USD1090465S1 - Power module housing - Google Patents

Power module housing

Info

Publication number
USD1090465S1
USD1090465S1 US29/938,184 US202429938184F USD1090465S US D1090465 S1 USD1090465 S1 US D1090465S1 US 202429938184 F US202429938184 F US 202429938184F US D1090465 S USD1090465 S US D1090465S
Authority
US
United States
Prior art keywords
power module
module housing
view
housing
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/938,184
Inventor
Yuan-Cheng Huang
Ji-Yuan Syu
Chun-Kai Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Industrial Technology Research Institute ITRI
Original Assignee
Industrial Technology Research Institute ITRI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Industrial Technology Research Institute ITRI filed Critical Industrial Technology Research Institute ITRI
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE reassignment INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, Yuan-cheng, LIU, CHUN-KAI, SYU, JI-YUAN
Application granted granted Critical
Publication of USD1090465S1 publication Critical patent/USD1090465S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top, front and right side perspective view of a power module housing showing our new design;
FIG. 2 is a top, rear and left side perspective view thereof;
FIG. 3 is a bottom, rear and left side perspective view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a right side view thereof;
FIG. 8 is a top view thereof; and,
FIG. 9 is a bottom view thereof.
The broken lines in the figures illustrate the portions of the design that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power module housing, as shown and described.
US29/938,184 2024-03-05 2024-04-18 Power module housing Active USD1090465S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW113301063F TWD235165S (en) 2024-03-05 2024-03-05 Power module housing
TW113301063 2024-03-05

Publications (1)

Publication Number Publication Date
USD1090465S1 true USD1090465S1 (en) 2025-08-26

Family

ID=93707195

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/938,184 Active USD1090465S1 (en) 2024-03-05 2024-04-18 Power module housing

Country Status (2)

Country Link
US (1) USD1090465S1 (en)
TW (1) TWD235165S (en)

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD556686S1 (en) 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
US20080142948A1 (en) * 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
US20140376184A1 (en) * 2012-04-16 2014-12-25 Fuji Electric Co. Ltd. Semiconductor device and cooler thereof
US20150373836A1 (en) * 2014-06-20 2015-12-24 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
US10020237B2 (en) * 2014-10-30 2018-07-10 Infineon Technologies Ag Power semiconductor module and method for producing a power semiconductor module
US20190157221A1 (en) * 2017-02-06 2019-05-23 Fuji Electric Co., Ltd. Semiconductor module, electric automobile and power control unit
US10396056B2 (en) * 2015-07-01 2019-08-27 Fuji Electric Co., Ltd. Semiconductor device and semiconductor device fabrication method
US10607903B2 (en) 2015-02-19 2020-03-31 Semiconductor Components Industries, Llc Semiconductor package with elastic coupler and related methods
TWD206651S (en) 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module
TW202032312A (en) 2019-02-20 2020-09-01 台達電子工業股份有限公司 Package structure of power module
USD903612S1 (en) 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
TW202127991A (en) 2020-01-05 2021-07-16 財團法人工業技術研究院 Power module
TWD212914S (en) 2020-09-30 2021-07-21 日商日本航空電子工業股份有限公司 Connector
US20210339601A1 (en) 2020-04-30 2021-11-04 Thermo King Corporation Power protection system for a power module of a transport climate control system
US20220077791A1 (en) * 2020-09-04 2022-03-10 Hitachi Astemo, Ltd. Power control unit
US11315859B1 (en) * 2020-10-22 2022-04-26 Semiconductor Components Industries, Llc Power module
US20230217590A1 (en) 2020-05-27 2023-07-06 Amosense Co., Ltd. Power module
US20240130055A1 (en) * 2022-10-13 2024-04-18 Industrial Technology Research Institute Combined power module
US20240222236A1 (en) * 2022-12-28 2024-07-04 Fuji Electric Co., Ltd. Electronic device and manufacturing method thereof
US20250070104A1 (en) * 2023-08-25 2025-02-27 Infineon Technologies Ag Power electronic system having a power semiconductor module and a current sensor and power semiconductor module
US20250149395A1 (en) * 2023-11-03 2025-05-08 Wolfspeed, Inc. Power modules having encapsulation stress and strain mitigating configurations

