USD412493S - Tape mounted heatsink package for electronic parts - Google Patents
Tape mounted heatsink package for electronic parts Download PDFInfo
- Publication number
- USD412493S USD412493S US29/080,599 US8059997F USD412493S US D412493 S USD412493 S US D412493S US 8059997 F US8059997 F US 8059997F US D412493 S USD412493 S US D412493S
- Authority
- US
- United States
- Prior art keywords
- electronic parts
- tape mounted
- package
- heatsink package
- mounted heatsink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 description 1
Images
Description
FIG. 1 is a top plan view of a tape mounted heatsink package for electronic parts showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof, the right side elevational view being mirror image;
FIG. 6 is a sectional view thereof, taken along line 6--6 in FIG. 2; and,
FIG. 7 is a top, front, and left side perspective view thereof, showing a pair of the heatsinks detached from the tape strip and mounted on an electronic circuit board assembly shown in broken-lines to indicate that it is not intended to form part of the claimed design.
The claimed designed is shown broken-away in the views to indicate indeterminate length, it being understood that the heat sink elements are continuous throughout the entire length of the packaging.
Claims (1)
- The ornamental design for a tape mounted heatsink package for electronic parts, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5741697 | 1997-06-10 | ||
| JP9-57416 | 1997-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD412493S true USD412493S (en) | 1999-08-03 |
Family
ID=71660707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/080,599 Expired - Lifetime USD412493S (en) | 1997-06-10 | 1997-10-01 | Tape mounted heatsink package for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD412493S (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD301334S (en) * | 1987-03-02 | 1989-05-30 | Aro Metal Stamping Co., Inc. | Heat sink |
| US4872505A (en) * | 1988-08-16 | 1989-10-10 | Ncr Corporation | Heat sink for an electronic device |
| USD361986S (en) * | 1994-04-05 | 1995-09-05 | Wakefield Engineering, Inc. | Heat sink |
-
1997
- 1997-10-01 US US29/080,599 patent/USD412493S/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD301334S (en) * | 1987-03-02 | 1989-05-30 | Aro Metal Stamping Co., Inc. | Heat sink |
| US4872505A (en) * | 1988-08-16 | 1989-10-10 | Ncr Corporation | Heat sink for an electronic device |
| USD361986S (en) * | 1994-04-05 | 1995-09-05 | Wakefield Engineering, Inc. | Heat sink |
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