USD654033S1 - Grooved wire support for a probe test core - Google Patents

Grooved wire support for a probe test core Download PDF

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Publication number
USD654033S1
USD654033S1 US29/354,193 US35419310F USD654033S US D654033 S1 USD654033 S1 US D654033S1 US 35419310 F US35419310 F US 35419310F US D654033 S USD654033 S US D654033S
Authority
US
United States
Prior art keywords
probe test
wire support
test core
grooved wire
grooved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/354,193
Inventor
Bryan J. Root
William A. Funk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celadon Systems Inc
Original Assignee
Celadon Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celadon Systems Inc filed Critical Celadon Systems Inc
Priority to US29/354,193 priority Critical patent/USD654033S1/en
Assigned to CELADON SYSTEMS, INC. reassignment CELADON SYSTEMS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUNK, WILLIAM A., ROOT, BRYAN J.
Application granted granted Critical
Publication of USD654033S1 publication Critical patent/USD654033S1/en
Assigned to CELADON SYSTEMS, INC. reassignment CELADON SYSTEMS, INC. CHANGE OF ADDRESS Assignors: CELADON SYSTEMS, INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a grooved wire support for a probe test core and showing the claimed design in an unclaimed environment of a bottom of a probe test core.
FIG. 2 is a bottom view thereof;
FIG. 3 is side view that shows some unclaimed environment of the probe test core shown in FIG. 1; and,
FIG. 4 is a top view showing the unclaimed environment of the top of the probe test core shown in FIG. 1.
Surface shading in the FIGS. 1 and 2 is provided to show the character and contour of surfaces of three-dimensional aspects of the design.
The broken line showing is for environmental purposes only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a grooved wire support for a probe test core, as shown and described.
US29/354,193 2010-01-20 2010-01-20 Grooved wire support for a probe test core Expired - Lifetime USD654033S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/354,193 USD654033S1 (en) 2010-01-20 2010-01-20 Grooved wire support for a probe test core

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/354,193 USD654033S1 (en) 2010-01-20 2010-01-20 Grooved wire support for a probe test core

Publications (1)

Publication Number Publication Date
USD654033S1 true USD654033S1 (en) 2012-02-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/354,193 Expired - Lifetime USD654033S1 (en) 2010-01-20 2010-01-20 Grooved wire support for a probe test core

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US (1) USD654033S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
USD722031S1 (en) * 2013-12-31 2015-02-03 Celadon Systems, Inc. Top contact layout board in an electrical system
USD929198S1 (en) * 2019-09-16 2021-08-31 David Gysland Tungsten grinder
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4495377A (en) * 1982-12-30 1985-01-22 International Business Machines Corporation Substrate wiring patterns for connecting to integrated-circuit chips
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD320361S (en) * 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
US5091822A (en) * 1989-06-15 1992-02-25 Graphico Co., Ltd. Radial type of parallel system bus structure with printed, twisted conductor lines
US5210682A (en) * 1990-10-19 1993-05-11 Graphico Co., Ltd. Radial type of parallel system bus structure having pairs of conductor lines with impedance matching elements
US6310398B1 (en) * 1998-12-03 2001-10-30 Walter M. Katz Routable high-density interfaces for integrated circuit devices
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD588290S1 (en) * 2008-11-25 2009-03-10 Osram Sylvania Inc. Exterior vehicle lamp
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD610101S1 (en) * 2009-01-14 2010-02-16 Cisco Technology, Inc. Access point circuit receptacle
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
USD639757S1 (en) * 2010-08-16 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
USD639755S1 (en) * 2010-01-20 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
US7974103B2 (en) * 2006-09-13 2011-07-05 Samsung Electronics Co., Ltd. LCD signal transfer members

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4495377A (en) * 1982-12-30 1985-01-22 International Business Machines Corporation Substrate wiring patterns for connecting to integrated-circuit chips
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD320361S (en) * 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
US5091822A (en) * 1989-06-15 1992-02-25 Graphico Co., Ltd. Radial type of parallel system bus structure with printed, twisted conductor lines
US5210682A (en) * 1990-10-19 1993-05-11 Graphico Co., Ltd. Radial type of parallel system bus structure having pairs of conductor lines with impedance matching elements
US6310398B1 (en) * 1998-12-03 2001-10-30 Walter M. Katz Routable high-density interfaces for integrated circuit devices
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7974103B2 (en) * 2006-09-13 2011-07-05 Samsung Electronics Co., Ltd. LCD signal transfer members
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD588290S1 (en) * 2008-11-25 2009-03-10 Osram Sylvania Inc. Exterior vehicle lamp
USD610101S1 (en) * 2009-01-14 2010-02-16 Cisco Technology, Inc. Access point circuit receptacle
USD639755S1 (en) * 2010-01-20 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
USD639757S1 (en) * 2010-08-16 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
USD722031S1 (en) * 2013-12-31 2015-02-03 Celadon Systems, Inc. Top contact layout board in an electrical system
USD929198S1 (en) * 2019-09-16 2021-08-31 David Gysland Tungsten grinder
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

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