USD658607S1 - Circuit package lid - Google Patents

Circuit package lid Download PDF

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Publication number
USD658607S1
USD658607S1 US29/394,524 US201129394524F USD658607S US D658607 S1 USD658607 S1 US D658607S1 US 201129394524 F US201129394524 F US 201129394524F US D658607 S USD658607 S US D658607S
Authority
US
United States
Prior art keywords
circuit package
package lid
lid
view
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/394,524
Inventor
Stephen Heng
Sanjay Dandia
Nikon Banouvong
Chia-Ken Leong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to US29/394,524 priority Critical patent/USD658607S1/en
Application granted granted Critical
Publication of USD658607S1 publication Critical patent/USD658607S1/en
Assigned to ADVANCED MICRO DEVICES, INC. reassignment ADVANCED MICRO DEVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DANDIA, SANJAY, LEONG, CHIA-KEN, BANOUVONG, NIKON, HENG, STEPHEN
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front perspective view of the circuit package lid;
FIG. 2 is a front view of the circuit package lid;
FIG. 3 is a top view of the circuit package lid;
FIG. 4 is a bottom view of the circuit package lid;
FIG. 5 is a left side view of the circuit package lid;
FIG. 6 is a right side view of the circuit package lid; and,
FIG. 7 is a rear view of the circuit package lid.
The broken line showing of the circuit package lid is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a circuit package lid, as shown and described.
US29/394,524 2010-03-26 2011-06-17 Circuit package lid Active USD658607S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/394,524 USD658607S1 (en) 2010-03-26 2011-06-17 Circuit package lid

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/358,472 USD641720S1 (en) 2010-03-26 2010-03-26 Circuit package lid
US29/394,524 USD658607S1 (en) 2010-03-26 2011-06-17 Circuit package lid

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/358,472 Division USD641720S1 (en) 2010-03-26 2010-03-26 Circuit package lid

Publications (1)

Publication Number Publication Date
USD658607S1 true USD658607S1 (en) 2012-05-01

Family

ID=44262259

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/358,472 Active USD641720S1 (en) 2010-03-26 2010-03-26 Circuit package lid
US29/394,524 Active USD658607S1 (en) 2010-03-26 2011-06-17 Circuit package lid

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/358,472 Active USD641720S1 (en) 2010-03-26 2010-03-26 Circuit package lid

Country Status (1)

Country Link
US (2) USD641720S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD852958S1 (en) * 2014-12-16 2019-07-02 Hamamatsu Photonics K.K. Radiation image conversion plate
USD960390S1 (en) * 2019-08-30 2022-08-09 Kyocera Corporation Analysis chip for biochemical testing machine

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD658187S1 (en) 2011-03-17 2012-04-24 Incase Designs Corp. Foldable front cover for electronic tablet
USD658188S1 (en) 2011-03-17 2012-04-24 Incase Designs Corp. Foldable front cover for electronic tablet
USD663304S1 (en) 2010-09-17 2012-07-10 Apple Inc. Cover
USD658186S1 (en) 2010-09-17 2012-04-24 Apple Inc. Cover
USD662100S1 (en) * 2011-02-07 2012-06-19 Hewlett-Packard Development Company, L.P. Case for a mobile computing device
USD677658S1 (en) 2011-03-02 2013-03-12 Apple Inc. Portable display device
USD713402S1 (en) 2012-03-06 2014-09-16 Apple Inc. Portable display device with case
JP1497024S (en) * 2013-07-10 2017-05-01

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
Advanced Micro Devices; AMD Socket F (1207) Design Specification; Publication No. 31700; Revision 1.03; Mar. 2006.
L1 Package; 2008; pp. 1-3.
Picture of Socket F design; from www.commons.wikimedia.org; Mar. 25, 2010.
U.S. Appl. No. 29/358,468, filed Mar. 26, 2010.
U.S. Appl. No. 29/358,472, filed Mar. 26, 2010.
U.S. Appl. No. 29/384,169, filed Jan. 27, 2011.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD852958S1 (en) * 2014-12-16 2019-07-02 Hamamatsu Photonics K.K. Radiation image conversion plate
USD960390S1 (en) * 2019-08-30 2022-08-09 Kyocera Corporation Analysis chip for biochemical testing machine

Also Published As

Publication number Publication date
USD641720S1 (en) 2011-07-19

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