USD1112114S1 - Thermal processing chamber for a semiconductor - Google Patents

Thermal processing chamber for a semiconductor

Info

Publication number
USD1112114S1
USD1112114S1 US29/909,205 US202329909205F USD1112114S US D1112114 S1 USD1112114 S1 US D1112114S1 US 202329909205 F US202329909205 F US 202329909205F US D1112114 S USD1112114 S US D1112114S
Authority
US
United States
Prior art keywords
semiconductor
processing chamber
thermal processing
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/909,205
Other languages
English (en)
Inventor
Takeshi Yasui
Yukinori Aburatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
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Publication of USD1112114S1 publication Critical patent/USD1112114S1/en
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US29/909,205 2023-02-15 2023-08-02 Thermal processing chamber for a semiconductor Active USD1112114S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023002895F JP1760956S (enExample) 2023-02-15 2023-02-15
JP2023-002895D 2023-02-15

Publications (1)

Publication Number Publication Date
USD1112114S1 true USD1112114S1 (en) 2026-02-10

Family

ID=89452045

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/909,205 Active USD1112114S1 (en) 2023-02-15 2023-08-02 Thermal processing chamber for a semiconductor

Country Status (3)

Country Link
US (1) USD1112114S1 (enExample)
JP (1) JP1760956S (enExample)
TW (1) TWD232416S (enExample)

Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604694A (en) * 1968-10-04 1971-09-14 Siemens Ag Device for heat treatment of silicon discs
US4849608A (en) * 1987-02-14 1989-07-18 Dainippon Screen Mfg. Co., Ltd. Apparatus for heat-treating wafers
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
US5772770A (en) * 1995-01-27 1998-06-30 Kokusai Electric Co, Ltd. Substrate processing apparatus
US5884009A (en) * 1997-08-07 1999-03-16 Tokyo Electron Limited Substrate treatment system
US6002109A (en) * 1995-07-10 1999-12-14 Mattson Technology, Inc. System and method for thermal processing of a semiconductor substrate
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
US6185370B1 (en) * 1998-09-09 2001-02-06 Tokyo Electron Limited Heating apparatus for heating an object to be processed
USD437333S1 (en) * 1999-11-30 2001-02-06 Applied Materials, Inc. Process chamber tray
US6187102B1 (en) * 1998-11-26 2001-02-13 Tokyo Electron Limited Thermal treatment apparatus
US6307184B1 (en) * 1999-07-12 2001-10-23 Fsi International, Inc. Thermal processing chamber for heating and cooling wafer-like objects
US6884066B2 (en) * 2002-09-10 2005-04-26 Fsi International, Inc. Thermal process station with heated lid
US6919271B2 (en) * 1998-11-20 2005-07-19 Mattson Technology, Inc. Method for rapidly heating and cooling semiconductor wafers
US6929774B2 (en) * 1997-07-10 2005-08-16 Applied Materials, Inc. Method and apparatus for heating and cooling substrates
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
US7554103B2 (en) * 2006-06-26 2009-06-30 Applied Materials, Inc. Increased tool utilization/reduction in MWBC for UV curing chamber
USD735255S1 (en) * 2013-12-24 2015-07-28 The Yankee Candle Company, Inc. Heater dish and wax cup for electric wax melting system
US20170073810A1 (en) * 2015-09-11 2017-03-16 Eugene Technology Co., Ltd. Substrate processing apparatus
JP1611626S (enExample) 2017-01-20 2018-08-20
USD911402S1 (en) * 2019-07-18 2021-02-23 Illinois Tool Works Inc. Chamber
JP1683051S (enExample) * 2019-08-28 2021-04-12
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD1071138S1 (en) * 2023-06-20 2025-04-15 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1079931S1 (en) * 2023-06-20 2025-06-17 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1079908S1 (en) * 2023-06-20 2025-06-17 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1080853S1 (en) * 2023-06-20 2025-06-24 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1089130S1 (en) * 2024-01-19 2025-08-19 Applied Materials, Inc. Process chamber manifold

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604694A (en) * 1968-10-04 1971-09-14 Siemens Ag Device for heat treatment of silicon discs
US4849608A (en) * 1987-02-14 1989-07-18 Dainippon Screen Mfg. Co., Ltd. Apparatus for heat-treating wafers
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
US5772770A (en) * 1995-01-27 1998-06-30 Kokusai Electric Co, Ltd. Substrate processing apparatus
US6002109A (en) * 1995-07-10 1999-12-14 Mattson Technology, Inc. System and method for thermal processing of a semiconductor substrate
US6929774B2 (en) * 1997-07-10 2005-08-16 Applied Materials, Inc. Method and apparatus for heating and cooling substrates
US5884009A (en) * 1997-08-07 1999-03-16 Tokyo Electron Limited Substrate treatment system
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
US6185370B1 (en) * 1998-09-09 2001-02-06 Tokyo Electron Limited Heating apparatus for heating an object to be processed
US6919271B2 (en) * 1998-11-20 2005-07-19 Mattson Technology, Inc. Method for rapidly heating and cooling semiconductor wafers
US6187102B1 (en) * 1998-11-26 2001-02-13 Tokyo Electron Limited Thermal treatment apparatus
US6307184B1 (en) * 1999-07-12 2001-10-23 Fsi International, Inc. Thermal processing chamber for heating and cooling wafer-like objects
USD437333S1 (en) * 1999-11-30 2001-02-06 Applied Materials, Inc. Process chamber tray
US6884066B2 (en) * 2002-09-10 2005-04-26 Fsi International, Inc. Thermal process station with heated lid
US7554103B2 (en) * 2006-06-26 2009-06-30 Applied Materials, Inc. Increased tool utilization/reduction in MWBC for UV curing chamber
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
USD735255S1 (en) * 2013-12-24 2015-07-28 The Yankee Candle Company, Inc. Heater dish and wax cup for electric wax melting system
US20170073810A1 (en) * 2015-09-11 2017-03-16 Eugene Technology Co., Ltd. Substrate processing apparatus
JP1611626S (enExample) 2017-01-20 2018-08-20
USD911402S1 (en) * 2019-07-18 2021-02-23 Illinois Tool Works Inc. Chamber
JP1683051S (enExample) * 2019-08-28 2021-04-12
JP1683107S (enExample) * 2019-08-28 2021-04-12
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD1071138S1 (en) * 2023-06-20 2025-04-15 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1079931S1 (en) * 2023-06-20 2025-06-17 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1079908S1 (en) * 2023-06-20 2025-06-17 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1080853S1 (en) * 2023-06-20 2025-06-24 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1084286S1 (en) * 2023-06-20 2025-07-15 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1089130S1 (en) * 2024-01-19 2025-08-19 Applied Materials, Inc. Process chamber manifold

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Rapid Thermal Processing (RTP) on Silicon Wafers,https://www.universitywafer.com/rapid-thermal-processing-silicon-wafers.html?srsltid=AfmBOooMTFM35EfapYOr9vKHh1J9Y47cPmBOTP3j1UFGdBBGBtWNxJLu,2025. (Year: 2025). *
Rapid Thermal Processing (RTP) on Silicon Wafers,https://www.universitywafer.com/rapid-thermal-processing-silicon-wafers.html?srsltid=AfmBOooMTFM35EfapYOr9vKHh1J9Y47cPmBOTP3j1UFGdBBGBtWNxJLu,2025. (Year: 2025). *

Also Published As

Publication number Publication date
JP1760956S (enExample) 2024-01-10
TWD232416S (zh) 2024-07-21

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