USD583779S1 - Electrolytic plating anode - Google Patents

Electrolytic plating anode Download PDF

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Publication number
USD583779S1
USD583779S1 US29/262,881 US26288106F USD583779S US D583779 S1 USD583779 S1 US D583779S1 US 26288106 F US26288106 F US 26288106F US D583779 S USD583779 S US D583779S
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US
United States
Prior art keywords
electrolytic plating
plating anode
anode
view
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/262,881
Inventor
Fumio Kuriyama
Masaaki Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US29/262,881 priority Critical patent/USD583779S1/en
Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIMURA, MASAAKI, KURIYAMA, FUMIO
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Publication of USD583779S1 publication Critical patent/USD583779S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

The claimed electrolytic plating anode is used to perform an electrolytic plating process in a plating bath when a voltage is applied via an anode shaft connected to the electrolytic plating anode.
FIG. 1 is a front elevation view of an electrolytic plating anode;
FIG. 2 is a rear view of the electrolytic plating anode shown in FIG. 1;
FIG. 3 is a top plan view of the electrolytic plating anode shown in FIG. 1, wherein the broken lines form no part of the claimed design;
FIG. 4 is a bottom plan view of the electrolytic plating anode shown in FIG. 1;
FIG. 5 is a right side view of the electrolytic plating anode shown in FIG. 1; and,
FIG. 6 is a left side view of the electrolytic plating anode shown in FIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for an electrolytic plating anode, as shown and described.
US29/262,881 2006-07-13 2006-07-13 Electrolytic plating anode Expired - Lifetime USD583779S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/262,881 USD583779S1 (en) 2006-07-13 2006-07-13 Electrolytic plating anode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/262,881 USD583779S1 (en) 2006-07-13 2006-07-13 Electrolytic plating anode

Publications (1)

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USD583779S1 true USD583779S1 (en) 2008-12-30

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US29/262,881 Expired - Lifetime USD583779S1 (en) 2006-07-13 2006-07-13 Electrolytic plating anode

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD886739S1 (en) * 2019-01-04 2020-06-09 Libest Inc. Electrode plate
USD925532S1 (en) * 2018-11-13 2021-07-20 Smk Corporation Touch panel
USD957357S1 (en) * 2021-03-15 2022-07-12 Christopher L. Moore Cap for an anode assembly

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203127A (en) * 1977-07-18 1980-05-13 Motorola, Inc. Package and method of packaging semiconductor wafers
US5429733A (en) * 1992-05-21 1995-07-04 Electroplating Engineers Of Japan, Ltd. Plating device for wafer
US5537042A (en) * 1994-11-18 1996-07-16 Eldec Corporation Method and system for unobtrusively measuring physical properties in electrochemical processes
US5657198A (en) * 1995-10-11 1997-08-12 Flener; Jeff M. Canister for surface mount electronic components
US5869196A (en) * 1996-12-20 1999-02-09 Composite Material Technology, Inc. Constrained filament electrolytic anode and process of fabrication
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6071388A (en) * 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6251238B1 (en) * 1999-07-07 2001-06-26 Technic Inc. Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance
US6309523B1 (en) * 1997-04-02 2001-10-30 Eltech Systems Corporation Electrode and electrolytic cell containing same
US6365020B1 (en) 1998-01-12 2002-04-02 Ebara Corporation Wafer plating jig
US6383352B1 (en) * 1998-11-13 2002-05-07 Mykrolis Corporation Spiral anode for metal plating baths
US20020112953A1 (en) * 2001-02-21 2002-08-22 Kohut Stephen J. Anode for plating a semiconductor wafer
US6471847B2 (en) * 1999-03-30 2002-10-29 Nutool, Inc. Method for forming an electrical contact with a semiconductor substrate
US6613200B2 (en) * 2001-01-26 2003-09-02 Applied Materials, Inc. Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
US20030221956A1 (en) * 2002-05-28 2003-12-04 Applied Materials, Inc. Anode slime reduction method while maintaining low current
US6716332B1 (en) 1998-11-09 2004-04-06 Ebara Corporation Plating method and apparatus
US20040231978A1 (en) * 2001-09-19 2004-11-25 White Tamara L Electrode attachment to anode assembly
US20050029641A1 (en) * 2003-07-28 2005-02-10 Sanyo Electric Co., Ltd. Semiconductor device and manufacturing method of the same
US20060124454A1 (en) * 2002-12-23 2006-06-15 Metakem Gesellschaft Fur Schichtchemie Der Metalle Mbh Anode used for electroplating
US7223323B2 (en) * 2002-07-24 2007-05-29 Applied Materials, Inc. Multi-chemistry plating system
US20080017505A1 (en) * 2006-07-21 2008-01-24 Fumio Kuriyama Anode holder

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203127A (en) * 1977-07-18 1980-05-13 Motorola, Inc. Package and method of packaging semiconductor wafers
US5429733A (en) * 1992-05-21 1995-07-04 Electroplating Engineers Of Japan, Ltd. Plating device for wafer
US5537042A (en) * 1994-11-18 1996-07-16 Eldec Corporation Method and system for unobtrusively measuring physical properties in electrochemical processes
US5657198A (en) * 1995-10-11 1997-08-12 Flener; Jeff M. Canister for surface mount electronic components
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US5869196A (en) * 1996-12-20 1999-02-09 Composite Material Technology, Inc. Constrained filament electrolytic anode and process of fabrication
US6309523B1 (en) * 1997-04-02 2001-10-30 Eltech Systems Corporation Electrode and electrolytic cell containing same
US6365020B1 (en) 1998-01-12 2002-04-02 Ebara Corporation Wafer plating jig
US6071388A (en) * 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6716332B1 (en) 1998-11-09 2004-04-06 Ebara Corporation Plating method and apparatus
US6383352B1 (en) * 1998-11-13 2002-05-07 Mykrolis Corporation Spiral anode for metal plating baths
US6471847B2 (en) * 1999-03-30 2002-10-29 Nutool, Inc. Method for forming an electrical contact with a semiconductor substrate
US6251238B1 (en) * 1999-07-07 2001-06-26 Technic Inc. Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance
US6613200B2 (en) * 2001-01-26 2003-09-02 Applied Materials, Inc. Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
US20020112953A1 (en) * 2001-02-21 2002-08-22 Kohut Stephen J. Anode for plating a semiconductor wafer
US20040231978A1 (en) * 2001-09-19 2004-11-25 White Tamara L Electrode attachment to anode assembly
US20030221956A1 (en) * 2002-05-28 2003-12-04 Applied Materials, Inc. Anode slime reduction method while maintaining low current
US7223323B2 (en) * 2002-07-24 2007-05-29 Applied Materials, Inc. Multi-chemistry plating system
US20060124454A1 (en) * 2002-12-23 2006-06-15 Metakem Gesellschaft Fur Schichtchemie Der Metalle Mbh Anode used for electroplating
US20050029641A1 (en) * 2003-07-28 2005-02-10 Sanyo Electric Co., Ltd. Semiconductor device and manufacturing method of the same
US20080017505A1 (en) * 2006-07-21 2008-01-24 Fumio Kuriyama Anode holder

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD925532S1 (en) * 2018-11-13 2021-07-20 Smk Corporation Touch panel
USD886739S1 (en) * 2019-01-04 2020-06-09 Libest Inc. Electrode plate
USD957357S1 (en) * 2021-03-15 2022-07-12 Christopher L. Moore Cap for an anode assembly

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