USD285301S - Pinned heat-sink extrusion for circuit-board mounting - Google Patents

Pinned heat-sink extrusion for circuit-board mounting Download PDF

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Publication number
USD285301S
USD285301S US06/602,666 US60266684F USD285301S US D285301 S USD285301 S US D285301S US 60266684 F US60266684 F US 60266684F US D285301 S USD285301 S US D285301S
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US
United States
Prior art keywords
circuit
board mounting
sink extrusion
pinned heat
pinned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/602,666
Inventor
Philip A. Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LaSalle Business Credit LLC
Original Assignee
Aavid Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Engineering Inc filed Critical Aavid Engineering Inc
Priority to US06/602,666 priority Critical patent/USD285301S/en
Assigned to AAVID ENGINEERING, INC. reassignment AAVID ENGINEERING, INC. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: JOHNSON, PHILIP A.
Application granted granted Critical
Publication of USD285301S publication Critical patent/USD285301S/en
Assigned to MNC COMMERCIAL CORP., A MD CORP. reassignment MNC COMMERCIAL CORP., A MD CORP. SPECIAL POWER ATTY., ASSIGNOR HEREBY APPOINTS ASSIGNEE AS ITS POWER OF ATTORNEY TO ACT IN ALL MATTERS INVOLVING SAID PATENTS. Assignors: AAVID ENGINEERING, INC., A N.H. CORP.
Assigned to MNC COMMERCIAL CORP., A MD CORP. reassignment MNC COMMERCIAL CORP., A MD CORP. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC., A N.H. CORP.
Assigned to MNC COMMERCIAL CORP. reassignment MNC COMMERCIAL CORP. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC., A NH CORP.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC.
Assigned to AAVID ENGINEERING, INC. reassignment AAVID ENGINEERING, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MARYLAND NATIONAL BANK (AS SUCCESSOR-IN-INTEREST TO MNC CREDIT CORP.)
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. CORRECTIVE ASSIGNMENT OF SECURITY INTEREST IN PATENTS TO AMEND THE CONVEYING PARTY NAME, PREVIOUSLY RECORDED AT REEL 6747, FRAME 0635. Assignors: AAVID THERMAL PRODCUTS, INC.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. AMENDMENT: AMEND CONVEYING PARTY'S NAME ON PREVIOUSLY RECORDED ASSIGNMENT OF SECURITY INTEREST IN PATENTS, REEL 8059 FRAME 0087, RECORDED 10/07/96 Assignors: AAVID THERMAL PRODUCTS, INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a pinned heat-sink extrusion for circuit-board mounting showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a side elevational view thereof, looking toward the right side thereof as it is shown in FIG. 1; and
FIG. 7 is a side elevational view thereof looking toward the left side thereof as it is shown in FIG. 1.

Claims (1)

  1. The ornamental design for a pinned heat-sink extrusion for circuit-board mounting, substantially as shown.
US06/602,666 1984-04-23 1984-04-23 Pinned heat-sink extrusion for circuit-board mounting Expired - Lifetime USD285301S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/602,666 USD285301S (en) 1984-04-23 1984-04-23 Pinned heat-sink extrusion for circuit-board mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/602,666 USD285301S (en) 1984-04-23 1984-04-23 Pinned heat-sink extrusion for circuit-board mounting

Publications (1)

Publication Number Publication Date
USD285301S true USD285301S (en) 1986-08-26

Family

ID=70053688

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/602,666 Expired - Lifetime USD285301S (en) 1984-04-23 1984-04-23 Pinned heat-sink extrusion for circuit-board mounting

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD316705S (en) 1989-01-13 1991-05-07 Product R&D Corporation Combined heat sink and radiator for electronic equipment
USD328057S (en) 1990-02-12 1992-07-21 Vicor Corporation Power supply
USD376132S (en) 1995-12-27 1996-12-03 Orton Kevin R Heatsink-outfitted speed controller housing
US20040201964A1 (en) * 2002-11-20 2004-10-14 Sigl Dennis R. Snap-in heat sink for semiconductor mounting
USD616378S1 (en) * 2009-06-18 2010-05-25 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD618185S1 (en) * 2009-06-18 2010-06-22 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD618183S1 (en) * 2009-06-18 2010-06-22 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD618184S1 (en) * 2009-06-19 2010-06-22 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD664544S1 (en) * 2010-07-20 2012-07-31 Cisco Technology, Inc. Router interface card

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303392A (en) 1963-09-10 1967-02-07 Gen Systems Inc Cooling arrangement for electronic devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303392A (en) 1963-09-10 1967-02-07 Gen Systems Inc Cooling arrangement for electronic devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD316705S (en) 1989-01-13 1991-05-07 Product R&D Corporation Combined heat sink and radiator for electronic equipment
USD328057S (en) 1990-02-12 1992-07-21 Vicor Corporation Power supply
USD376132S (en) 1995-12-27 1996-12-03 Orton Kevin R Heatsink-outfitted speed controller housing
US20040201964A1 (en) * 2002-11-20 2004-10-14 Sigl Dennis R. Snap-in heat sink for semiconductor mounting
USD616378S1 (en) * 2009-06-18 2010-05-25 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD618185S1 (en) * 2009-06-18 2010-06-22 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD618183S1 (en) * 2009-06-18 2010-06-22 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD618184S1 (en) * 2009-06-19 2010-06-22 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD664544S1 (en) * 2010-07-20 2012-07-31 Cisco Technology, Inc. Router interface card

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