USD1140755S1 - Thermometer for semiconductor manufacturing apparatus - Google Patents

Thermometer for semiconductor manufacturing apparatus

Info

Publication number
USD1140755S1
USD1140755S1 US29/921,334 US202329921334F USD1140755S US D1140755 S1 USD1140755 S1 US D1140755S1 US 202329921334 F US202329921334 F US 202329921334F US D1140755 S USD1140755 S US D1140755S
Authority
US
United States
Prior art keywords
thermometer
manufacturing apparatus
semiconductor manufacturing
double
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/921,334
Other languages
English (en)
Inventor
Takayuki Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNOR'S INTEREST Assignors: NAKADA, TAKAYUKI
Application granted granted Critical
Publication of USD1140755S1 publication Critical patent/USD1140755S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

US29/921,334 2023-06-19 2023-12-15 Thermometer for semiconductor manufacturing apparatus Active USD1140755S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-012485D 2023-06-19
JP2023012485F JP1760962S (cg-RX-API-DMAC7.html) 2023-06-19 2023-06-19

Publications (1)

Publication Number Publication Date
USD1140755S1 true USD1140755S1 (en) 2026-08-11

Family

ID=89452079

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/921,334 Active USD1140755S1 (en) 2023-06-19 2023-12-15 Thermometer for semiconductor manufacturing apparatus

Country Status (3)

Country Link
US (1) USD1140755S1 (cg-RX-API-DMAC7.html)
JP (1) JP1760962S (cg-RX-API-DMAC7.html)
TW (1) TWD240928S (cg-RX-API-DMAC7.html)

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990016192A (ko) * 1997-08-13 1999-03-05 윤종용 독립 수신이 가능한 팩스 모뎀 및 그 제어 방법
USD520854S1 (en) * 2004-10-28 2006-05-16 International Rv Products Company Extendable awning wand for engaging and deploying a retractable awning on a home or motor home
USD560126S1 (en) * 2006-06-22 2008-01-22 Watlow Electric Manufacturing Company Dual temperature sensor assembly
USD560518S1 (en) * 2006-06-22 2008-01-29 Watlow Electric Manufacturing Company Uni-probe temperature sensor assembly
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
USD617630S1 (en) * 2008-06-11 2010-06-15 Magisso Oy Hanging or storage attachment for a sink
US7780210B1 (en) * 2006-03-02 2010-08-24 Boyum Paul H Pickup box retrieval implement
USD656373S1 (en) * 2010-10-18 2012-03-27 David Martin Extendable pole
US20130259090A1 (en) * 2012-03-29 2013-10-03 Tuerk & Hillinger Gmbh Immersion temperature sensor
JP1534939S (cg-RX-API-DMAC7.html) 2015-02-25 2015-10-13
JP2016015083A (ja) * 2014-07-03 2016-01-28 清水建設株式会社 ３次元図形生成システム及び３次元図形生成方法
JP1577927S (cg-RX-API-DMAC7.html) 2016-07-14 2017-06-05
USD803075S1 (en) * 2016-02-10 2017-11-21 Hitachi Kokusai Electric Inc. Thermometry tool for substrate processing apparatus
USD811193S1 (en) * 2017-01-03 2018-02-27 Spectrum Brands, Inc. Handle
USD822824S1 (en) * 2016-10-26 2018-07-10 Vyaire Medical Capital Llc Sensor port
USD871864S1 (en) * 2018-07-13 2020-01-07 Hewlett-Packard Development Company, L. P. Arm extension tool
USD882437S1 (en) * 2017-10-16 2020-04-28 Caterpillar Inc. Gauge needle
USD937104S1 (en) * 2019-07-25 2021-11-30 Chunhua Lei Probe for food thermometer
US20220390288A1 (en) * 2021-06-02 2022-12-08 Tokyo Electron Limited Semiconductor manufacturing apparatus and temperature control method
USD973520S1 (en) * 2020-08-31 2022-12-27 Kokusai Electric Corporation Temperature sensor
USD976129S1 (en) * 2020-09-15 2023-01-24 Kokusai Electric Corporation Temperature sensor
USD1031467S1 (en) * 2022-03-18 2024-06-18 Therm-O-Disc, Incorporated Dual probe sensor
US20240234187A1 (en) * 2021-09-28 2024-07-11 Kokusai Electric Corporation Substrate supporter, substrate processing apparatus, method of measuring temperature, method of manufacturing semiconductor device and recording medium
USD1096359S1 (en) * 2023-09-28 2025-10-07 Xingsanxing Cloud Technology Co., Ltd. Handle

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1534604S (cg-RX-API-DMAC7.html) 2015-02-25 2015-10-05

