USD716741S1 - Wiring board - Google Patents
Wiring board Download PDFInfo
- Publication number
- USD716741S1 USD716741S1 US29/476,981 US201329476981F USD716741S US D716741 S1 USD716741 S1 US D716741S1 US 201329476981 F US201329476981 F US 201329476981F US D716741 S USD716741 S US D716741S
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- United States
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- wiring board
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007613 environmental effect Effects 0.000 description 1
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-015946 | 2013-07-11 | ||
JPD2013-15946F JP1497022S (enrdf_load_stackoverflow) | 2013-07-11 | 2013-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD716741S1 true USD716741S1 (en) | 2014-11-04 |
Family
ID=51798600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/476,981 Active USD716741S1 (en) | 2013-07-11 | 2013-12-18 | Wiring board |
Country Status (2)
Country | Link |
---|---|
US (1) | USD716741S1 (enrdf_load_stackoverflow) |
JP (1) | JP1497022S (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD745476S1 (en) * | 2012-10-19 | 2015-12-15 | Solumatics CVBA | Print board |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD327883S (en) * | 1990-02-09 | 1992-07-14 | Gemplus Card International | Connecting terminal for chip cards |
USD328599S (en) * | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
US20030006422A1 (en) * | 1997-05-08 | 2003-01-09 | Showa Denko K.K. | Electrode for light-emitting semiconductor devices and method of producing the electrode |
USD532756S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
USD532757S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
USD533847S1 (en) * | 2005-11-02 | 2006-12-19 | Supernova Optoelectronics Corp. | Electrode layer |
USD534134S1 (en) * | 2005-11-02 | 2006-12-26 | Supernova Optoelectronics Corp. | Electrode layer |
USD534506S1 (en) * | 2005-11-02 | 2007-01-02 | Supernova Optoelectronics Corp. | Electrode layer |
USD535264S1 (en) * | 2005-11-02 | 2007-01-16 | Supernova Optoelectronics Corp. | Electrode layer |
US20070166146A1 (en) * | 2006-01-13 | 2007-07-19 | Disco Corporation | Semiconductor wafer |
USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
USD613690S1 (en) * | 2008-12-09 | 2010-04-13 | Fujifilm Corporation | Conductive sheet |
USD615927S1 (en) * | 2008-05-09 | 2010-05-18 | Fujifilm Corporation | Conductive sheet |
US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
USD651991S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
USD651992S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
-
2013
- 2013-07-11 JP JPD2013-15946F patent/JP1497022S/ja active Active
- 2013-12-18 US US29/476,981 patent/USD716741S1/en active Active
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD327883S (en) * | 1990-02-09 | 1992-07-14 | Gemplus Card International | Connecting terminal for chip cards |
USD328599S (en) * | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
US20030006422A1 (en) * | 1997-05-08 | 2003-01-09 | Showa Denko K.K. | Electrode for light-emitting semiconductor devices and method of producing the electrode |
USD534134S1 (en) * | 2005-11-02 | 2006-12-26 | Supernova Optoelectronics Corp. | Electrode layer |
USD532757S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
USD533847S1 (en) * | 2005-11-02 | 2006-12-19 | Supernova Optoelectronics Corp. | Electrode layer |
USD532756S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
USD534506S1 (en) * | 2005-11-02 | 2007-01-02 | Supernova Optoelectronics Corp. | Electrode layer |
USD535264S1 (en) * | 2005-11-02 | 2007-01-16 | Supernova Optoelectronics Corp. | Electrode layer |
US20070166146A1 (en) * | 2006-01-13 | 2007-07-19 | Disco Corporation | Semiconductor wafer |
USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
USD615927S1 (en) * | 2008-05-09 | 2010-05-18 | Fujifilm Corporation | Conductive sheet |
USD613690S1 (en) * | 2008-12-09 | 2010-04-13 | Fujifilm Corporation | Conductive sheet |
US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
USD651991S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
USD651992S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
Non-Patent Citations (3)
Title |
---|
"Pillar PC-Clad", published by Nippon Pillar Packing Co., Ltd., publication date unknown but at least as early as 2008. |
"Products News 173", Newline-up of "Black colored flexible printed circuit stiffener", http://www.risho.co.jp/rishonews/products—news/pn173/products—news.html release date: Jul. 10, 2010, published by Risho Kogyo Co., Ltd. |
Brochure of "Chukoh Flo", release date Nov. 1, 2007, published by Chukoh Chemical Industries, Ltd. |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD745476S1 (en) * | 2012-10-19 | 2015-12-15 | Solumatics CVBA | Print board |
Also Published As
Publication number | Publication date |
---|---|
JP1497022S (enrdf_load_stackoverflow) | 2017-05-01 |
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