USD616387S1 - Bridge rectifier package - Google Patents

Bridge rectifier package Download PDF

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Publication number
USD616387S1
USD616387S1 US29/321,381 US32138108F USD616387S US D616387 S1 USD616387 S1 US D616387S1 US 32138108 F US32138108 F US 32138108F US D616387 S USD616387 S US D616387S
Authority
US
United States
Prior art keywords
bridge rectifier
rectifier package
package
view
bridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/321,381
Inventor
Ta-Te Chou
Xiong-Jie Zhang
Xian Li
Hai Fu
Yong-Qi Tian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay General Semiconductor LLC
Original Assignee
Vishay General Semiconductor LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay General Semiconductor LLC filed Critical Vishay General Semiconductor LLC
Priority to US29/321,381 priority Critical patent/USD616387S1/en
Priority to US29/359,100 priority patent/USD654881S1/en
Application granted granted Critical
Publication of USD616387S1 publication Critical patent/USD616387S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top and left perspective view of the new bridge rectifier package showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a left of front view thereof;
FIG. 5 is a right of front view thereof;
FIG. 6 is a front view thereof; and,
FIG. 7 is a back view thereof.

Claims (1)

  1. The ornamental design for a new bridge rectifier package, as shown and described.
US29/321,381 2006-10-19 2008-07-15 Bridge rectifier package Expired - Lifetime USD616387S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/321,381 USD616387S1 (en) 2006-10-19 2008-07-15 Bridge rectifier package
US29/359,100 USD654881S1 (en) 2006-10-19 2010-04-06 Bridge rectifier package with heat sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/267,653 USD573116S1 (en) 2006-10-19 2006-10-19 Bridge rectifier package with heat sink
US29/321,381 USD616387S1 (en) 2006-10-19 2008-07-15 Bridge rectifier package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/267,653 Division USD573116S1 (en) 2006-10-19 2006-10-19 Bridge rectifier package with heat sink

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/359,100 Division USD654881S1 (en) 2006-10-19 2010-04-06 Bridge rectifier package with heat sink

Publications (1)

Publication Number Publication Date
USD616387S1 true USD616387S1 (en) 2010-05-25

Family

ID=39597057

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/267,653 Expired - Lifetime USD573116S1 (en) 2006-10-19 2006-10-19 Bridge rectifier package with heat sink
US29/321,381 Expired - Lifetime USD616387S1 (en) 2006-10-19 2008-07-15 Bridge rectifier package
US29/359,100 Expired - Lifetime USD654881S1 (en) 2006-10-19 2010-04-06 Bridge rectifier package with heat sink

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/267,653 Expired - Lifetime USD573116S1 (en) 2006-10-19 2006-10-19 Bridge rectifier package with heat sink

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/359,100 Expired - Lifetime USD654881S1 (en) 2006-10-19 2010-04-06 Bridge rectifier package with heat sink

Country Status (2)