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990016192A (ko) * 1997-08-13 1999-03-05 윤종용 독립 수신이 가능한 팩스 모뎀 및 그 제어 방법
USD520854S1 (en) * 2004-10-28 2006-05-16 International Rv Products Company Extendable awning wand for engaging and deploying a retractable awning on a home or motor home
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
US7780210B1 (en) * 2006-03-02 2010-08-24 Boyum Paul H Pickup box retrieval implement
USD560518S1 (en) * 2006-06-22 2008-01-29 Watlow Electric Manufacturing Company Uni-probe temperature sensor assembly
USD560126S1 (en) * 2006-06-22 2008-01-22 Watlow Electric Manufacturing Company Dual temperature sensor assembly
USD617630S1 (en) * 2008-06-11 2010-06-15 Magisso Oy Hanging or storage attachment for a sink
USD656373S1 (en) * 2010-10-18 2012-03-27 David Martin Extendable pole
US20130259090A1 (en) * 2012-03-29 2013-10-03 Tuerk & Hillinger Gmbh Immersion temperature sensor
JP2016015083A (ja) * 2014-07-03 2016-01-28 清水建設株式会社 ３次元図形生成システム及び３次元図形生成方法
JP1534939S (cg-RX-API-DMAC7.html) 2015-02-25 2015-10-13
USD780606S1 (en) * 2015-02-25 2017-03-07 Hitachi Kokusai Electric Inc. Protector tube for thermocouple
USD803075S1 (en) * 2016-02-10 2017-11-21 Hitachi Kokusai Electric Inc. Thermometry tool for substrate processing apparatus
JP1577927S (cg-RX-API-DMAC7.html) 2016-07-14 2017-06-05
USD818850S1 (en) * 2016-07-14 2018-05-29 Hitachi Kokusai Electric Inc. Protector tube for thermocouple
USD822824S1 (en) * 2016-10-26 2018-07-10 Vyaire Medical Capital Llc Sensor port
USD811193S1 (en) * 2017-01-03 2018-02-27 Spectrum Brands, Inc. Handle
USD882437S1 (en) * 2017-10-16 2020-04-28 Caterpillar Inc. Gauge needle
USD871864S1 (en) * 2018-07-13 2020-01-07 Hewlett-Packard Development Company, L. P. Arm extension tool
USD937104S1 (en) * 2019-07-25 2021-11-30 Chunhua Lei Probe for food thermometer
USD973520S1 (en) * 2020-08-31 2022-12-27 Kokusai Electric Corporation Temperature sensor
USD976129S1 (en) * 2020-09-15 2023-01-24 Kokusai Electric Corporation Temperature sensor
US20220390288A1 (en) * 2021-06-02 2022-12-08 Tokyo Electron Limited Semiconductor manufacturing apparatus and temperature control method
US20240234187A1 (en) * 2021-09-28 2024-07-11 Kokusai Electric Corporation Substrate supporter, substrate processing apparatus, method of measuring temperature, method of manufacturing semiconductor device and recording medium
USD1031467S1 (en) * 2022-03-18 2024-06-18 Therm-O-Disc, Incorporated Dual probe sensor
USD1096359S1 (en) * 2023-09-28 2025-10-07 Xingsanxing Cloud Technology Co., Ltd. Handle

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
ABB Measurement & Analytics Industrial temperature measurement Basics and practice, Published Sep. 26, 2013, retrieved Mar. 16, 2026,available https://search-ext.abb.com/library/Download.aspx?DocumentID=03/TEMP-EN&LanguageCode=en&DocumentPartId=&Action=Launch (Year: 2013). *
IOX-Connect, Collect.Analyze.Act,Wireless food Probe, First available Jan. 29, 2023, retrieved Mar. 10, 2026,available from https://www.iox-connect.com/hubfs/Data%20Sheets%20and%20Specifications/Sensors/Data%20Sheets/Food%20Probe%20Sensor/Food-Probe-Sensor-Data-Sheet.pdf (Year: 2023). *
Omega,Unique Surface Probes,Published Jan. 17, 2018, retrieved Mar. 16, 2026,available Fromhttps://assets.dwyeromega.com/pdf/test-and-measurement-equipment/temperature/sensors/thermocouple-probes/88000_hightemp.pdf (Year: 2018). *
Profi Mess, MT-01 industrial Thermometer,Date first available Apr. 17, 2024, retrieved Mar. 10, 2026,available from https://www.profimess.com/english/pdfs/MT-01_eng.pdf (Year: 2017). *
PROsense, 10K-3 Thermistor Spring-Loaded Probes with Hex Nipple, Date first available Feb. 17, 2026, retrieved Mar. 10, 2026, available from https://cdn.automationdirect.com/static/specs/ps10k3tslphn.pdf?_gl=1cor0cl_upMQ.._gsMQ..&gclid=EAlalQobChMlh8fcgouWkwMVJhutBh3eKybIEAQYFSABEgKZLfD_BwE (Year: 2026). *

Also Published As

Publication number Publication date
JP1760962S (cg-RX-API-DMAC7.html) 2024-01-10
TWD240928S (zh) 2025-10-11