USD768095S1 - Light-emitting diode package - Google Patents

Light-emitting diode package Download PDF

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Publication number
USD768095S1
USD768095S1 US29/541,826 US201529541826F USD768095S US D768095 S1 USD768095 S1 US D768095S1 US 201529541826 F US201529541826 F US 201529541826F US D768095 S USD768095 S US D768095S
Authority
US
United States
Prior art keywords
emitting diode
diode package
light
light emitting
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/541,826
Inventor
Junpeng Shi
Pei-Song Cai
Zhenduan Lin
Hao Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quanzhou Sanan Semiconductor Technology Co Ltd
Original Assignee
Xiamen Sanan Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Sanan Optoelectronics Technology Co Ltd filed Critical Xiamen Sanan Optoelectronics Technology Co Ltd
Priority to US29/541,826 priority Critical patent/USD768095S1/en
Assigned to XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. reassignment XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CAI, PEI-SONG, HUANG, HAO, LIN, ZHENDUAN, SHI, Junpeng
Application granted granted Critical
Publication of USD768095S1 publication Critical patent/USD768095S1/en
Assigned to Quanzhou Sanan Semiconductor Technology Co., Ltd. reassignment Quanzhou Sanan Semiconductor Technology Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
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Description

FIG. 1 is a front view of a light emitting diode package according to our new design;
FIG. 2 is a rear view of a light emitting diode package according to our new design;
FIG. 3 is a left side view of a light emitting diode package according to our new design;
FIG. 4 is a right side view of a light emitting diode package according to our new design;
FIG. 5 is a top view of a light emitting diode package according to our new design;
FIG. 6 is a bottom view of a light emitting diode package according to our new design;
FIG. 7 is a perspective view of a light emitting diode package according to our new design; and,
FIG. 8 is another perspective view of a light emitting diode package according to our new design.

Claims (1)

    CLAIM
  1. The ornamental design for a light-emitting diode package, substantially as shown and described.
US29/541,826 2015-10-08 2015-10-08 Light-emitting diode package Active USD768095S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/541,826 USD768095S1 (en) 2015-10-08 2015-10-08 Light-emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/541,826 USD768095S1 (en) 2015-10-08 2015-10-08 Light-emitting diode package

Publications (1)

Publication Number Publication Date
USD768095S1 true USD768095S1 (en) 2016-10-04

Family

ID=56990021

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/541,826 Active USD768095S1 (en) 2015-10-08 2015-10-08 Light-emitting diode package

Country Status (1)

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US (1) USD768095S1 (en)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020123163A1 (en) * 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
US6657238B2 (en) * 2001-01-25 2003-12-02 Rohm Co., Ltd. Light emitting diode and illuminator using the same
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US7491977B2 (en) * 2004-02-04 2009-02-17 Citizen Electronics Co., Ltd. Light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures
US20100059782A1 (en) * 2008-09-09 2010-03-11 Nichia Corporation Optical-semiconductor device and method for manufactruing the same
USD626097S1 (en) * 2009-10-16 2010-10-26 Kabushiki Kaisha Toshiba Light-emitting diode
USD626922S1 (en) * 2010-02-23 2010-11-09 Citizen Electronics Co., Ltd. Light-emitting diode
USD629767S1 (en) * 2010-03-19 2010-12-28 Kabushiki Kaisha Toshiba Light-emitting diode
US20120132933A1 (en) * 2010-11-25 2012-05-31 Kabushiki Kaisha Toshiba Led module and illumination apparatus
USD676002S1 (en) * 2011-07-07 2013-02-12 Citizen Electronics Co., Ltd. Light-emitting diode
USD676003S1 (en) * 2011-08-29 2013-02-12 Toyoda Gosei Co., Ltd. Light emitting diode
USD694201S1 (en) * 2012-03-30 2013-11-26 Citizen Electronics Co., Ltd. Light-emitting diode
USD698742S1 (en) * 2012-09-27 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD742554S1 (en) * 2013-01-27 2015-11-03 Citizen Electronics Co., Ltd. Lighting unit
USD756942S1 (en) * 2015-05-06 2016-05-24 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020123163A1 (en) * 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US6657238B2 (en) * 2001-01-25 2003-12-02 Rohm Co., Ltd. Light emitting diode and illuminator using the same
US7491977B2 (en) * 2004-02-04 2009-02-17 Citizen Electronics Co., Ltd. Light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures
US20100059782A1 (en) * 2008-09-09 2010-03-11 Nichia Corporation Optical-semiconductor device and method for manufactruing the same
USD626097S1 (en) * 2009-10-16 2010-10-26 Kabushiki Kaisha Toshiba Light-emitting diode
USD626922S1 (en) * 2010-02-23 2010-11-09 Citizen Electronics Co., Ltd. Light-emitting diode
USD629767S1 (en) * 2010-03-19 2010-12-28 Kabushiki Kaisha Toshiba Light-emitting diode
US20120132933A1 (en) * 2010-11-25 2012-05-31 Kabushiki Kaisha Toshiba Led module and illumination apparatus
USD676002S1 (en) * 2011-07-07 2013-02-12 Citizen Electronics Co., Ltd. Light-emitting diode
USD676003S1 (en) * 2011-08-29 2013-02-12 Toyoda Gosei Co., Ltd. Light emitting diode
USD694201S1 (en) * 2012-03-30 2013-11-26 Citizen Electronics Co., Ltd. Light-emitting diode
USD698742S1 (en) * 2012-09-27 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD742554S1 (en) * 2013-01-27 2015-11-03 Citizen Electronics Co., Ltd. Lighting unit
USD756942S1 (en) * 2015-05-06 2016-05-24 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode

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