USD436609S1 - Transfer chamber - Google Patents

Transfer chamber Download PDF

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Publication number
USD436609S1
USD436609S1 US29/114,734 US11473499F USD436609S US D436609 S1 USD436609 S1 US D436609S1 US 11473499 F US11473499 F US 11473499F US D436609 S USD436609 S US D436609S
Authority
US
United States
Prior art keywords
transfer chamber
perspective
view
present
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/114,734
Inventor
Avi Tepman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/114,734 priority Critical patent/USD436609S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TEPMAN, AVI
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Publication of USD436609S1 publication Critical patent/USD436609S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top perspective view of a transfer chamber of the present invention;
FIG. 2 is a perspective view showing substantially the top of a transfer chamber of the present invention;
FIG. 3 is a perspective view showing substantially one side of a transfer chamber of the present invention;
FIG. 4 is a perspective view showing substantially another side of a transfer chamber of the present invention;
FIG. 5 is a perspective view showing substantially one end of a transfer chamber of the present invention;
FIG. 6 is a perspective view showing substantially another end of a transfer chamber of the present invention; and,
FIG. 7 is a perspective view showing substantially the bottom of a transfer chamber of the present invention.

Claims (1)

  1. The ornamental design for a transfer chamber, as shown.
US29/114,734 1999-11-30 1999-11-30 Transfer chamber Expired - Lifetime USD436609S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/114,734 USD436609S1 (en) 1999-11-30 1999-11-30 Transfer chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/114,734 USD436609S1 (en) 1999-11-30 1999-11-30 Transfer chamber

Publications (1)

Publication Number Publication Date
USD436609S1 true USD436609S1 (en) 2001-01-23

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US29/114,734 Expired - Lifetime USD436609S1 (en) 1999-11-30 1999-11-30 Transfer chamber

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US (1) USD436609S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD527751S1 (en) * 2004-05-28 2006-09-05 Tokyo Electron Limited Transfer-chamber
US20100304027A1 (en) * 2009-05-27 2010-12-02 Applied Materials, Inc. Substrate processing system and methods thereof
USD911402S1 (en) * 2019-07-18 2021-02-23 Illinois Tool Works Inc. Chamber
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure

Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405435A (en) 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum
US4498416A (en) 1981-01-27 1985-02-12 Instrument S.A. Installation for treatment of materials for the production of semi-conductors
US4592306A (en) 1983-12-05 1986-06-03 Pilkington Brothers P.L.C. Apparatus for the deposition of multi-layer coatings
US4607593A (en) 1983-12-23 1986-08-26 U.S. Philips Corporation Apparatus for processing articles in a controlled environment
US4664062A (en) 1984-10-31 1987-05-12 Hitachi, Ltd. Apparatus for manufacturing semiconductors
US4681773A (en) 1981-03-27 1987-07-21 American Telephone And Telegraph Company At&T Bell Laboratories Apparatus for simultaneous molecular beam deposition on a plurality of substrates
US4709655A (en) 1985-12-03 1987-12-01 Varian Associates, Inc. Chemical vapor deposition apparatus
US4715921A (en) 1986-10-24 1987-12-29 General Signal Corporation Quad processor
US4717461A (en) 1986-09-15 1988-01-05 Machine Technology, Inc. System and method for processing workpieces
US4733631A (en) 1986-09-30 1988-03-29 Denton Vacuum, Inc. Apparatus for coating substrate devices
US4739787A (en) 1986-11-10 1988-04-26 Stoltenberg Kevin J Method and apparatus for improving the yield of integrated circuit devices
US4820106A (en) 1987-05-16 1989-04-11 Leybold-Heraeus Gmbh Apparatus for passing workpieces into and out of a coating chamber through locks
US4825808A (en) 1986-12-19 1989-05-02 Anelva Corporation Substrate processing apparatus
US4857160A (en) 1988-07-25 1989-08-15 Oerlikon-Buhrle U.S.A. Inc. High vacuum processing system and method
US4886592A (en) 1987-10-17 1989-12-12 Leybold Aktiengesellschaft Apparatus on the carousel principle for coating substrates
US4917556A (en) 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5000113A (en) 1986-12-19 1991-03-19 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
US5067218A (en) 1990-05-21 1991-11-26 Motorola, Inc. Vacuum wafer transport and processing system and method using a plurality of wafer transport arms
US5088444A (en) 1989-03-15 1992-02-18 Kabushiki Kaisha Toshiba Vapor deposition system
US5186718A (en) 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US5199483A (en) 1991-05-15 1993-04-06 Applied Materials, Inc. Method and apparatus for cooling wafers
US5259881A (en) 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US5516732A (en) 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5520002A (en) 1995-02-01 1996-05-28 Sony Corporation High speed pump for a processing vacuum chamber
US5582866A (en) 1993-01-28 1996-12-10 Applied Materials, Inc. Single substrate vacuum processing apparatus having improved exhaust system
US5769952A (en) 1994-06-07 1998-06-23 Tokyo Electron, Ltd. Reduced pressure and normal pressure treatment apparatus
US5784238A (en) 1996-08-01 1998-07-21 Applied Materials, Inc. Coordinated cluster tool energy delivery system
USD397346S (en) 1997-07-16 1998-08-25 Industrial Technology Research Institute Wafer-boat positioning member of wafer container
US5930456A (en) 1998-05-14 1999-07-27 Ag Associates Heating device for semiconductor wafers
US5944857A (en) 1997-05-08 1999-08-31 Tokyo Electron Limited Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor

