USD1049064S1 - Heat sink cover - Google Patents

Heat sink cover Download PDF

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Publication number
USD1049064S1
USD1049064S1 US29/811,314 US202129811314F USD1049064S US D1049064 S1 USD1049064 S1 US D1049064S1 US 202129811314 F US202129811314 F US 202129811314F US D1049064 S USD1049064 S US D1049064S
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US
United States
Prior art keywords
heat sink
sink cover
cover
side elevational
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/811,314
Inventor
Chris Togami
Radhakrishnan L. Nagarajan
Gary Sasser
Brian Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marvell Asia Pte Ltd
Original Assignee
Marvell Asia Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Marvell Asia Pte Ltd filed Critical Marvell Asia Pte Ltd
Priority to US29/811,314 priority Critical patent/USD1049064S1/en
Application granted granted Critical
Publication of USD1049064S1 publication Critical patent/USD1049064S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 shows a perspective view of a heat sink cover according to the new design.
FIG. 2 is a top plane view of the heat sink cover of FIG. 1 .
FIG. 3 is a bottom plane view of the heat sink cover of FIG. 1 .
FIG. 4 is a left side elevational view of the heat sink cover of FIG. 1 .
FIG. 5 is a right side elevational view of the heat sink cover of FIG. 1 .
FIG. 6 is a front side elevational view of the heat sink cover of FIG. 1 ; and,
FIG. 7 is a back side elevational view of the heat sink cover of FIG. 1 .

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink cover as shown and described.
US29/811,314 2019-09-13 2021-10-13 Heat sink cover Active USD1049064S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/811,314 USD1049064S1 (en) 2019-09-13 2021-10-13 Heat sink cover

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/705,640 USD933617S1 (en) 2019-09-13 2019-09-13 Heat sink cover
US29/811,314 USD1049064S1 (en) 2019-09-13 2021-10-13 Heat sink cover

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/705,640 Division USD933617S1 (en) 2019-09-13 2019-09-13 Heat sink cover

Publications (1)

Publication Number Publication Date
USD1049064S1 true USD1049064S1 (en) 2024-10-29

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ID=78069338

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US29/705,640 Active USD933617S1 (en) 2019-09-13 2019-09-13 Heat sink cover
US29/811,314 Active USD1049064S1 (en) 2019-09-13 2021-10-13 Heat sink cover

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/705,640 Active USD933617S1 (en) 2019-09-13 2019-09-13 Heat sink cover

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US (2) USD933617S1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD933617S1 (en) * 2019-09-13 2021-10-19 Marvell Asia Pte, Ltd. Heat sink cover
USD896767S1 (en) * 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD947414S1 (en) 2020-05-20 2022-03-29 Peak Industries, Inc. Mobile stackable tower
USD991012S1 (en) * 2020-05-20 2023-07-04 Peak Industries, Inc. Base plate of a mobile stackable tower

Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD269084S (en) * 1981-04-08 1983-05-24 Aavid Engineering, Inc. Dual heat sink for electronic semiconductor devices
USD280320S (en) 1983-07-29 1985-08-27 Aavid Engineering, Inc. Twisted-fin heat sink for electrical devices
USD295281S (en) * 1985-04-01 1988-04-19 Thermalloy Incorporated Heat sink or similar article
USD296778S (en) * 1985-10-31 1988-07-19 Aavid Engineering, Inc. Slotted dual-channel heat sink for electronic devices
USD361317S (en) * 1994-05-26 1995-08-15 Wakefield Engineering, Inc. Heat sink device
USD376349S (en) 1995-05-15 1996-12-10 Wakefield Engineering, Inc. Clamping heat sink
USD407381S (en) * 1997-10-27 1999-03-30 Wakefield Engineering, Inc. Heat sink
USD409157S (en) 1998-03-09 1999-05-04 Schneider Automation Inc. Clip-on heat sink
USD422970S (en) 1998-11-30 2000-04-18 I.E.R.C. (International Electronic Research Corp. Heat sink
US20050207118A1 (en) 2004-03-18 2005-09-22 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20060222342A1 (en) 2005-03-31 2006-10-05 Orion Electric Co., Ltd. Recording and reproducing device
USD531138S1 (en) 2006-01-20 2006-10-31 Watlow Electric Manufacturing Company Power controller heat sink
US20120090888A1 (en) 2010-10-19 2012-04-19 Hon Hai Precision Industry Co., Ltd. Enclosure of electronic device
US20120241038A1 (en) 2011-03-25 2012-09-27 Hon Hai Precision Industry Co., Ltd. Airflow guide cover assembly
US20130050951A1 (en) 2011-08-30 2013-02-28 Hon Hai Precision Industry Co., Ltd. Air duct
US20130164970A1 (en) * 2011-11-08 2013-06-27 Molex Incorporated Connector with integrated heat sink
US20130328466A1 (en) 2012-06-08 2013-12-12 Lerng-Horng CHANG Combinational chassis featuring heat dissipation
US9578780B1 (en) 2015-10-16 2017-02-21 Chaun-Choung Technology Corp. Heat dissipating device
JP1588801S (en) 2016-12-05 2017-10-23
JP1588802S (en) 2016-12-05 2017-10-23
JP1588803S (en) 2016-12-05 2017-10-23
JP1588800S (en) * 2016-12-05 2017-10-23
US20190115519A1 (en) 2016-04-06 2019-04-18 Denso Corporation Thermoelectric generator
US20190150319A1 (en) 2016-04-29 2019-05-16 Hewlett Packard Enterprise Development Lp First and second shields for thermal isolation
USD856945S1 (en) 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US20190377391A1 (en) 2018-06-06 2019-12-12 Cooler Master Technology Inc. Cooling system and water cooling radiator
US10942323B1 (en) * 2019-09-20 2021-03-09 Inphi Corporation Apparatus and method for thermal dissipation of photonic transceiving module
USD933617S1 (en) * 2019-09-13 2021-10-19 Marvell Asia Pte, Ltd. Heat sink cover

