit |
Country Status (2)
Country | Link |
---|---|
US (1) | USD787457S1 (en) |
JP (1) | JP1528484S (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD798251S1 (en) * | 2016-11-07 | 2017-09-26 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
USD819037S1 (en) * | 2016-01-22 | 2018-05-29 | Shenzhen Longsys Electronics Co., Ltd. | SSD storage module |
USD821987S1 (en) * | 2016-04-27 | 2018-07-03 | Ngk Insulators, Ltd. | Flexible printed circuits |
USD824910S1 (en) * | 2017-02-17 | 2018-08-07 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826944S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826945S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826946S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD828357S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD828358S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD834025S1 (en) * | 2017-02-17 | 2018-11-20 | Samsung Electronics Co., Ltd. | SSD storage device |
USD843334S1 (en) * | 2016-05-11 | 2019-03-19 | Ngk Insulators, Ltd. | Flexible printed circuits |
USD848432S1 (en) * | 2017-02-17 | 2019-05-14 | Samsung Electronics Co., Ltd. | SSD storage device |
USD868796S1 (en) * | 2018-02-07 | 2019-12-03 | Samsung Electronics Co., Ltd. | USB memory |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869470S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD937230S1 (en) * | 2019-12-20 | 2021-11-30 | Fleece Performance Engineering, Inc. | Circuit board |
USD947801S1 (en) * | 2019-11-07 | 2022-04-05 | Phoenix Contact Gmbh & Co. Kg | Printed circuit board |
USD1001753S1 (en) * | 2019-09-09 | 2023-10-17 | The Noco Company | Circuit board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD189064S (en) | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | Ssd storage device |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5303121A (en) * | 1992-12-28 | 1994-04-12 | Ncr Corporation | Multi-chip module board |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US6307754B1 (en) * | 1999-12-09 | 2001-10-23 | Gateway, Inc. | Circuit card guide |
US6347394B1 (en) * | 1998-11-04 | 2002-02-12 | Micron Technology, Inc. | Buffering circuit embedded in an integrated circuit device module used for buffering clocks and other input signals |
USD459706S1 (en) | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
US6765278B2 (en) * | 2000-08-24 | 2004-07-20 | Heetronix | Circuit structure with W, WC and/or W2C layer on AlN substrate |
US20070274032A1 (en) * | 2000-01-06 | 2007-11-29 | Super Talent Electronics Inc. | Thin Flash-Hard-Drive with Two-Piece Casing |
US20080137278A1 (en) * | 2006-12-11 | 2008-06-12 | Kreton Corporation | Memory chip and insert card having the same thereon |
US20090279243A1 (en) * | 2009-05-13 | 2009-11-12 | Amidi Mike H | Memory Module with Vertically Accessed Interposer Assemblies |
US20100264520A1 (en) * | 2007-12-25 | 2010-10-21 | Toyota Jidosha Kabushiki Kaisha | Semiconductor module |
USD637193S1 (en) * | 2010-11-19 | 2011-05-03 | Apple Inc. | Electronic device |
US20110122481A1 (en) * | 2009-11-20 | 2011-05-26 | Citizen Holdings Co., Ltd. | Integrated device and manufacturing method |
USD655296S1 (en) | 2010-10-18 | 2012-03-06 | Apple Inc. | Electronic device |
USD673922S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
USD673921S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
US20130306991A1 (en) * | 2011-04-22 | 2013-11-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD716310S1 (en) * | 2012-06-09 | 2014-10-28 | Apple, Inc. | Electronic device |
USD730304S1 (en) * | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
US20150355686A1 (en) * | 2014-06-05 | 2015-12-10 | Liqid Inc. | Adjustable data storage drive module carrier assembly |
USD753073S1 (en) * | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
US20160172016A1 (en) * | 2014-12-12 | 2016-06-16 | Kabushiki Kaisha Toshiba | Semiconductor device and electronic device |
USD764424S1 (en) * | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
US20160334992A1 (en) * | 2015-05-12 | 2016-11-17 | Kabushiki Kaisha Toshiba | Semiconductor device that changes a target memory unit based on temperature |
US20170010639A1 (en) * | 2015-07-09 | 2017-01-12 | Kabushiki Kaisha Toshiba | Semiconductor device package having an oscillator and an apparatus having the same |
-
2015
- 2015-01-14 JP JPD2015-435F patent/JP1528484S/ja active Active
- 2015-07-14 US US29/533,047 patent/USD787457S1/en active Active
Patent Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5303121A (en) * | 1992-12-28 | 1994-04-12 | Ncr Corporation | Multi-chip module board |
