USD563327S1 - Resin-packaged optical communication module - Google Patents

Description

FIG. 1 is a front elevation of a resin-packaged optical communication module showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a rear elevation thereof;

FIG. 5 is a left side elevation thereof;

FIG. 6 is a right side elevation thereof; and,

FIG. 7 is a cross-section thereof taken along line 7—7 in FIG. 2.

Claims (1)

1. The ornamental design for a resin-packaged optical communication module, as shown and described.

Images