USD511326S1 - Electronic component cooling apparatus - Google Patents
Electronic component cooling apparatus Download PDFInfo
- Publication number
- USD511326S1 USD511326S1 US29/196,215 US19621503F USD511326S US D511326 S1 USD511326 S1 US D511326S1 US 19621503 F US19621503 F US 19621503F US D511326 S USD511326 S US D511326S
- Authority
- US
- United States
- Prior art keywords
- electronic component
- cooling apparatus
- component cooling
- view
- side elevation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front side elevation view.
FIG. 2 is a rear side elevation view.
FIG. 3 is a right side elevation view.
FIG. 4 is a left side elevation view.
FIG. 5 is a top plan view.
FIG. 6 is a bottom plan view; and,
FIG. 7 is a perspective view.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Claims (1)
- The ornamental design for an electronic component cooling apparatus, as shown and described.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003018125 | 2003-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD511326S1 true USD511326S1 (en) | 2005-11-08 |
Family
ID=35207274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/196,215 Expired - Lifetime USD511326S1 (en) | 2003-06-25 | 2003-12-23 | Electronic component cooling apparatus |
Country Status (1)
Country | Link |
---|---|
US (1) | USD511326S1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050103471A1 (en) * | 2003-11-14 | 2005-05-19 | Chun-Chi Chen | Heat sink |
US20060198105A1 (en) * | 2002-06-06 | 2006-09-07 | Raytheon Company | Method and Apparatus for Cooling a Circuit Component |
US20070242433A1 (en) * | 2006-04-14 | 2007-10-18 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US20080180912A1 (en) * | 2007-01-15 | 2008-07-31 | Nidec Corporation | Radiator, heat sink fan, and radiator manufacturing method |
USD778853S1 (en) * | 2013-08-06 | 2017-02-14 | Phoenix Contact Gmbh & Co. Kg | Housing for electrical or electronic component |
-
2003
- 2003-12-23 US US29/196,215 patent/USD511326S1/en not_active Expired - Lifetime
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060198105A1 (en) * | 2002-06-06 | 2006-09-07 | Raytheon Company | Method and Apparatus for Cooling a Circuit Component |
US8665595B2 (en) * | 2002-06-06 | 2014-03-04 | Ol Security Limited Liability Company | Method and apparatus for cooling a circuit component |
US20050103471A1 (en) * | 2003-11-14 | 2005-05-19 | Chun-Chi Chen | Heat sink |
US7152666B2 (en) * | 2003-11-14 | 2006-12-26 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat sink |
US20070242433A1 (en) * | 2006-04-14 | 2007-10-18 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US7532472B2 (en) * | 2006-04-14 | 2009-05-12 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
US20080180912A1 (en) * | 2007-01-15 | 2008-07-31 | Nidec Corporation | Radiator, heat sink fan, and radiator manufacturing method |
US8256258B2 (en) | 2007-01-15 | 2012-09-04 | Nidec Corporation | Radiator, heat sink fan, and radiator manufacturing method |
USD778853S1 (en) * | 2013-08-06 | 2017-02-14 | Phoenix Contact Gmbh & Co. Kg | Housing for electrical or electronic component |
USD796460S1 (en) | 2013-08-06 | 2017-09-05 | Phoenix Contact Gmbh & Co. Kg | Housing for electrical or electronic component |
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