USD461172S1 - Surface mount package - Google Patents

Surface mount package Download PDF

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Publication number
USD461172S1
USD461172S1 US29/145,236 US14523601F USD461172S US D461172 S1 USD461172 S1 US D461172S1 US 14523601 F US14523601 F US 14523601F US D461172 S USD461172 S US D461172S
Authority
US
United States
Prior art keywords
surface mount
mount package
package
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/145,236
Inventor
James Harnden
Richard K. Williams
Anthony Chia
Chu Weibing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
Original Assignee
GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/145,236 priority Critical patent/USD461172S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIA, ANTHONY, WEIBING, CHU, WILLIAMS, RICHARD K., HARNDEN, JAMES
Application granted granted Critical
Publication of USD461172S1 publication Critical patent/USD461172S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a surface mount package showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof:
FIG. 4 is a front elevational view thereof:
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 the right side elevational view thereof.
The broken line showing of the environment is for illustrative purpose only and forms not part of the claimed design.

Claims (1)

  1. The ornamental design for a surface mount package, as shown and described.
US29/145,236 2001-07-17 2001-07-17 Surface mount package Expired - Lifetime USD461172S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/145,236 USD461172S1 (en) 2001-07-17 2001-07-17 Surface mount package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/145,236 USD461172S1 (en) 2001-07-17 2001-07-17 Surface mount package

Publications (1)

Publication Number Publication Date
USD461172S1 true USD461172S1 (en) 2002-08-06

Family

ID=27611639

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/145,236 Expired - Lifetime USD461172S1 (en) 2001-07-17 2001-07-17 Surface mount package

Country Status (1)

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US (1) USD461172S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230260879A1 (en) * 2019-06-29 2023-08-17 Texas Instruments Incorporated Three-dimensional functional integration

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JEDEC Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun., 1999, MO-199, pp. 1-5.
JEDEC Solid State Product Outlines, "Plastic Small Outline (SOJ) Package Family with 0.330 Inch Body Width", Issue B, May, 1992, MO-121, pp. 1-2.
JEDEC Solid State Product Outlines, "Small Outline J-Lead" (SOJ) 0.300 Body Family (MS-013 Body), Issue A, Jun., 1988, MO-088, AA-AF.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230260879A1 (en) * 2019-06-29 2023-08-17 Texas Instruments Incorporated Three-dimensional functional integration
US12074098B2 (en) * 2019-06-29 2024-08-27 Texas Instruments Incorporated Three-dimensional functional integration

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