Patent Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405435A (en) 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum
US4498416A (en) 1981-01-27 1985-02-12 Instrument S.A. Installation for treatment of materials for the production of semi-conductors
US4681773A (en) 1981-03-27 1987-07-21 American Telephone And Telegraph Company At&T Bell Laboratories Apparatus for simultaneous molecular beam deposition on a plurality of substrates
US4592306A (en) 1983-12-05 1986-06-03 Pilkington Brothers P.L.C. Apparatus for the deposition of multi-layer coatings
US4607593A (en) 1983-12-23 1986-08-26 U.S. Philips Corporation Apparatus for processing articles in a controlled environment
US4664062A (en) 1984-10-31 1987-05-12 Hitachi, Ltd. Apparatus for manufacturing semiconductors
US4709655A (en) 1985-12-03 1987-12-01 Varian Associates, Inc. Chemical vapor deposition apparatus
US4917556A (en) 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4717461A (en) 1986-09-15 1988-01-05 Machine Technology, Inc. System and method for processing workpieces
US4733631A (en) 1986-09-30 1988-03-29 Denton Vacuum, Inc. Apparatus for coating substrate devices
US4733631B1 (en) 1986-09-30 1993-03-09 Apparatus for coating substrate devices
US4715921A (en) 1986-10-24 1987-12-29 General Signal Corporation Quad processor
US4739787A (en) 1986-11-10 1988-04-26 Stoltenberg Kevin J Method and apparatus for improving the yield of integrated circuit devices
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US4825808A (en) 1986-12-19 1989-05-02 Anelva Corporation Substrate processing apparatus
US5000113A (en) 1986-12-19 1991-03-19 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
US4820106A (en) 1987-05-16 1989-04-11 Leybold-Heraeus Gmbh Apparatus for passing workpieces into and out of a coating chamber through locks
US4886592A (en) 1987-10-17 1989-12-12 Leybold Aktiengesellschaft Apparatus on the carousel principle for coating substrates
US4857160A (en) 1988-07-25 1989-08-15 Oerlikon-Buhrle U.S.A. Inc. High vacuum processing system and method
US5088444A (en) 1989-03-15 1992-02-18 Kabushiki Kaisha Toshiba Vapor deposition system
US5186718A (en) 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US5067218A (en) 1990-05-21 1991-11-26 Motorola, Inc. Vacuum wafer transport and processing system and method using a plurality of wafer transport arms
US5199483A (en) 1991-05-15 1993-04-06 Applied Materials, Inc. Method and apparatus for cooling wafers
US5352248A (en) 1991-05-17 1994-10-04 Materials Research Corporation Pyrometer temperature measurement of plural wafers stacked on a processing chamber
US5259881A (en) 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US5380682A (en) 1991-05-17 1995-01-10 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing method
US5516732A (en) 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5582866A (en) 1993-01-28 1996-12-10 Applied Materials, Inc. Single substrate vacuum processing apparatus having improved exhaust system
US5769952A (en) 1994-06-07 1998-06-23 Tokyo Electron, Ltd. Reduced pressure and normal pressure treatment apparatus
US5520002A (en) 1995-02-01 1996-05-28 Sony Corporation High speed pump for a processing vacuum chamber
US5784238A (en) 1996-08-01 1998-07-21 Applied Materials, Inc. Coordinated cluster tool energy delivery system
US5944857A (en) 1997-05-08 1999-08-31 Tokyo Electron Limited Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
USD397346S (en) 1997-07-16 1998-08-25 Industrial Technology Research Institute Wafer-boat positioning member of wafer container
US5930456A (en) 1998-05-14 1999-07-27 Ag Associates Heating device for semiconductor wafers

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD527751S1 (en) * 2004-05-28 2006-09-05 Tokyo Electron Limited Transfer-chamber
US20100304027A1 (en) * 2009-05-27 2010-12-02 Applied Materials, Inc. Substrate processing system and methods thereof
USD911402S1 (en) * 2019-07-18 2021-02-23 Illinois Tool Works Inc. Chamber
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure

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