USD419979S - Computer cooling device - Google Patents
Computer cooling device Download PDFInfo
- Publication number
- USD419979S USD419979S US29/098,376 US9837698F USD419979S US D419979 S USD419979 S US D419979S US 9837698 F US9837698 F US 9837698F US D419979 S USD419979 S US D419979S
- Authority
- US
- United States
- Prior art keywords
- cooling device
- computer cooling
- computer
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front-right-top perspective view of a computer cooling device showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a computer cooling device, as shown.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW87307327 | 1998-10-09 | ||
TW87307327 | 1998-10-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD419979S true USD419979S (en) | 2000-02-01 |
Family
ID=71781588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/098,376 Expired - Lifetime USD419979S (en) | 1998-10-09 | 1998-12-28 | Computer cooling device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD419979S (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030111213A1 (en) * | 2001-12-14 | 2003-06-19 | Chang Je Young | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers |
US20030221814A1 (en) * | 2002-06-03 | 2003-12-04 | International Business Machines Corporation | Apparatus having forced fluid cooling and pin-fin heat sink |
USD975714S1 (en) * | 2019-01-07 | 2023-01-17 | EKWB d.o.o. | Tube bending tool |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208731A (en) * | 1992-01-17 | 1993-05-04 | International Electronic Research Corporation | Heat dissipating assembly |
US5276585A (en) * | 1992-11-16 | 1994-01-04 | Thermalloy, Inc. | Heat sink mounting apparatus |
US5369301A (en) * | 1993-07-08 | 1994-11-29 | Sumitomo Metal Industries, Ltd. | Pin-finned forged heat sink |
US5421406A (en) * | 1992-06-16 | 1995-06-06 | Showa Aluminum Corporation | Heat sinks having pin-shaped fins and process for producing same |
US5486981A (en) * | 1994-08-12 | 1996-01-23 | International Electronic Research Corporation | Heat dissipating assembly |
USD398295S (en) * | 1996-10-08 | 1998-09-15 | Chih Pin Chang | Heat dissipating plate for computer parts |
-
1998
- 1998-12-28 US US29/098,376 patent/USD419979S/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208731A (en) * | 1992-01-17 | 1993-05-04 | International Electronic Research Corporation | Heat dissipating assembly |
US5421406A (en) * | 1992-06-16 | 1995-06-06 | Showa Aluminum Corporation | Heat sinks having pin-shaped fins and process for producing same |
US5276585A (en) * | 1992-11-16 | 1994-01-04 | Thermalloy, Inc. | Heat sink mounting apparatus |
US5369301A (en) * | 1993-07-08 | 1994-11-29 | Sumitomo Metal Industries, Ltd. | Pin-finned forged heat sink |
US5486981A (en) * | 1994-08-12 | 1996-01-23 | International Electronic Research Corporation | Heat dissipating assembly |
USD398295S (en) * | 1996-10-08 | 1998-09-15 | Chih Pin Chang | Heat dissipating plate for computer parts |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030111213A1 (en) * | 2001-12-14 | 2003-06-19 | Chang Je Young | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers |
US7131487B2 (en) * | 2001-12-14 | 2006-11-07 | Intel Corporation | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers |
US20030221814A1 (en) * | 2002-06-03 | 2003-12-04 | International Business Machines Corporation | Apparatus having forced fluid cooling and pin-fin heat sink |
US6817405B2 (en) * | 2002-06-03 | 2004-11-16 | International Business Machines Corporation | Apparatus having forced fluid cooling and pin-fin heat sink |
USD975714S1 (en) * | 2019-01-07 | 2023-01-17 | EKWB d.o.o. | Tube bending tool |
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