USD474214S1 - Tool for dispensing adhesives, sealants, and underfill materials - Google Patents
Tool for dispensing adhesives, sealants, and underfill materials Download PDFInfo
- Publication number
- USD474214S1 USD474214S1 US29/162,410 US16241002F USD474214S US D474214 S1 USD474214 S1 US D474214S1 US 16241002 F US16241002 F US 16241002F US D474214 S USD474214 S US D474214S
- Authority
- US
- United States
- Prior art keywords
- tool
- sealants
- underfill materials
- dispensing adhesives
- adhesives
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is an elevational view of a first end for the new design for a tool for dispensing adhesives, sealants, and underfill material;
FIG. 2 is a top plan view of the tool as shown in FIG. 1;
FIG. 3 is a bottom view;
FIG. 4 is a right side elevational view wherein the left elevational view is a mirror image; and,
FIG. 5 is a rear elevational view.
Claims (1)
- The ornamental design for a tool for dispensing adhesives, sealants, and underfill materials, as shown and described.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/162,410 USD474214S1 (en) | 2002-06-14 | 2002-06-14 | Tool for dispensing adhesives, sealants, and underfill materials |
| JP2003512021A JP2005514760A (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
| US10/483,128 US20040241262A1 (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
| KR10-2004-7000237A KR20040017281A (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
| CNA028137981A CN1525910A (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
| PCT/US2002/021458 WO2003006230A1 (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/162,410 USD474214S1 (en) | 2002-06-14 | 2002-06-14 | Tool for dispensing adhesives, sealants, and underfill materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD474214S1 true USD474214S1 (en) | 2003-05-06 |
Family
ID=22585493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/162,410 Expired - Lifetime USD474214S1 (en) | 2001-07-09 | 2002-06-14 | Tool for dispensing adhesives, sealants, and underfill materials |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD474214S1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040241262A1 (en) * | 2001-07-09 | 2004-12-02 | Brett Huey | Method and apparatus for underfilling electronic components using vacuum assist |
| US8956923B2 (en) | 2012-06-18 | 2015-02-17 | Samsung Electronics Co., Ltd. | Methods of fabricating semiconductor devices and underfill equipment for the same |
| USD824968S1 (en) * | 2016-10-30 | 2018-08-07 | Nordson Corporation | Hot melt dispenser |
-
2002
- 2002-06-14 US US29/162,410 patent/USD474214S1/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040241262A1 (en) * | 2001-07-09 | 2004-12-02 | Brett Huey | Method and apparatus for underfilling electronic components using vacuum assist |
| US8956923B2 (en) | 2012-06-18 | 2015-02-17 | Samsung Electronics Co., Ltd. | Methods of fabricating semiconductor devices and underfill equipment for the same |
| USD824968S1 (en) * | 2016-10-30 | 2018-08-07 | Nordson Corporation | Hot melt dispenser |
| USD851694S1 (en) | 2016-10-30 | 2019-06-18 | Nordson Corporation | Hot melt dispenser |
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