USD412493S - Tape mounted heatsink package for electronic parts - Google Patents

Tape mounted heatsink package for electronic parts Download PDF

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Publication number
USD412493S
USD412493S US29/080,599 US8059997F USD412493S US D412493 S USD412493 S US D412493S US 8059997 F US8059997 F US 8059997F US D412493 S USD412493 S US D412493S
Authority
US
United States
Prior art keywords
electronic parts
tape mounted
package
heatsink package
mounted heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/080,599
Inventor
Fumihiko Hikita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhythm Kyoshin Co Ltd
Original Assignee
Kyoshin Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoshin Kogyo Co Ltd filed Critical Kyoshin Kogyo Co Ltd
Assigned to KYOSHIN KOGYO CO., LTD. reassignment KYOSHIN KOGYO CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIKITA, FUMIHIKO
Application granted granted Critical
Publication of USD412493S publication Critical patent/USD412493S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a tape mounted heatsink package for electronic parts showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof, the right side elevational view being mirror image;
FIG. 6 is a sectional view thereof, taken along line 6--6 in FIG. 2; and,
FIG. 7 is a top, front, and left side perspective view thereof, showing a pair of the heatsinks detached from the tape strip and mounted on an electronic circuit board assembly shown in broken-lines to indicate that it is not intended to form part of the claimed design.
The claimed designed is shown broken-away in the views to indicate indeterminate length, it being understood that the heat sink elements are continuous throughout the entire length of the packaging.

Claims (1)

  1. The ornamental design for a tape mounted heatsink package for electronic parts, as shown and described.
US29/080,599 1997-06-10 1997-10-01 Tape mounted heatsink package for electronic parts Expired - Lifetime USD412493S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5741697 1997-06-10
JP9-57416 1997-06-10

Publications (1)

Publication Number Publication Date
USD412493S true USD412493S (en) 1999-08-03

Family

ID=71660707

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/080,599 Expired - Lifetime USD412493S (en) 1997-06-10 1997-10-01 Tape mounted heatsink package for electronic parts

Country Status (1)

Country Link
US (1) USD412493S (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD301334S (en) * 1987-03-02 1989-05-30 Aro Metal Stamping Co., Inc. Heat sink
US4872505A (en) * 1988-08-16 1989-10-10 Ncr Corporation Heat sink for an electronic device
USD361986S (en) * 1994-04-05 1995-09-05 Wakefield Engineering, Inc. Heat sink

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD301334S (en) * 1987-03-02 1989-05-30 Aro Metal Stamping Co., Inc. Heat sink
US4872505A (en) * 1988-08-16 1989-10-10 Ncr Corporation Heat sink for an electronic device
USD361986S (en) * 1994-04-05 1995-09-05 Wakefield Engineering, Inc. Heat sink

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