USD730849S1 - Universal ground fault circuit interrupter (GFCI) printed circuit board package - Google Patents

Universal ground fault circuit interrupter (GFCI) printed circuit board package Download PDF

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Publication number
USD730849S1
USD730849S1 US29/433,827 US201229433827F USD730849S US D730849 S1 USD730849 S1 US D730849S1 US 201229433827 F US201229433827 F US 201229433827F US D730849 S USD730849 S US D730849S
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US
United States
Prior art keywords
gfci
ground fault
circuit board
printed circuit
board package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/433,827
Inventor
Victor V. Aromin
Chepur P. Rao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tower Manufacturing Corp
Tower Manufacturing Co
Original Assignee
Tower Manufacturing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tower Manufacturing Corp filed Critical Tower Manufacturing Corp
Priority to US29/433,827 priority Critical patent/USD730849S1/en
Assigned to TOWER MANUFACTURING COMPANY reassignment TOWER MANUFACTURING COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AROMIN, VICTOR V
Application granted granted Critical
Publication of USD730849S1 publication Critical patent/USD730849S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of a universal ground fault circuit interupter (GFCI) printed circuit board package showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a rear elevation view thereof;
FIG. 7 is a front elevation view thereof;
FIG. 8 right side view thereof shown in a used condition with a right angle GFCI enclosure shown in broken lines; and,
FIG. 9 is another right side view thereof shown in a used condition with an inline GFCI enclosure shown in broken lines.
The broken lines of FIGS. 8 and 9 of a right angle and inline GFCI enclosures and the broken lines in FIGS. 1-5 and 7 of power input terminals form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a universal ground fault circuit interrupter (GFCI) printed circuit board package, as shown and described.
US29/433,827 2012-10-05 2012-10-05 Universal ground fault circuit interrupter (GFCI) printed circuit board package Active USD730849S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/433,827 USD730849S1 (en) 2012-10-05 2012-10-05 Universal ground fault circuit interrupter (GFCI) printed circuit board package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/433,827 USD730849S1 (en) 2012-10-05 2012-10-05 Universal ground fault circuit interrupter (GFCI) printed circuit board package

Publications (1)

Publication Number Publication Date
USD730849S1 true USD730849S1 (en) 2015-06-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/433,827 Active USD730849S1 (en) 2012-10-05 2012-10-05 Universal ground fault circuit interrupter (GFCI) printed circuit board package

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US (1) USD730849S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD882538S1 (en) * 2017-06-30 2020-04-28 Tenka Inc. Circuit cube
USD962881S1 (en) * 2019-05-06 2022-09-06 Lam Research Corporation Semiconductor wafer processing apparatus

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3646399A (en) * 1970-03-04 1972-02-29 Gen Electric Printed circuit board construction
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US4807087A (en) * 1986-11-20 1989-02-21 Kabushiki Kaisha Toshiba Single-in-line type semiconductor device
USD316251S (en) * 1988-12-19 1991-04-16 Mosaic Semiconductor, Inc. In-line semiconductor package
USD397093S (en) * 1997-07-30 1998-08-18 Il Kim Printed circuit board with mounted components
USD430856S (en) * 1999-08-05 2000-09-12 Alan W. Wilkerson Circuit board
USD459706S1 (en) * 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
US6760225B1 (en) * 2003-01-20 2004-07-06 Power Mate Technology Co., Ltd. Heat-dissipating structure of circuit board
USD505925S1 (en) * 2003-12-11 2005-06-07 Kyung Hee Koo Repeater circuit board design
USD524763S1 (en) * 2004-03-08 2006-07-11 Mitsumi Electric Co., Ltd. Transmitting/receiving unit
USD525213S1 (en) * 2002-11-01 2006-07-18 Siemens Aktiengesellschaft Circuit board
USD552048S1 (en) * 2005-10-26 2007-10-02 Hon Hai Precision Industry Co., Ltd. Printed circuit board
USD556158S1 (en) * 2005-11-18 2007-11-27 Hon Hai Precision Industry Co., Ltd. Printed circuit board
US20080080151A1 (en) * 2004-02-06 2008-04-03 Autonetworks Technologies, Ltd. Circuit Module
US20090268390A1 (en) * 2008-04-23 2009-10-29 International Business Machines Corporation Printed circuit assembly with determination of storage configuration based on installed paddle board
USD639756S1 (en) * 2010-07-16 2011-06-14 Dbg Group Investments, Llc Circuit board for integrated ozone laundry system
USD642546S1 (en) * 2010-07-16 2011-08-02 Dbg Group Investments, Llc Circuit board with LEDS for an integrated ozone laundry system
USD647072S1 (en) * 2010-12-21 2011-10-18 Arthur Lane Bentley Circuit board

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3646399A (en) * 1970-03-04 1972-02-29 Gen Electric Printed circuit board construction
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US4807087A (en) * 1986-11-20 1989-02-21 Kabushiki Kaisha Toshiba Single-in-line type semiconductor device
USD316251S (en) * 1988-12-19 1991-04-16 Mosaic Semiconductor, Inc. In-line semiconductor package
USD397093S (en) * 1997-07-30 1998-08-18 Il Kim Printed circuit board with mounted components
USD430856S (en) * 1999-08-05 2000-09-12 Alan W. Wilkerson Circuit board
USD459706S1 (en) * 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD525213S1 (en) * 2002-11-01 2006-07-18 Siemens Aktiengesellschaft Circuit board
US6760225B1 (en) * 2003-01-20 2004-07-06 Power Mate Technology Co., Ltd. Heat-dissipating structure of circuit board
USD505925S1 (en) * 2003-12-11 2005-06-07 Kyung Hee Koo Repeater circuit board design
US20080080151A1 (en) * 2004-02-06 2008-04-03 Autonetworks Technologies, Ltd. Circuit Module
USD524763S1 (en) * 2004-03-08 2006-07-11 Mitsumi Electric Co., Ltd. Transmitting/receiving unit
USD552048S1 (en) * 2005-10-26 2007-10-02 Hon Hai Precision Industry Co., Ltd. Printed circuit board
USD556158S1 (en) * 2005-11-18 2007-11-27 Hon Hai Precision Industry Co., Ltd. Printed circuit board
US20090268390A1 (en) * 2008-04-23 2009-10-29 International Business Machines Corporation Printed circuit assembly with determination of storage configuration based on installed paddle board
USD639756S1 (en) * 2010-07-16 2011-06-14 Dbg Group Investments, Llc Circuit board for integrated ozone laundry system
USD642546S1 (en) * 2010-07-16 2011-08-02 Dbg Group Investments, Llc Circuit board with LEDS for an integrated ozone laundry system
USD647072S1 (en) * 2010-12-21 2011-10-18 Arthur Lane Bentley Circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD882538S1 (en) * 2017-06-30 2020-04-28 Tenka Inc. Circuit cube
USD882537S1 (en) * 2017-06-30 2020-04-28 Tenka, Inc. Circuit cube
USD886072S1 (en) * 2017-06-30 2020-06-02 Tenka Inc. Circuit cube
USD962881S1 (en) * 2019-05-06 2022-09-06 Lam Research Corporation Semiconductor wafer processing apparatus

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