US6347394B1 (en) * | 1998-11-04 | 2002-02-12 | Micron Technology, Inc. | Buffering circuit embedded in an integrated circuit device module used for buffering clocks and other input signals |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US6307754B1 (en) * | 1999-12-09 | 2001-10-23 | Gateway, Inc. | Circuit card guide |
US20070274032A1 (en) * | 2000-01-06 | 2007-11-29 | Super Talent Electronics Inc. | Thin Flash-Hard-Drive with Two-Piece Casing |
US6765278B2 (en) * | 2000-08-24 | 2004-07-20 | Heetronix | Circuit structure with W, WC and/or W2C layer on AlN substrate |
USD459706S1 (en) | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
US20080137278A1 (en) * | 2006-12-11 | 2008-06-12 | Kreton Corporation | Memory chip and insert card having the same thereon |
US20100264520A1 (en) * | 2007-12-25 | 2010-10-21 | Toyota Jidosha Kabushiki Kaisha | Semiconductor module |
US20090279243A1 (en) * | 2009-05-13 | 2009-11-12 | Amidi Mike H | Memory Module with Vertically Accessed Interposer Assemblies |
US20110122481A1 (en) * | 2009-11-20 | 2011-05-26 | Citizen Holdings Co., Ltd. | Integrated device and manufacturing method |
USD655296S1 (en) | 2010-10-18 | 2012-03-06 | Apple Inc. | Electronic device |
USD686215S1 (en) * | 2010-11-19 | 2013-07-16 | Apple Inc. | Electronic device |
USD637193S1 (en) * | 2010-11-19 | 2011-05-03 | Apple Inc. | Electronic device |
USD652041S1 (en) * | 2010-11-19 | 2012-01-10 | Apple Inc. | Electronic device |
USD673922S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
USD673921S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
US20130306991A1 (en) * | 2011-04-22 | 2013-11-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD716310S1 (en) * | 2012-06-09 | 2014-10-28 | Apple, Inc. | Electronic device |
USD730304S1 (en) * | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD764424S1 (en) * | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD778852S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD778851S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
US20150355686A1 (en) * | 2014-06-05 | 2015-12-10 | Liqid Inc. | Adjustable data storage drive module carrier assembly |
US20160172016A1 (en) * | 2014-12-12 | 2016-06-16 | Kabushiki Kaisha Toshiba | Semiconductor device and electronic device |
USD753073S1 (en) * | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
US20160334992A1 (en) * | 2015-05-12 | 2016-11-17 | Kabushiki Kaisha Toshiba | Semiconductor device that changes a target memory unit based on temperature |
US20170010639A1 (en) * | 2015-07-09 | 2017-01-12 | Kabushiki Kaisha Toshiba | Semiconductor device package having an oscillator and an apparatus having the same |
Non-Patent Citations (2)
Title |
---|
Toshiba HG5D Series SATA M.2 SSD Review (512GB)-Amazing Performance in a SATA M.2 SSD, dated Oct. 8, 2013, [online], [site visited Feb. 17, 2017]. Available from Internet, <URL: http://www.thessdreview.com/our-reviews/toshiba-hg5d-series-sata-m-2-ssd-review-512gb/>. * |
Toshiba Releases "Blade-Type" SSD Modules up to 256GB, dated Nov. 8, 2010, [online], [site visited Feb. 17, 2017]. Available from Internet, <URL: https://techcrunch.com/2010/11/08/toshiba-releases-blade-type-ssd-modules-up-to-256gb/>. * |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD819037S1 (en) * | 2016-01-22 | 2018-05-29 | Shenzhen Longsys Electronics Co., Ltd. | SSD storage module |
USD821987S1 (en) * | 2016-04-27 | 2018-07-03 | Ngk Insulators, Ltd. | Flexible printed circuits |
USD843334S1 (en) * | 2016-05-11 | 2019-03-19 | Ngk Insulators, Ltd. | Flexible printed circuits |
USD798251S1 (en) * | 2016-11-07 | 2017-09-26 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
USD828358S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD848432S1 (en) * | 2017-02-17 | 2019-05-14 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826946S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD828357S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826944S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD834025S1 (en) * | 2017-02-17 | 2018-11-20 | Samsung Electronics Co., Ltd. | SSD storage device |
USD824910S1 (en) * | 2017-02-17 | 2018-08-07 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826945S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD868796S1 (en) * | 2018-02-07 | 2019-12-03 | Samsung Electronics Co., Ltd. | USB memory |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869470S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD1001753S1 (en) * | 2019-09-09 | 2023-10-17 | The Noco Company | Circuit board |
USD947801S1 (en) * | 2019-11-07 | 2022-04-05 | Phoenix Contact Gmbh & Co. Kg | Printed circuit board |
USD937230S1 (en) * | 2019-12-20 | 2021-11-30 | Fleece Performance Engineering, Inc. | Circuit board |
Also Published As
Publication number | Publication date |
---|---|
JP1528484S (en) | 2015-07-13 |
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