USB553421I5 - - Google Patents

Info

Publication number
USB553421I5
USB553421I5 US55342175A USB553421I5 US B553421 I5 USB553421 I5 US B553421I5 US 55342175 A US55342175 A US 55342175A US B553421 I5 USB553421 I5 US B553421I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US05/553,421 priority Critical patent/US4001146A/en
Priority to CA227,572A priority patent/CA1050746A/en
Priority to DE2523009A priority patent/DE2523009C3/en
Publication of USB553421I5 publication Critical patent/USB553421I5/en
Application granted granted Critical
Publication of US4001146A publication Critical patent/US4001146A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
US05/553,421 1975-02-26 1975-02-26 Novel silver compositions Expired - Lifetime US4001146A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US05/553,421 US4001146A (en) 1975-02-26 1975-02-26 Novel silver compositions
CA227,572A CA1050746A (en) 1975-02-26 1975-05-22 Silver compositions
DE2523009A DE2523009C3 (en) 1975-02-26 1975-05-23 Suitable silver compound for the formation of strongly adhering conductor patterns on aluminum oxide substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/553,421 US4001146A (en) 1975-02-26 1975-02-26 Novel silver compositions

Publications (2)

Publication Number Publication Date
USB553421I5 true USB553421I5 (en) 1976-03-23
US4001146A US4001146A (en) 1977-01-04

Family

ID=24209328

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/553,421 Expired - Lifetime US4001146A (en) 1975-02-26 1975-02-26 Novel silver compositions

Country Status (3)

Country Link
US (1) US4001146A (en)
CA (1) CA1050746A (en)
DE (1) DE2523009C3 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4323483A (en) 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
EP0327816A2 (en) * 1988-02-11 1989-08-16 W.C. Heraeus GmbH Non-oxidizable copper thick film conductor

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4254546A (en) * 1978-09-11 1981-03-10 Ses, Incorporated Photovoltaic cell array
US4353153A (en) * 1978-11-16 1982-10-12 Union Carbide Corporation Method of making capacitor with CO-fired end terminations
US4235644A (en) * 1979-08-31 1980-11-25 E. I. Du Pont De Nemours And Company Thick film silver metallizations for silicon solar cells
JPS5719903A (en) * 1980-07-11 1982-02-02 Alps Electric Co Ltd Conductive paste
US4419279A (en) * 1980-09-15 1983-12-06 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
FR2505094A1 (en) * 1981-04-29 1982-11-05 Trt Telecom Radio Electr METHOD FOR PRODUCING MICROWAVE CIRCUITS
US4414143A (en) * 1981-05-06 1983-11-08 E. I. Du Pont De Nemours & Co. Conductor compositions
NL8102809A (en) * 1981-06-11 1983-01-03 Philips Nv RESISTANCE PASTE FOR A RESISTANCE BODY.
FR2593346B1 (en) * 1986-01-17 1990-05-25 Nec Corp WIRING SUBSTRATE USING CERAMIC AS INSULATION
US4871608A (en) * 1986-12-10 1989-10-03 Ngk Spark Plug Co., Ltd. High-density wiring multilayered substrate
US5189009A (en) * 1987-03-27 1993-02-23 Massachusetts Institute Of Technology Preparation of superconducting oxides and oxide-metal composites
US4826808A (en) * 1987-03-27 1989-05-02 Massachusetts Institute Of Technology Preparation of superconducting oxides and oxide-metal composites
US5204318A (en) * 1987-03-27 1993-04-20 Massachusetts Institute Of Technology Preparation of superconducting oxides and oxide-metal composites
US4981840A (en) * 1987-08-13 1991-01-01 International Business Machines Corporation Process for preparing metal-ceramic coatings electrically superconducting above 77 degrees Kappa
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5250229A (en) * 1991-10-10 1993-10-05 E. I. Du Pont De Nemours And Company Silver-rich conductor compositions for high thermal cycled and aged adhesion
US6001508A (en) * 1993-06-14 1999-12-14 Rayovac Corporation AgO cathode battery
US5391223A (en) * 1993-08-20 1995-02-21 The Penn State Research Foundation Metallization compositions for BI and PB-containing ceramic dielectrics
US5840432A (en) * 1995-02-13 1998-11-24 Hitachi Chemical Company, Ltd. Electroconductive paste
US6338893B1 (en) * 1998-10-28 2002-01-15 Ngk Spark Plug Co., Ltd. Conductive paste and ceramic printed circuit substrate using the same
JP2002362987A (en) * 2001-06-08 2002-12-18 Hitachi Ltd Electronic component and method for manufacturing the same
JP3767514B2 (en) * 2002-04-26 2006-04-19 株式会社村田製作所 Conductive paste
US20080230119A1 (en) * 2007-03-22 2008-09-25 Hideki Akimoto Paste for back contact-type solar cell
US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
US20090211626A1 (en) * 2008-02-26 2009-08-27 Hideki Akimoto Conductive paste and grid electrode for silicon solar cells
TWM512217U (en) 2013-06-20 2015-11-11 Plant PV Solar cells
US20160322163A1 (en) * 2015-04-28 2016-11-03 E I Du Pont De Nemours And Company Terminal electrode of electronic component
US10550291B2 (en) 2015-08-25 2020-02-04 Hitachi Chemical Co., Ltd. Core-shell, oxidation-resistant, electrically conducting particles for low temperature conductive applications
WO2017035102A1 (en) 2015-08-26 2017-03-02 Plant Pv, Inc Silver-bismuth non-contact metallization pastes for silicon solar cells
US10696851B2 (en) 2015-11-24 2020-06-30 Hitachi Chemical Co., Ltd. Print-on pastes for modifying material properties of metal particle layers

