USD651628S1 - Thermal infrared imager

Info

Publication number: USD651628S1
Application number: US29/366,181
Authority: US
Inventors: Hao Wang
Original assignee: Hangzhou Mission Infrared Electro Optics Technology Co Ltd
Current assignee: Hangzhou Mission Infrared Electro Optics Technology Co Ltd
Priority date: 2010-01-21
Filing date: 2010-07-21
Publication date: 2012-01-03
Anticipated expiration: 2026-01-03

FIG. 1 is a front elevational view of the thermal infrared imager when it is in a closed position;

FIG. 2 is a rear elevational view of the thermal infrared imager when it is in a closed position;

FIG. 3 is a bottom plan view of the thermal infrared imager when it is in a closed position;

FIG. 4 is a top plan view of the thermal infrared imager when it is in a closed position;

FIG. 5 is a left side view of the thermal infrared imager when it is in a closed position;

FIG. 6 is a right side view of the thermal infrared imager when it is in a closed position;

FIG. 7 is a rear perspective view of the thermal infrared imager when it is in a closed position;

FIG. 8 is a right side view of the thermal infrared imager when it is in an open position;

FIG. 9 is a front elevational view of the thermal infrared imager when it is in an open position;

FIG. 10 is a rear elevational view of the thermal infrared imager when it is in an open position;

FIG. 11 is a top plan view of the thermal infrared imager when it is in an open position; and,

FIG. 12 is a bottom plan view of the thermal infrared imager when it is in an open position.

The broken lines form no part of the claimed design.

I claim the ornamental design for the thermal infrared imager, as shown and described.