USD716241S1 - Wiring board - Google Patents
Wiring board Download PDFInfo
- Publication number
- USD716241S1 USD716241S1 US29/476,992 US201329476992F USD716241S US D716241 S1 USD716241 S1 US D716241S1 US 201329476992 F US201329476992 F US 201329476992F US D716241 S USD716241 S US D716241S
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- United States
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- wiring board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007613 environmental effect Effects 0.000 description 1
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2013-15944F JP1497021S (cs) | 2013-07-11 | 2013-07-11 | |
| JP2013-015944 | 2013-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD716241S1 true USD716241S1 (en) | 2014-10-28 |
Family
ID=51753690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/476,992 Active USD716241S1 (en) | 2013-07-11 | 2013-12-18 | Wiring board |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD716241S1 (cs) |
| JP (1) | JP1497021S (cs) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD745476S1 (en) * | 2012-10-19 | 2015-12-15 | Solumatics CVBA | Print board |
| USD783006S1 (en) * | 2016-01-20 | 2017-04-04 | World Products, Inc. | Shorted ISM asymmetric omni antenna |
| USD787484S1 (en) * | 2016-05-03 | 2017-05-23 | Avery Dennison Retailinformation Services, Llc | Antenna design |
| USD787483S1 (en) * | 2016-05-03 | 2017-05-23 | Avery Dennison Retail Information Services, Llc | Antenna design |
| USD860175S1 (en) * | 2018-03-14 | 2019-09-17 | Megabyte Limited | RFID tag inlay |
| USD1012871S1 (en) * | 2020-06-30 | 2024-01-30 | Roche Molecular Systems, Inc. | Circuit board sensor pad |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
| USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
| USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
| USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
| USD327883S (en) * | 1990-02-09 | 1992-07-14 | Gemplus Card International | Connecting terminal for chip cards |
| USD328599S (en) * | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
| US20030006422A1 (en) * | 1997-05-08 | 2003-01-09 | Showa Denko K.K. | Electrode for light-emitting semiconductor devices and method of producing the electrode |
| USD532756S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
| USD532757S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
| USD533847S1 (en) * | 2005-11-02 | 2006-12-19 | Supernova Optoelectronics Corp. | Electrode layer |
| USD534134S1 (en) * | 2005-11-02 | 2006-12-26 | Supernova Optoelectronics Corp. | Electrode layer |
| USD534506S1 (en) * | 2005-11-02 | 2007-01-02 | Supernova Optoelectronics Corp. | Electrode layer |
| USD535264S1 (en) * | 2005-11-02 | 2007-01-16 | Supernova Optoelectronics Corp. | Electrode layer |
| US20070166146A1 (en) * | 2006-01-13 | 2007-07-19 | Disco Corporation | Semiconductor wafer |
| USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
| USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
| USD613690S1 (en) * | 2008-12-09 | 2010-04-13 | Fujifilm Corporation | Conductive sheet |
| USD615927S1 (en) * | 2008-05-09 | 2010-05-18 | Fujifilm Corporation | Conductive sheet |
| US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
| USD651992S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
| USD651991S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
-
2013
- 2013-07-11 JP JPD2013-15944F patent/JP1497021S/ja active Active
- 2013-12-18 US US29/476,992 patent/USD716241S1/en active Active
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
| USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
| USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
| USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
| USD327883S (en) * | 1990-02-09 | 1992-07-14 | Gemplus Card International | Connecting terminal for chip cards |
| USD328599S (en) * | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
| US20030006422A1 (en) * | 1997-05-08 | 2003-01-09 | Showa Denko K.K. | Electrode for light-emitting semiconductor devices and method of producing the electrode |
| USD534134S1 (en) * | 2005-11-02 | 2006-12-26 | Supernova Optoelectronics Corp. | Electrode layer |
| USD532757S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
| USD533847S1 (en) * | 2005-11-02 | 2006-12-19 | Supernova Optoelectronics Corp. | Electrode layer |
| USD532756S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
| USD534506S1 (en) * | 2005-11-02 | 2007-01-02 | Supernova Optoelectronics Corp. | Electrode layer |
| USD535264S1 (en) * | 2005-11-02 | 2007-01-16 | Supernova Optoelectronics Corp. | Electrode layer |
| US20070166146A1 (en) * | 2006-01-13 | 2007-07-19 | Disco Corporation | Semiconductor wafer |
| USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
| USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
| USD615927S1 (en) * | 2008-05-09 | 2010-05-18 | Fujifilm Corporation | Conductive sheet |
| USD613690S1 (en) * | 2008-12-09 | 2010-04-13 | Fujifilm Corporation | Conductive sheet |
| US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
| USD651992S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
| USD651991S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
Non-Patent Citations (3)
| Title |
|---|
| "Pillar PC-Clad", published by Nippon Pillar Packing Co., Ltd., publication date unknown but at least as early as 2008. |
| "Products News 173", Newline-up of "Black colored flexible printed circuit stiffener", http://www.risho.co.jp/rishonews/products—news/pn173/products—newsnews.html release date: Jul. 10, 2010, published by Risho Kogyo Co., Ltd. |
| Brochure of "Chukoh Flo", release date Nov. 1, 2007, published by Chukoh Chjemical Industries, Ltd. |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD745476S1 (en) * | 2012-10-19 | 2015-12-15 | Solumatics CVBA | Print board |
| USD783006S1 (en) * | 2016-01-20 | 2017-04-04 | World Products, Inc. | Shorted ISM asymmetric omni antenna |
| USD787484S1 (en) * | 2016-05-03 | 2017-05-23 | Avery Dennison Retailinformation Services, Llc | Antenna design |
| USD787483S1 (en) * | 2016-05-03 | 2017-05-23 | Avery Dennison Retail Information Services, Llc | Antenna design |
| USD860175S1 (en) * | 2018-03-14 | 2019-09-17 | Megabyte Limited | RFID tag inlay |
| USD1012871S1 (en) * | 2020-06-30 | 2024-01-30 | Roche Molecular Systems, Inc. | Circuit board sensor pad |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1497021S (cs) | 2017-05-01 |
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