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2819170A (en) * 1954-08-06 1958-01-07 Du Pont Vitrifiable flux and silver compositions containing same
GB855625A (en) * 1957-08-06 1960-12-07 Morgan Crucible Co Improvements in the metallising of ceramics
US3293501A (en) * 1964-11-24 1966-12-20 Sprague Electric Co Ceramic with metal film via binder of copper oxide containing glass
US3763409A (en) * 1972-04-20 1973-10-02 Du Pont Capacitor with copper containing electrode
US3776769A (en) * 1970-08-27 1973-12-04 Atomic Energy Authority Uk Metallising pastes
US3799890A (en) * 1972-03-08 1974-03-26 B Smith Composition and method of bonding gold to a ceramic substrate and a bonded gold article
US3799891A (en) * 1972-04-27 1974-03-26 B Smith Gold composition for bonding gold to a ceramic substrate utilizing copper oxide and cadmium oxide

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2819170A (en) * 1954-08-06 1958-01-07 Du Pont Vitrifiable flux and silver compositions containing same
GB855625A (en) * 1957-08-06 1960-12-07 Morgan Crucible Co Improvements in the metallising of ceramics
US3293501A (en) * 1964-11-24 1966-12-20 Sprague Electric Co Ceramic with metal film via binder of copper oxide containing glass
US3776769A (en) * 1970-08-27 1973-12-04 Atomic Energy Authority Uk Metallising pastes
US3799890A (en) * 1972-03-08 1974-03-26 B Smith Composition and method of bonding gold to a ceramic substrate and a bonded gold article
US3763409A (en) * 1972-04-20 1973-10-02 Du Pont Capacitor with copper containing electrode
US3799891A (en) * 1972-04-27 1974-03-26 B Smith Gold composition for bonding gold to a ceramic substrate utilizing copper oxide and cadmium oxide

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
American Ceramic Society Bulletin 46, 789 (1967), "An Air Fired Gold-Copper Oxide Paste". *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4323483A (en) 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
EP0327816A2 (en) * 1988-02-11 1989-08-16 W.C. Heraeus GmbH Non-oxidizable copper thick film conductor
EP0327816A3 (en) * 1988-02-11 1990-10-10 W.C. Heraeus Gmbh Non-oxidizable copper thick film conductor

Also Published As

Publication number Publication date
DE2523009C3 (en) 1981-04-09
US4001146A (en) 1977-01-04
DE2523009A1 (en) 1976-09-09
DE2523009B2 (en) 1976-12-16
CA1050746A (en) 1979-03-20

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