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN305877609S (en) * 2020-06-26
USD269084S (en) * 1981-04-08 1983-05-24 Aavid Engineering, Inc. Dual heat sink for electronic semiconductor devices
USD280320S (en) 1983-07-29 1985-08-27 Aavid Engineering, Inc. Twisted-fin heat sink for electrical devices
USD295281S (en) * 1985-04-01 1988-04-19 Thermalloy Incorporated Heat sink or similar article
USD296778S (en) * 1985-10-31 1988-07-19 Aavid Engineering, Inc. Slotted dual-channel heat sink for electronic devices
USD361317S (en) * 1994-05-26 1995-08-15 Wakefield Engineering, Inc. Heat sink device
USD376349S (en) 1995-05-15 1996-12-10 Wakefield Engineering, Inc. Clamping heat sink
USD407381S (en) * 1997-10-27 1999-03-30 Wakefield Engineering, Inc. Heat sink
USD409157S (en) 1998-03-09 1999-05-04 Schneider Automation Inc. Clip-on heat sink
USD422970S (en) 1998-11-30 2000-04-18 I.E.R.C. (International Electronic Research Corp. Heat sink
US20050207118A1 (en) 2004-03-18 2005-09-22 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20060222342A1 (en) 2005-03-31 2006-10-05 Orion Electric Co., Ltd. Recording and reproducing device
USD531138S1 (en) 2006-01-20 2006-10-31 Watlow Electric Manufacturing Company Power controller heat sink
US20120090888A1 (en) 2010-10-19 2012-04-19 Hon Hai Precision Industry Co., Ltd. Enclosure of electronic device
US20120241038A1 (en) 2011-03-25 2012-09-27 Hon Hai Precision Industry Co., Ltd. Airflow guide cover assembly
US20130050951A1 (en) 2011-08-30 2013-02-28 Hon Hai Precision Industry Co., Ltd. Air duct
US20130164970A1 (en) * 2011-11-08 2013-06-27 Molex Incorporated Connector with integrated heat sink
US20130328466A1 (en) 2012-06-08 2013-12-12 Lerng-Horng CHANG Combinational chassis featuring heat dissipation
US9578780B1 (en) 2015-10-16 2017-02-21 Chaun-Choung Technology Corp. Heat dissipating device
US20190115519A1 (en) 2016-04-06 2019-04-18 Denso Corporation Thermoelectric generator
US20190150319A1 (en) 2016-04-29 2019-05-16 Hewlett Packard Enterprise Development Lp First and second shields for thermal isolation
JP1588802S (en) 2016-12-05 2017-10-23
JP1588800S (en) * 2016-12-05 2017-10-23
JP1588803S (en) 2016-12-05 2017-10-23
JP1588801S (en) 2016-12-05 2017-10-23
US20190377391A1 (en) 2018-06-06 2019-12-12 Cooler Master Technology Inc. Cooling system and water cooling radiator
USD856945S1 (en) 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD933617S1 (en) * 2019-09-13 2021-10-19 Marvell Asia Pte, Ltd. Heat sink cover
US10942323B1 (en) * 2019-09-20 2021-03-09 Inphi Corporation Apparatus and method for thermal dissipation of photonic transceiving module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Aluminum Extrusion Heatsink Case, Supply Power Box / Inverter Box /Controller Terminal Box", first accessed Feb. 7, 2024. dgcoolwhist.en.made-in-china.com [https://dgcoolwhist.en.made-in-china.com/product/IBUJHGRdghcD/China-Aluminum-Extrusion-Heatsink-Case-Supply-Power-Box-Inverter-Box-Controller-Terminal-Box.html] (Year: 2024). *

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