USD611014S1 - Circuit board module - Google Patents
Circuit board module Download PDFInfo
- Publication number
- USD611014S1 USD611014S1 US29/319,715 US31971508F USD611014S US D611014 S1 USD611014 S1 US D611014S1 US 31971508 F US31971508 F US 31971508F US D611014 S USD611014 S US D611014S
- Authority
- US
- United States
- Prior art keywords
- circuit board
- board module
- module
- ornamental design
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
Claims (1)
- The ornamental design for a circuit board module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/319,715 USD611014S1 (en) | 2008-06-13 | 2008-06-13 | Circuit board module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/319,715 USD611014S1 (en) | 2008-06-13 | 2008-06-13 | Circuit board module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD611014S1 true USD611014S1 (en) | 2010-03-02 |
Family
ID=41718011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/319,715 Expired - Lifetime USD611014S1 (en) | 2008-06-13 | 2008-06-13 | Circuit board module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD611014S1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD794586S1 (en) * | 2015-11-12 | 2017-08-15 | Mitsubishi Electric Corporation | Circuit board |
US9780465B1 (en) * | 2016-09-20 | 2017-10-03 | Northrop Grumman Systems Corporation | Angled circuit board connector |
USD799438S1 (en) * | 2015-11-12 | 2017-10-10 | Mitsubishi Electric Corporation | Circuit board |
US10276504B2 (en) | 2017-05-17 | 2019-04-30 | Northrop Grumman Systems Corporation | Preclean and deposition methodology for superconductor interconnects |
US11380461B2 (en) | 2019-07-02 | 2022-07-05 | Northrop Grumman Systems Corporation | Superconducting flexible interconnecting cable connector |
-
2008
- 2008-06-13 US US29/319,715 patent/USD611014S1/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD794586S1 (en) * | 2015-11-12 | 2017-08-15 | Mitsubishi Electric Corporation | Circuit board |
USD799438S1 (en) * | 2015-11-12 | 2017-10-10 | Mitsubishi Electric Corporation | Circuit board |
US9780465B1 (en) * | 2016-09-20 | 2017-10-03 | Northrop Grumman Systems Corporation | Angled circuit board connector |
US10276504B2 (en) | 2017-05-17 | 2019-04-30 | Northrop Grumman Systems Corporation | Preclean and deposition methodology for superconductor interconnects |
US11380461B2 (en) | 2019-07-02 | 2022-07-05 | Northrop Grumman Systems Corporation | Superconducting flexible interconnecting cable connector |
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