USD341820S - Heat dissipating device for a semiconductor package - Google Patents

Heat dissipating device for a semiconductor package Download PDF

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Publication number
USD341820S
USD341820S US07/933,504 US93350492F USD341820S US D341820 S USD341820 S US D341820S US 93350492 F US93350492 F US 93350492F US D341820 S USD341820 S US D341820S
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US
United States
Prior art keywords
heat dissipating
semiconductor package
dissipating device
view
desscribed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/933,504
Inventor
Satomi Itoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Itoh Research & Development Laboratory Co Ltd
Itoh Res and Dev Labs Co Ltd
Original Assignee
Itoh Res and Dev Labs Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itoh Res and Dev Labs Co Ltd filed Critical Itoh Res and Dev Labs Co Ltd
Assigned to ITOH RESEARCH & DEVELOPMENT LABORATORY CO., LTD. reassignment ITOH RESEARCH & DEVELOPMENT LABORATORY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ITOH, SATOMI
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Publication of USD341820S publication Critical patent/USD341820S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of an embodiment of the heat dissipating device;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a perspective view thereof;
FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2;
FIG. 7 is a sectional view taken along section line 7--7 in FIG. 2; and,
FIG. 8 is a view of the heat dissipating device shown in FIG. 1 attached to a semiconductor package, the latter being shown by broken lines only as it does not form any part of the claimed design.

Claims (1)

  1. The ornamental design for a heat dissipating device for a semiconductor package, as shown and desscribed.
US07/933,504 1992-03-04 1992-08-21 Heat dissipating device for a semiconductor package Expired - Lifetime USD341820S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP620192 1992-03-04
JP4-6201 1992-03-04

Publications (1)

Publication Number Publication Date
USD341820S true USD341820S (en) 1993-11-30

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US07/933,504 Expired - Lifetime USD341820S (en) 1992-03-04 1992-08-21 Heat dissipating device for a semiconductor package

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD479829S1 (en) 2002-12-09 2003-09-23 Xanoptix Inc. Inside-out heat sink
USD479828S1 (en) 2002-12-09 2003-09-23 Xanoptix, Inc. Inside-out heat sink
USD490382S1 (en) 2002-12-09 2004-05-25 Xanoptix, Inc. Inside-out heat sink
US20130058042A1 (en) * 2011-09-03 2013-03-07 Todd Richard Salamon Laminated heat sinks
USD927435S1 (en) * 2019-04-12 2021-08-10 Shin-Etsu Polymer Co., Ltd. Heat dissipating device for batteries or electric devices
USD987167S1 (en) * 2020-03-23 2023-05-23 Osram Gmbh Heatsink for a lamp

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079410A (en) 1975-12-10 1978-03-14 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier device with improved cooling arrangement
US4268850A (en) 1979-05-11 1981-05-19 Electric Power Research Institute Forced vaporization heat sink for semiconductor devices
US4494171A (en) 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4546405A (en) 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US4942497A (en) 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US5113315A (en) 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079410A (en) 1975-12-10 1978-03-14 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier device with improved cooling arrangement
US4268850A (en) 1979-05-11 1981-05-19 Electric Power Research Institute Forced vaporization heat sink for semiconductor devices
US4494171A (en) 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4546405A (en) 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US4942497A (en) 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US5113315A (en) 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD479829S1 (en) 2002-12-09 2003-09-23 Xanoptix Inc. Inside-out heat sink
USD479828S1 (en) 2002-12-09 2003-09-23 Xanoptix, Inc. Inside-out heat sink
USD490382S1 (en) 2002-12-09 2004-05-25 Xanoptix, Inc. Inside-out heat sink
US20130058042A1 (en) * 2011-09-03 2013-03-07 Todd Richard Salamon Laminated heat sinks
USD927435S1 (en) * 2019-04-12 2021-08-10 Shin-Etsu Polymer Co., Ltd. Heat dissipating device for batteries or electric devices
USD987167S1 (en) * 2020-03-23 2023-05-23 Osram Gmbh Heatsink for a lamp

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