USD1090465S1 - Power module housing - Google Patents
Power module housingInfo
- Publication number
- USD1090465S1 USD1090465S1 US29/938,184 US202429938184F USD1090465S US D1090465 S1 USD1090465 S1 US D1090465S1 US 202429938184 F US202429938184 F US 202429938184F US D1090465 S USD1090465 S US D1090465S
- Authority
- US
- United States
- Prior art keywords
- power module
- module housing
- view
- housing
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines in the figures illustrate the portions of the design that form no part of the claimed design.
Claims (1)
- The ornamental design for a power module housing, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113301063F TWD235165S (en) | 2024-03-05 | 2024-03-05 | Power module housing |
| TW113301063 | 2024-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1090465S1 true USD1090465S1 (en) | 2025-08-26 |
Family
ID=93707195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/938,184 Active USD1090465S1 (en) | 2024-03-05 | 2024-04-18 | Power module housing |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1090465S1 (en) |
| TW (1) | TWD235165S (en) |
Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD556686S1 (en) | 2006-04-27 | 2007-12-04 | Hitachi, Ltd. | Power module for power inverter |
| US20080142948A1 (en) * | 2006-12-15 | 2008-06-19 | Mitsubishi Electric Corporation | Semiconductor device |
| US20140376184A1 (en) * | 2012-04-16 | 2014-12-25 | Fuji Electric Co. Ltd. | Semiconductor device and cooler thereof |
| US20150373836A1 (en) * | 2014-06-20 | 2015-12-24 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor device |
| USD748595S1 (en) | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
| USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
| US10020237B2 (en) * | 2014-10-30 | 2018-07-10 | Infineon Technologies Ag | Power semiconductor module and method for producing a power semiconductor module |
| US20190157221A1 (en) * | 2017-02-06 | 2019-05-23 | Fuji Electric Co., Ltd. | Semiconductor module, electric automobile and power control unit |
| US10396056B2 (en) * | 2015-07-01 | 2019-08-27 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor device fabrication method |
| US10607903B2 (en) | 2015-02-19 | 2020-03-31 | Semiconductor Components Industries, Llc | Semiconductor package with elastic coupler and related methods |
| TWD206651S (en) | 2020-04-24 | 2020-08-21 | 財團法人工業技術研究院 | Power module |
| TW202032312A (en) | 2019-02-20 | 2020-09-01 | 台達電子工業股份有限公司 | Package structure of power module |
| USD903612S1 (en) | 2019-03-26 | 2020-12-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| TW202127991A (en) | 2020-01-05 | 2021-07-16 | 財團法人工業技術研究院 | Power module |
| TWD212914S (en) | 2020-09-30 | 2021-07-21 | 日商日本航空電子工業股份有限公司 | Connector |
| US20210339601A1 (en) | 2020-04-30 | 2021-11-04 | Thermo King Corporation | Power protection system for a power module of a transport climate control system |
| US20220077791A1 (en) * | 2020-09-04 | 2022-03-10 | Hitachi Astemo, Ltd. | Power control unit |
| US11315859B1 (en) * | 2020-10-22 | 2022-04-26 | Semiconductor Components Industries, Llc | Power module |
| US20230217590A1 (en) | 2020-05-27 | 2023-07-06 | Amosense Co., Ltd. | Power module |
| US20240130055A1 (en) * | 2022-10-13 | 2024-04-18 | Industrial Technology Research Institute | Combined power module |
| US20240222236A1 (en) * | 2022-12-28 | 2024-07-04 | Fuji Electric Co., Ltd. | Electronic device and manufacturing method thereof |
| US20250070104A1 (en) * | 2023-08-25 | 2025-02-27 | Infineon Technologies Ag | Power electronic system having a power semiconductor module and a current sensor and power semiconductor module |
| US20250149395A1 (en) * | 2023-11-03 | 2025-05-08 | Wolfspeed, Inc. | Power modules having encapsulation stress and strain mitigating configurations |
-
2024
- 2024-03-05 TW TW113301063F patent/TWD235165S/en unknown
- 2024-04-18 US US29/938,184 patent/USD1090465S1/en active Active
Patent Citations (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD556686S1 (en) | 2006-04-27 | 2007-12-04 | Hitachi, Ltd. | Power module for power inverter |
| US20080142948A1 (en) * | 2006-12-15 | 2008-06-19 | Mitsubishi Electric Corporation | Semiconductor device |
| US20140376184A1 (en) * | 2012-04-16 | 2014-12-25 | Fuji Electric Co. Ltd. | Semiconductor device and cooler thereof |
| US20150373836A1 (en) * | 2014-06-20 | 2015-12-24 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor device |
| USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
| USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
| US10020237B2 (en) * | 2014-10-30 | 2018-07-10 | Infineon Technologies Ag | Power semiconductor module and method for producing a power semiconductor module |
| USD748595S1 (en) | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| US10607903B2 (en) | 2015-02-19 | 2020-03-31 | Semiconductor Components Industries, Llc | Semiconductor package with elastic coupler and related methods |
| US10396056B2 (en) * | 2015-07-01 | 2019-08-27 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor device fabrication method |
| US20190157221A1 (en) * | 2017-02-06 | 2019-05-23 | Fuji Electric Co., Ltd. | Semiconductor module, electric automobile and power control unit |
| TW202032312A (en) | 2019-02-20 | 2020-09-01 | 台達電子工業股份有限公司 | Package structure of power module |
| USD903612S1 (en) | 2019-03-26 | 2020-12-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| TW202127991A (en) | 2020-01-05 | 2021-07-16 | 財團法人工業技術研究院 | Power module |
| TWD206651S (en) | 2020-04-24 | 2020-08-21 | 財團法人工業技術研究院 | Power module |
| USD976852S1 (en) * | 2020-04-24 | 2023-01-31 | Industrial Technology Research Institute | Power module |
| US20210339601A1 (en) | 2020-04-30 | 2021-11-04 | Thermo King Corporation | Power protection system for a power module of a transport climate control system |
| US20230217590A1 (en) | 2020-05-27 | 2023-07-06 | Amosense Co., Ltd. | Power module |
| US20220077791A1 (en) * | 2020-09-04 | 2022-03-10 | Hitachi Astemo, Ltd. | Power control unit |
| TWD212914S (en) | 2020-09-30 | 2021-07-21 | 日商日本航空電子工業股份有限公司 | Connector |
| USD976838S1 (en) | 2020-09-30 | 2023-01-31 | Japan Aviation Electronics Industry, Limited | Connector |
| US11315859B1 (en) * | 2020-10-22 | 2022-04-26 | Semiconductor Components Industries, Llc | Power module |
| US20240130055A1 (en) * | 2022-10-13 | 2024-04-18 | Industrial Technology Research Institute | Combined power module |
| US20240222236A1 (en) * | 2022-12-28 | 2024-07-04 | Fuji Electric Co., Ltd. | Electronic device and manufacturing method thereof |
| US20250070104A1 (en) * | 2023-08-25 | 2025-02-27 | Infineon Technologies Ag | Power electronic system having a power semiconductor module and a current sensor and power semiconductor module |
| US20250149395A1 (en) * | 2023-11-03 | 2025-05-08 | Wolfspeed, Inc. | Power modules having encapsulation stress and strain mitigating configurations |
Non-Patent Citations (1)
| Title |
|---|
| TW Notice of Allowance dated Aug. 1, 2024 as received in Application No. 113301063. |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD235165S (en) | 2024-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |