USD511326S1 - Electronic component cooling apparatus - Google Patents

Electronic component cooling apparatus Download PDF

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Publication number
USD511326S1
USD511326S1 US29/196,215 US19621503F USD511326S US D511326 S1 USD511326 S1 US D511326S1 US 19621503 F US19621503 F US 19621503F US D511326 S USD511326 S US D511326S
Authority
US
United States
Prior art keywords
electronic component
cooling apparatus
component cooling
view
side elevation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/196,215
Inventor
Michinori Watanabe
Toshiki Ogawara
Masayuki Iijima
Haruhisa Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Denki Co Ltd
Original Assignee
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Denki Co Ltd filed Critical Sanyo Denki Co Ltd
Assigned to SANYO DENKI CO., LTD. reassignment SANYO DENKI CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IIJIMA, MASAYUKI, MARUYAMA, HARUHISA, OGAWARA, TOSHIKI, WATANABE, MICHINORI
Application granted granted Critical
Publication of USD511326S1 publication Critical patent/USD511326S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front side elevation view.
FIG. 2 is a rear side elevation view.
FIG. 3 is a right side elevation view.
FIG. 4 is a left side elevation view.
FIG. 5 is a top plan view.
FIG. 6 is a bottom plan view; and,
FIG. 7 is a perspective view.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for an electronic component cooling apparatus, as shown and described.
US29/196,215 2003-06-25 2003-12-23 Electronic component cooling apparatus Expired - Lifetime USD511326S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003018125 2003-06-25

Publications (1)

Publication Number Publication Date
USD511326S1 true USD511326S1 (en) 2005-11-08

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ID=35207274

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/196,215 Expired - Lifetime USD511326S1 (en) 2003-06-25 2003-12-23 Electronic component cooling apparatus

Country Status (1)

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US (1) USD511326S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050103471A1 (en) * 2003-11-14 2005-05-19 Chun-Chi Chen Heat sink
US20060198105A1 (en) * 2002-06-06 2006-09-07 Raytheon Company Method and Apparatus for Cooling a Circuit Component
US20070242433A1 (en) * 2006-04-14 2007-10-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20080180912A1 (en) * 2007-01-15 2008-07-31 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
USD778853S1 (en) * 2013-08-06 2017-02-14 Phoenix Contact Gmbh & Co. Kg Housing for electrical or electronic component

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060198105A1 (en) * 2002-06-06 2006-09-07 Raytheon Company Method and Apparatus for Cooling a Circuit Component
US8665595B2 (en) * 2002-06-06 2014-03-04 Ol Security Limited Liability Company Method and apparatus for cooling a circuit component
US20050103471A1 (en) * 2003-11-14 2005-05-19 Chun-Chi Chen Heat sink
US7152666B2 (en) * 2003-11-14 2006-12-26 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink
US20070242433A1 (en) * 2006-04-14 2007-10-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7532472B2 (en) * 2006-04-14 2009-05-12 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20080180912A1 (en) * 2007-01-15 2008-07-31 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
US8256258B2 (en) 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
USD778853S1 (en) * 2013-08-06 2017-02-14 Phoenix Contact Gmbh & Co. Kg Housing for electrical or electronic component
USD796460S1 (en) 2013-08-06 2017-09-05 Phoenix Contact Gmbh & Co. Kg Housing for electrical or electronic component

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