USD456367S1 - Semiconductor chip - Google Patents
Semiconductor chip Download PDFInfo
- Publication number
- USD456367S1 USD456367S1 US29/134,204 US13420400F USD456367S US D456367 S1 USD456367 S1 US D456367S1 US 13420400 F US13420400 F US 13420400F US D456367 S USD456367 S US D456367S
- Authority
- US
- United States
- Prior art keywords
- semiconductor chip
- view
- showing
- ornamental design
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 7
Images
Description
FIG. 1 is a perspective view of a semiconductor chip illustrating my new design;
FIG. 2 is a top view thereof;
FIG. 3 is a front elevational view showing one side of the semiconductor chip;
FIG. 4 is an end view of the semiconductor chip of FIG. 2 showing the left end thereof;
FIG. 5 is an end view of the semiconductor chip of FIG. 2 showing the right end thereof;
FIG. 6 is a side elevational view of the semiconductor chip of FIG. 2 showing a side opposite to that shown in FIG. 3; and,
FIG. 7 is a bottom view thereof.
Claims (1)
- The ornamental design for a semiconductor chip, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/134,204 USD456367S1 (en) | 2000-12-15 | 2000-12-15 | Semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/134,204 USD456367S1 (en) | 2000-12-15 | 2000-12-15 | Semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD456367S1 true USD456367S1 (en) | 2002-04-30 |
Family
ID=22462227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/134,204 Expired - Lifetime USD456367S1 (en) | 2000-12-15 | 2000-12-15 | Semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD456367S1 (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD503688S1 (en) * | 2002-07-03 | 2005-04-05 | Demmel Ag | Electrical logic element with relief symbol |
| USD714745S1 (en) * | 2012-02-14 | 2014-10-07 | Panasonic Corporation | Semiconductor |
| USD715234S1 (en) * | 2013-04-18 | 2014-10-14 | SemiLEDs Optoelectronics Co., Ltd. | Flip chip |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
| USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
| USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
| USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
| USD1090469S1 (en) * | 2023-12-29 | 2025-08-26 | Zhuhai Pantum Electronics Co., Ltd. | Chip for cartridge for laser printers |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD365092S (en) | 1993-08-12 | 1995-12-12 | Siemens Aktiengesellschaft | Chipcard module |
| USD406822S (en) | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| US6013946A (en) | 1996-09-11 | 2000-01-11 | Samsung Electronics Co., Ltd. | Wire bond packages for semiconductor chips and related methods and assemblies |
| USD421743S (en) | 1997-03-19 | 2000-03-21 | Sony Corporation | Lens for semiconductor element |
| US6201296B1 (en) | 1996-09-23 | 2001-03-13 | Siemens Aktiengesellschaft | Semiconductor chip with protection against analyzing |
| US6211572B1 (en) | 1995-10-31 | 2001-04-03 | Tessera, Inc. | Semiconductor chip package with fan-in leads |
| USD441727S1 (en) | 2000-10-04 | 2001-05-08 | Sony Corporation | Semiconductor element |
| USD441726S1 (en) | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
| US6297561B1 (en) | 1999-05-26 | 2001-10-02 | United Microelectronics Corp. | Semiconductor chip |
| US6300685B1 (en) | 1998-08-20 | 2001-10-09 | Oki Electric Industry Co., Ltd. | Semiconductor package |
| US6303982B2 (en) | 1988-09-20 | 2001-10-16 | Hitachi, Ltd. | Semiconductor device |
| US6307269B1 (en) | 1997-07-11 | 2001-10-23 | Hitachi, Ltd. | Semiconductor device with chip size package |
-
2000
- 2000-12-15 US US29/134,204 patent/USD456367S1/en not_active Expired - Lifetime
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6303982B2 (en) | 1988-09-20 | 2001-10-16 | Hitachi, Ltd. | Semiconductor device |
| USD365092S (en) | 1993-08-12 | 1995-12-12 | Siemens Aktiengesellschaft | Chipcard module |
| US6211572B1 (en) | 1995-10-31 | 2001-04-03 | Tessera, Inc. | Semiconductor chip package with fan-in leads |
| US6013946A (en) | 1996-09-11 | 2000-01-11 | Samsung Electronics Co., Ltd. | Wire bond packages for semiconductor chips and related methods and assemblies |
| US6201296B1 (en) | 1996-09-23 | 2001-03-13 | Siemens Aktiengesellschaft | Semiconductor chip with protection against analyzing |
| USD406822S (en) | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| USD421743S (en) | 1997-03-19 | 2000-03-21 | Sony Corporation | Lens for semiconductor element |
| US6307269B1 (en) | 1997-07-11 | 2001-10-23 | Hitachi, Ltd. | Semiconductor device with chip size package |
| US6300685B1 (en) | 1998-08-20 | 2001-10-09 | Oki Electric Industry Co., Ltd. | Semiconductor package |
| US6297561B1 (en) | 1999-05-26 | 2001-10-02 | United Microelectronics Corp. | Semiconductor chip |
| USD441726S1 (en) | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
| USD441727S1 (en) | 2000-10-04 | 2001-05-08 | Sony Corporation | Semiconductor element |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD503688S1 (en) * | 2002-07-03 | 2005-04-05 | Demmel Ag | Electrical logic element with relief symbol |
| USD714745S1 (en) * | 2012-02-14 | 2014-10-07 | Panasonic Corporation | Semiconductor |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
| US9269661B1 (en) | 2013-03-07 | 2016-02-23 | Vlt, Inc. | Low resistance power switching device |
| USD752000S1 (en) | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
| USD715234S1 (en) * | 2013-04-18 | 2014-10-14 | SemiLEDs Optoelectronics Co., Ltd. | Flip chip |
| USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
| USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
| USD911298S1 (en) | 2017-02-17 | 2021-02-23 | Stat Peel Ag | Chip |
| USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
| USD1090469S1 (en) * | 2023-12-29 | 2025-08-26 | Zhuhai Pantum Electronics Co., Ltd. | Chip for cartridge for laser printers |
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