USD1140754S1 - Thermometer for semiconductor manufacturing apparatus - Google Patents

Thermometer for semiconductor manufacturing apparatus

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Publication number
USD1140754S1
USD1140754S1 US29/921,324 US202329921324F USD1140754S US D1140754 S1 USD1140754 S1 US D1140754S1 US 202329921324 F US202329921324 F US 202329921324F US D1140754 S USD1140754 S US D1140754S
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United States
Prior art keywords
thermometer
manufacturing apparatus
semiconductor manufacturing
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US29/921,324
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English (en)
Inventor
Takayuki Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNOR'S INTEREST Assignors: NAKADA, TAKAYUKI
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Publication of USD1140754S1 publication Critical patent/USD1140754S1/en
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US29/921,324 2023-06-19 2023-12-15 Thermometer for semiconductor manufacturing apparatus Active USD1140754S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-012484D 2023-06-19
JP2023012484F JP1760961S (cg-RX-API-DMAC7.html) 2023-06-19 2023-06-19

Publications (1)

Publication Number Publication Date
USD1140754S1 true USD1140754S1 (en) 2026-08-11

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ID=89452047

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US29/921,324 Active USD1140754S1 (en) 2023-06-19 2023-12-15 Thermometer for semiconductor manufacturing apparatus

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US (1) USD1140754S1 (cg-RX-API-DMAC7.html)
JP (1) JP1760961S (cg-RX-API-DMAC7.html)
TW (1) TWD240927S (cg-RX-API-DMAC7.html)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD560518S1 (en) * 2006-06-22 2008-01-29 Watlow Electric Manufacturing Company Uni-probe temperature sensor assembly
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
US20090014435A1 (en) * 2007-06-25 2009-01-15 Hitachi Kokusai Electric Inc. Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
US20130259090A1 (en) * 2012-03-29 2013-10-03 Tuerk & Hillinger Gmbh Immersion temperature sensor
JP1534939S (cg-RX-API-DMAC7.html) 2015-02-25 2015-10-13
JP2016015083A (ja) * 2014-07-03 2016-01-28 清水建設株式会社 ３次元図形生成システム及び３次元図形生成方法
USD778741S1 (en) * 2015-02-25 2017-02-14 Hitachi Kokusai Electric Inc. Protector tube for thermocouple
JP1577927S (cg-RX-API-DMAC7.html) 2016-07-14 2017-06-05
USD803075S1 (en) * 2016-02-10 2017-11-21 Hitachi Kokusai Electric Inc. Thermometry tool for substrate processing apparatus
USD819463S1 (en) * 2016-07-14 2018-06-05 Hitachi Kokusai Electric Inc. Protector tube for thermocouple
USD976129S1 (en) * 2020-09-15 2023-01-24 Kokusai Electric Corporation Temperature sensor
USD1030526S1 (en) * 2022-03-18 2024-06-11 Therm-O-Disc, Incorporated Single probe sensor
USD1031467S1 (en) * 2022-03-18 2024-06-18 Therm-O-Disc, Incorporated Dual probe sensor
US20240234187A1 (en) * 2021-09-28 2024-07-11 Kokusai Electric Corporation Substrate supporter, substrate processing apparatus, method of measuring temperature, method of manufacturing semiconductor device and recording medium
US20250316504A1 (en) * 2024-04-09 2025-10-09 Applied Materials, Inc. Cleaning device for semiconductor and flat panel display processing tools

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
USD560518S1 (en) * 2006-06-22 2008-01-29 Watlow Electric Manufacturing Company Uni-probe temperature sensor assembly
US20090014435A1 (en) * 2007-06-25 2009-01-15 Hitachi Kokusai Electric Inc. Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
US20130259090A1 (en) * 2012-03-29 2013-10-03 Tuerk & Hillinger Gmbh Immersion temperature sensor
JP2016015083A (ja) * 2014-07-03 2016-01-28 清水建設株式会社 ３次元図形生成システム及び３次元図形生成方法
JP1534939S (cg-RX-API-DMAC7.html) 2015-02-25 2015-10-13
USD778741S1 (en) * 2015-02-25 2017-02-14 Hitachi Kokusai Electric Inc. Protector tube for thermocouple
USD780606S1 (en) * 2015-02-25 2017-03-07 Hitachi Kokusai Electric Inc. Protector tube for thermocouple
USD803075S1 (en) * 2016-02-10 2017-11-21 Hitachi Kokusai Electric Inc. Thermometry tool for substrate processing apparatus
JP1577927S (cg-RX-API-DMAC7.html) 2016-07-14 2017-06-05
USD818850S1 (en) 2016-07-14 2018-05-29 Hitachi Kokusai Electric Inc. Protector tube for thermocouple
USD819463S1 (en) * 2016-07-14 2018-06-05 Hitachi Kokusai Electric Inc. Protector tube for thermocouple
USD976129S1 (en) * 2020-09-15 2023-01-24 Kokusai Electric Corporation Temperature sensor
US20240234187A1 (en) * 2021-09-28 2024-07-11 Kokusai Electric Corporation Substrate supporter, substrate processing apparatus, method of measuring temperature, method of manufacturing semiconductor device and recording medium
USD1030526S1 (en) * 2022-03-18 2024-06-11 Therm-O-Disc, Incorporated Single probe sensor
USD1031467S1 (en) * 2022-03-18 2024-06-18 Therm-O-Disc, Incorporated Dual probe sensor
US20250316504A1 (en) * 2024-04-09 2025-10-09 Applied Materials, Inc. Cleaning device for semiconductor and flat panel display processing tools

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
IOX-Connect, Collect.Analyze.Act,Wireless food Probe, First available Jan. 29, 2023,retrieved Mar. 10, 2026,available from https://www.iox-connect.com/hubfs/Data%20Sheets%20and%20Specifications/Sensors/Data%20Sheets/Food%20Probe%20Sensor/Food-Probe-Sensor-Data-Sheet.pdf (Year: 2023). *
Profi Mess, MT-01 industrial Thermometer, Date first available Apr. 17, 2024, retrieved Mar. 10, 2026,available from https://www.profimess.com/english/pdfs/MT-01_eng.pdf (Year: 2017). *
ProSense, 10K-3 Thermistor Spring-Loaded Probes with Hex Nipple, Date first available Feb. 17, 2026, retrieved Mar. 10, 2026, available from https://cdn.automationdirect.com/static/specs/ps10k3tslphn.pdf?_gl=1*cor0cl*_up*MQ..*_gs*MQ..&gclid=EAlalQobChMlh8fcgouWkwMVJhutBh3eKybIEAQYFSABEgKZLfD_BwE (Year: 2026). *

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JP1760961S (cg-RX-API-DMAC7.html) 2024-01-10
TWD240927S (zh) 2025-10-11