USD507248S1 - Semiconductor carrier - Google Patents

Semiconductor carrier Download PDF

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Publication number
USD507248S1
USD507248S1 US29/210,045 US21004504F USD507248S US D507248 S1 USD507248 S1 US D507248S1 US 21004504 F US21004504 F US 21004504F US D507248 S USD507248 S US D507248S
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US
United States
Prior art keywords
semiconductor carrier
semiconductor
carrier
new design
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/210,045
Inventor
Minoru Hisaishi
Noriyuki Matsuoka
Takeyuki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Priority to US29/210,045 priority Critical patent/USD507248S1/en
Assigned to YAMAICHI ELECTRONICS CO., LTD. reassignment YAMAICHI ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HISAISHI, MINORU, MATSUOKA, NORIYUKI, SUZUKI, TAKEYUKI
Priority to US29/231,789 priority patent/USD525215S1/en
Priority to US29/231,788 priority patent/USD518798S1/en
Application granted granted Critical
Publication of USD507248S1 publication Critical patent/USD507248S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a semiconductor carrier of our new design in its entirety;
FIG. 2 is a bottom plan view of our new design;
FIG. 3 is a right end view of our new design;
FIG. 4 is a left end view of our new design;
FIG. 5 is a front view of our new design;
FIG. 6 is a rear view our new design; and,
FIG. 7 is a left, front perspective view of our new design.

Claims (1)

  1. The ornamental design for a semiconductor carrier, as shown and described.
US29/210,045 2004-01-27 2004-07-27 Semiconductor carrier Expired - Lifetime USD507248S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/210,045 USD507248S1 (en) 2004-07-27 2004-07-27 Semiconductor carrier
US29/231,789 USD525215S1 (en) 2004-01-27 2005-06-10 Base for a semiconductor carrier
US29/231,788 USD518798S1 (en) 2004-07-27 2005-06-10 Cover for a semiconductor carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/210,045 USD507248S1 (en) 2004-07-27 2004-07-27 Semiconductor carrier

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29/231,789 Continuation-In-Part USD525215S1 (en) 2004-01-27 2005-06-10 Base for a semiconductor carrier
US29/231,788 Division USD518798S1 (en) 2004-07-27 2005-06-10 Cover for a semiconductor carrier

Publications (1)

Publication Number Publication Date
USD507248S1 true USD507248S1 (en) 2005-07-12

Family

ID=34709916

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/210,045 Expired - Lifetime USD507248S1 (en) 2004-01-27 2004-07-27 Semiconductor carrier
US29/231,788 Expired - Lifetime USD518798S1 (en) 2004-07-27 2005-06-10 Cover for a semiconductor carrier

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/231,788 Expired - Lifetime USD518798S1 (en) 2004-07-27 2005-06-10 Cover for a semiconductor carrier

Country Status (1)

Country Link
US (2) USD507248S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD539275S1 (en) * 2005-08-12 2007-03-27 Mitsumi Electric Co., Ltd. Wireless module
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD1049066S1 (en) * 2022-02-28 2024-10-29 Syskey Technology Co., Ltd. Base for a multi-chamber semiconductor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5451165A (en) * 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
US5541525A (en) * 1991-06-04 1996-07-30 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US20010043074A1 (en) * 1998-08-28 2001-11-22 David R. Hembree Test carrier with molded interconnect for testing semiconductor components
US20040016993A1 (en) * 2002-07-24 2004-01-29 Mirae Corporation Test tray with carrier modules for a semiconductor device handler

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
US5541525A (en) * 1991-06-04 1996-07-30 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5451165A (en) * 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US20010043074A1 (en) * 1998-08-28 2001-11-22 David R. Hembree Test carrier with molded interconnect for testing semiconductor components
US20040016993A1 (en) * 2002-07-24 2004-01-29 Mirae Corporation Test tray with carrier modules for a semiconductor device handler

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD539275S1 (en) * 2005-08-12 2007-03-27 Mitsumi Electric Co., Ltd. Wireless module
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD1049066S1 (en) * 2022-02-28 2024-10-29 Syskey Technology Co., Ltd. Base for a multi-chamber semiconductor

Also Published As

Publication number Publication date
USD518798S1 (en) 2006-04-11

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