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD556686S1 (en) 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
US20080142948A1 (en) * 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
US20140376184A1 (en) * 2012-04-16 2014-12-25 Fuji Electric Co. Ltd. Semiconductor device and cooler thereof
US20150373836A1 (en) * 2014-06-20 2015-12-24 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
US10020237B2 (en) * 2014-10-30 2018-07-10 Infineon Technologies Ag Power semiconductor module and method for producing a power semiconductor module
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
US10607903B2 (en) 2015-02-19 2020-03-31 Semiconductor Components Industries, Llc Semiconductor package with elastic coupler and related methods
US10396056B2 (en) * 2015-07-01 2019-08-27 Fuji Electric Co., Ltd. Semiconductor device and semiconductor device fabrication method
US20190157221A1 (en) * 2017-02-06 2019-05-23 Fuji Electric Co., Ltd. Semiconductor module, electric automobile and power control unit
TW202032312A (en) 2019-02-20 2020-09-01 台達電子工業股份有限公司 Package structure of power module
USD903612S1 (en) 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
TW202127991A (en) 2020-01-05 2021-07-16 財團法人工業技術研究院 Power module
TWD206651S (en) 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module
USD976852S1 (en) * 2020-04-24 2023-01-31 Industrial Technology Research Institute Power module
US20210339601A1 (en) 2020-04-30 2021-11-04 Thermo King Corporation Power protection system for a power module of a transport climate control system
US20230217590A1 (en) 2020-05-27 2023-07-06 Amosense Co., Ltd. Power module
US20220077791A1 (en) * 2020-09-04 2022-03-10 Hitachi Astemo, Ltd. Power control unit
TWD212914S (en) 2020-09-30 2021-07-21 日商日本航空電子工業股份有限公司 Connector
USD976838S1 (en) 2020-09-30 2023-01-31 Japan Aviation Electronics Industry, Limited Connector
US11315859B1 (en) * 2020-10-22 2022-04-26 Semiconductor Components Industries, Llc Power module
US20240130055A1 (en) * 2022-10-13 2024-04-18 Industrial Technology Research Institute Combined power module
US20240222236A1 (en) * 2022-12-28 2024-07-04 Fuji Electric Co., Ltd. Electronic device and manufacturing method thereof
US20250070104A1 (en) * 2023-08-25 2025-02-27 Infineon Technologies Ag Power electronic system having a power semiconductor module and a current sensor and power semiconductor module
US20250149395A1 (en) * 2023-11-03 2025-05-08 Wolfspeed, Inc. Power modules having encapsulation stress and strain mitigating configurations

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
TW Notice of Allowance dated Aug. 1, 2024 as received in Application No. 113301063.

Also Published As

Publication number Publication date
TWD235165S (en) 2024-12-01

Similar Documents

Publication Publication Date Title
USD1076821S1 (en) Power strip
USD976852S1 (en) Power module
USD1038024S1 (en) Power adapter
USD1024968S1 (en) Power connector
USD983750S1 (en) Power connector
USD1042336S1 (en) Power bank
USD1093283S1 (en) Power bank
USD1027860S1 (en) Power connector
USD1081542S1 (en) Battery housing
USD1087899S1 (en) Power bank
USD955335S1 (en) Power module
USD1090426S1 (en) Power bank
USD1074609S1 (en) Power strip
USD1062639S1 (en) Power strip
USD1056851S1 (en) Housing for a power distribution module
USD1076822S1 (en) Power strip
USD1077753S1 (en) Power strip
USD1067189S1 (en) Power outlet
USD1081721S1 (en) Pump module housing
USD1074612S1 (en) Electrical housing
USD1090465S1 (en) Power module housing
USD1030673S1 (en) Power connector
USD1024926S1 (en) Battery module
USD1092406S1 (en) Power connector
USD1094288S1 (en) Power module

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY