USD419979S - Computer cooling device - Google Patents

Computer cooling device Download PDF

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Publication number
USD419979S
USD419979S US29/098,376 US9837698F USD419979S US D419979 S USD419979 S US D419979S US 9837698 F US9837698 F US 9837698F US D419979 S USD419979 S US D419979S
Authority
US
United States
Prior art keywords
cooling device
computer cooling
computer
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/098,376
Inventor
Chun-Hsin Lu
Pao-Lung Lin
Nien-Tien Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Assigned to FOXCONN PRECISION COMPONENTS CO., LTD. reassignment FOXCONN PRECISION COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, NIEN-TIEN, LIN, PAO-LUNG, LU, CHUN-HSIN
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Application granted granted Critical
Publication of USD419979S publication Critical patent/USD419979S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front-right-top perspective view of a computer cooling device showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a computer cooling device, as shown.
US29/098,376 1998-10-09 1998-12-28 Computer cooling device Expired - Lifetime USD419979S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW87307327 1998-10-09
TW87307327 1998-10-09

Publications (1)

Publication Number Publication Date
USD419979S true USD419979S (en) 2000-02-01

Family

ID=71781588

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/098,376 Expired - Lifetime USD419979S (en) 1998-10-09 1998-12-28 Computer cooling device

Country Status (1)

Country Link
US (1) USD419979S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030111213A1 (en) * 2001-12-14 2003-06-19 Chang Je Young Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
US20030221814A1 (en) * 2002-06-03 2003-12-04 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
USD975714S1 (en) * 2019-01-07 2023-01-17 EKWB d.o.o. Tube bending tool

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
US5276585A (en) * 1992-11-16 1994-01-04 Thermalloy, Inc. Heat sink mounting apparatus
US5369301A (en) * 1993-07-08 1994-11-29 Sumitomo Metal Industries, Ltd. Pin-finned forged heat sink
US5421406A (en) * 1992-06-16 1995-06-06 Showa Aluminum Corporation Heat sinks having pin-shaped fins and process for producing same
US5486981A (en) * 1994-08-12 1996-01-23 International Electronic Research Corporation Heat dissipating assembly
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
US5421406A (en) * 1992-06-16 1995-06-06 Showa Aluminum Corporation Heat sinks having pin-shaped fins and process for producing same
US5276585A (en) * 1992-11-16 1994-01-04 Thermalloy, Inc. Heat sink mounting apparatus
US5369301A (en) * 1993-07-08 1994-11-29 Sumitomo Metal Industries, Ltd. Pin-finned forged heat sink
US5486981A (en) * 1994-08-12 1996-01-23 International Electronic Research Corporation Heat dissipating assembly
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030111213A1 (en) * 2001-12-14 2003-06-19 Chang Je Young Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
US7131487B2 (en) * 2001-12-14 2006-11-07 Intel Corporation Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
US20030221814A1 (en) * 2002-06-03 2003-12-04 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
US6817405B2 (en) * 2002-06-03 2004-11-16 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
USD975714S1 (en) * 2019-01-07 2023-01-17 EKWB d.o.o. Tube bending tool

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