USD507545S1 - Semiconductor carrier - Google Patents

Semiconductor carrier Download PDF

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Publication number
USD507545S1
USD507545S1 US29/211,532 US21153204F USD507545S US D507545 S1 USD507545 S1 US D507545S1 US 21153204 F US21153204 F US 21153204F US D507545 S USD507545 S US D507545S
Authority
US
United States
Prior art keywords
semiconductor carrier
semiconductor
carrier
view
new design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/211,532
Inventor
Yuji Nakamura
Katsumi Suzuki
Takahiro Ishibashi
Eiji Kobori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Assigned to YAMAICHI ELECTRONICS CO. LTD. reassignment YAMAICHI ELECTRONICS CO. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHIBASHI, TAKAHIRO, NAKAMURA, YIJI, KOBORI, EIJI, SUZUKI, KATSUMI
Priority to US29/229,567 priority Critical patent/USD516046S1/en
Priority to US29/229,566 priority patent/USD516528S1/en
Application granted granted Critical
Publication of USD507545S1 publication Critical patent/USD507545S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of a semiconductor carrier showing our new design, the back view being a mirror image thereof;
FIG. 2 is a top view of our new design;
FIG. 3 is a bottom view of our new design;
FIG. 4 is a right-side view of our new design;
FIG. 5 is a left-side view of our new design; and,
FIG. 6 is a left-front perspective view of our new design.

Claims (1)

  1. The ornamental design for the semiconductor carrier, as shown and described.
US29/211,532 2004-02-20 2004-08-18 Semiconductor carrier Expired - Lifetime USD507545S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/229,567 USD516046S1 (en) 2004-02-20 2005-05-10 Base for a semiconductor carrier
US29/229,566 USD516528S1 (en) 2004-02-20 2005-05-10 Cover for a semiconductor carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004004834 2004-02-20
JP2004-004834 2004-02-20

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29/229,567 Division USD516046S1 (en) 2004-02-20 2005-05-10 Base for a semiconductor carrier
US29/229,566 Division USD516528S1 (en) 2004-02-20 2005-05-10 Cover for a semiconductor carrier

Publications (1)

Publication Number Publication Date
USD507545S1 true USD507545S1 (en) 2005-07-19

Family

ID=34737212

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/211,532 Expired - Lifetime USD507545S1 (en) 2004-02-20 2004-08-18 Semiconductor carrier
US29/229,567 Expired - Lifetime USD516046S1 (en) 2004-02-20 2005-05-10 Base for a semiconductor carrier

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/229,567 Expired - Lifetime USD516046S1 (en) 2004-02-20 2005-05-10 Base for a semiconductor carrier

Country Status (1)

Country Link
US (2) USD507545S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD1049066S1 (en) * 2022-02-28 2024-10-29 Syskey Technology Co., Ltd. Base for a multi-chamber semiconductor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5451165A (en) * 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
US5541525A (en) * 1991-06-04 1996-07-30 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US20010043074A1 (en) * 1998-08-28 2001-11-22 David R. Hembree Test carrier with molded interconnect for testing semiconductor components
US20040016993A1 (en) * 2002-07-24 2004-01-29 Mirae Corporation Test tray with carrier modules for a semiconductor device handler

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
US5541525A (en) * 1991-06-04 1996-07-30 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5451165A (en) * 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US20010043074A1 (en) * 1998-08-28 2001-11-22 David R. Hembree Test carrier with molded interconnect for testing semiconductor components
US20040016993A1 (en) * 2002-07-24 2004-01-29 Mirae Corporation Test tray with carrier modules for a semiconductor device handler

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD1049066S1 (en) * 2022-02-28 2024-10-29 Syskey Technology Co., Ltd. Base for a multi-chamber semiconductor

Also Published As

Publication number Publication date
USD516046S1 (en) 2006-02-28

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