USD541229S1 - Electronic component cooling apparatus - Google Patents

Electronic component cooling apparatus Download PDF

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Publication number
USD541229S1
USD541229S1 US29/216,926 US21692604F USD541229S US D541229 S1 USD541229 S1 US D541229S1 US 21692604 F US21692604 F US 21692604F US D541229 S USD541229 S US D541229S
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US
United States
Prior art keywords
cooling apparatus
electronic component
component cooling
view
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/216,926
Inventor
Michinori Watanabe
Toshiki Ogawara
Haruhisa Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Denki Co Ltd
Original Assignee
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Denki Co Ltd filed Critical Sanyo Denki Co Ltd
Assigned to SANYO DENKI CO. LTD. reassignment SANYO DENKI CO. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MARUYAMA, HARUHISA, OGAWARA, TOSHIKI, WATANABE, MICHINORI
Priority to US29/249,884 priority Critical patent/USD563910S1/en
Priority to US29/249,886 priority patent/USD570301S1/en
Application granted granted Critical
Publication of USD541229S1 publication Critical patent/USD541229S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevation view of a first embodiment of an electronic component cooling apparatus showing our new design;
FIG. 2 is a rear elevation view of the first embodiment of the cooling apparatus;
FIG. 3 is a right side elevation view of the first embodiment of the cooling apparatus;
FIG. 4 is a left side elevation view of the first embodiment of the cooling apparatus;
FIG. 5 is a top plan view of the first embodiment of the cooling apparatus;
FIG. 6 is a bottom plan view of the first embodiment of the cooling apparatus;
FIG. 7 is a top plan reference view of the first embodiment of the cooling apparatus;
FIG. 8 is a longitudinal cross sectional view of the first embodiment of the cooling apparatus;
FIG. 9 is a perspective view of the first embodiment of the cooling apparatus;
FIG. 10 is a front elevation view of a second embodiment of an electronic component cooling apparatus showing our new design;
FIG. 11 is a rear elevation view of the second embodiment of the cooling apparatus;
FIG. 12 is a right side elevation view of the second embodiment of the cooling apparatus;
FIG. 13 is a left side elevation view of the second embodiment of the cooling apparatus;
FIG. 14 is a top plan view of the second embodiment of the cooling apparatus;
FIG. 15 is a bottom plan view of the second embodiment of the cooling apparatus;
FIG. 16 is a top plan reference view of the second embodiment of the cooling apparatus;
FIG. 17 is a longitudinal cross sectional view of the second embodiment of the cooling apparatus taken along line 17—17 in FIG. 16; and,
FIG. 18 is a perspective view of the third embodiment of the cooling apparatus.

Claims (1)

  1. The ornamental design for an electronic component cooling apparatus, as shown and described.
US29/216,926 2004-05-13 2004-11-10 Electronic component cooling apparatus Expired - Lifetime USD541229S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/249,884 USD563910S1 (en) 2004-05-13 2006-10-25 Electronic component cooling apparatus
US29/249,886 USD570301S1 (en) 2004-05-13 2006-10-25 Electronic component cooling apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004014192 2004-05-13
JP2004014193 2004-05-13
JP2004014194 2004-05-13
JP2004014195 2004-05-13

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29/249,884 Division USD563910S1 (en) 2004-05-13 2006-10-25 Electronic component cooling apparatus
US29/249,886 Division USD570301S1 (en) 2004-05-13 2006-10-25 Electronic component cooling apparatus

Publications (1)

Publication Number Publication Date
USD541229S1 true USD541229S1 (en) 2007-04-24

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
US29/216,926 Expired - Lifetime USD541229S1 (en) 2004-05-13 2004-11-10 Electronic component cooling apparatus
US29/249,884 Expired - Lifetime USD563910S1 (en) 2004-05-13 2006-10-25 Electronic component cooling apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/249,884 Expired - Lifetime USD563910S1 (en) 2004-05-13 2006-10-25 Electronic component cooling apparatus

Country Status (1)

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US (2) USD541229S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080156461A1 (en) * 2006-12-28 2008-07-03 Nidec Corporation Heat sink fan
US20080180912A1 (en) * 2007-01-15 2008-07-31 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080156461A1 (en) * 2006-12-28 2008-07-03 Nidec Corporation Heat sink fan
US8210241B2 (en) 2006-12-28 2012-07-03 Nidec Corporation Heat sink fan
US20080180912A1 (en) * 2007-01-15 2008-07-31 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
US8256258B2 (en) 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method

Also Published As

Publication number Publication date
USD563910S1 (en) 2008-03-11

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