Country Link
US (3) USD573116S1 (en)
TW (4) TWD134144S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD654881S1 (en) * 2006-10-19 2012-02-28 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
US11555831B2 (en) 2020-08-20 2023-01-17 Vishay Dale Electronics, Llc Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD692377S1 (en) * 2012-12-04 2013-10-29 Remy Technologies, Llc Mosfet rectifier bridge power pack
USD954666S1 (en) * 2019-05-03 2022-06-14 Lumileds Holding B.V. Flexible circuit board
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503452A (en) * 1981-05-18 1985-03-05 Matsushita Electronics Corporation Plastic encapsulated semiconductor device and method for manufacturing the same
US4803545A (en) * 1988-03-17 1989-02-07 Motorola, Inc. Self-fixturing heat sink
US4827329A (en) * 1985-10-05 1989-05-02 Telefunken Electronic Gmbh Semiconductor array
US5450284A (en) * 1994-02-17 1995-09-12 Spacelabs Medical, Inc. Heat sink and transistor retaining assembly
US5886400A (en) * 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6362517B1 (en) * 1999-09-22 2002-03-26 Michael Ray Bell High voltage package for electronic device
US6476481B2 (en) * 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
US20040145037A1 (en) * 2003-01-24 2004-07-29 Niko Semiconductor Co., Ltd. Power semiconductor able of fast heat sinking
US6828170B2 (en) * 1999-03-15 2004-12-07 Gentex Corporation Method of making a semiconductor radiation emitter package
US6891256B2 (en) * 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US20050145998A1 (en) * 2001-05-15 2005-07-07 Gem Services, Inc. Surface mount package
US20060001133A1 (en) * 2003-03-20 2006-01-05 Mcgarvey Brian Optical sub-assembly for a transceiver
US20060033122A1 (en) * 2004-08-11 2006-02-16 Mark Pavier Half-bridge package
US7095099B2 (en) * 2003-11-12 2006-08-22 International Rectifier Corporation Low profile package having multiple die
US20060255362A1 (en) * 2005-04-22 2006-11-16 Ralf Otremba Semiconductor Component in a Standard Housing and Method for the Production Thereof
US20070012947A1 (en) * 2002-07-15 2007-01-18 International Rectifier Corporation Direct FET device for high frequency application
US20070063212A1 (en) * 2003-10-15 2007-03-22 Sanyo Electric Co., Ltd. Semiconductor laser device and manufacturing method thereof
USD573116S1 (en) * 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
US7586179B2 (en) * 2007-10-09 2009-09-08 Fairchild Semiconductor Corporation Wireless semiconductor package for efficient heat dissipation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201011655Y (en) * 2007-01-10 2008-01-23 上海凯虹科技电子有限公司 A frame of a high-power semiconductor device

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503452A (en) * 1981-05-18 1985-03-05 Matsushita Electronics Corporation Plastic encapsulated semiconductor device and method for manufacturing the same
US4827329A (en) * 1985-10-05 1989-05-02 Telefunken Electronic Gmbh Semiconductor array
US4803545A (en) * 1988-03-17 1989-02-07 Motorola, Inc. Self-fixturing heat sink
US5450284A (en) * 1994-02-17 1995-09-12 Spacelabs Medical, Inc. Heat sink and transistor retaining assembly
US5886400A (en) * 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
US6476481B2 (en) * 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6828170B2 (en) * 1999-03-15 2004-12-07 Gentex Corporation Method of making a semiconductor radiation emitter package
US6362517B1 (en) * 1999-09-22 2002-03-26 Michael Ray Bell High voltage package for electronic device
US20050145998A1 (en) * 2001-05-15 2005-07-07 Gem Services, Inc. Surface mount package
US6891256B2 (en) * 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US20070012947A1 (en) * 2002-07-15 2007-01-18 International Rectifier Corporation Direct FET device for high frequency application
US20040145037A1 (en) * 2003-01-24 2004-07-29 Niko Semiconductor Co., Ltd. Power semiconductor able of fast heat sinking
US20060001133A1 (en) * 2003-03-20 2006-01-05 Mcgarvey Brian Optical sub-assembly for a transceiver
US20070063212A1 (en) * 2003-10-15 2007-03-22 Sanyo Electric Co., Ltd. Semiconductor laser device and manufacturing method thereof
US7095099B2 (en) * 2003-11-12 2006-08-22 International Rectifier Corporation Low profile package having multiple die
US20060033122A1 (en) * 2004-08-11 2006-02-16 Mark Pavier Half-bridge package
US20060255362A1 (en) * 2005-04-22 2006-11-16 Ralf Otremba Semiconductor Component in a Standard Housing and Method for the Production Thereof
USD573116S1 (en) * 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
US7586179B2 (en) * 2007-10-09 2009-09-08 Fairchild Semiconductor Corporation Wireless semiconductor package for efficient heat dissipation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD654881S1 (en) * 2006-10-19 2012-02-28 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
US11555831B2 (en) 2020-08-20 2023-01-17 Vishay Dale Electronics, Llc Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making
US12196783B2 (en) 2020-08-20 2025-01-14 Vishay Dale Electronics, Llc Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making

Also Published As

Publication number Publication date
TWD134143S1 (en) 2010-04-01
USD573116S1 (en) 2008-07-15
TWD138337S1 (en) 2010-12-21
TWD134144S1 (en) 2010-04-01
TWD132656S1 (en) 2009-12-21
USD654881S1 (en) 2012-02-28

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