USB509772I5 - - Google Patents

Info

Publication number
USB509772I5
USB509772I5 US50977274A USB509772I5 US B509772 I5 USB509772 I5 US B509772I5 US 50977274 A US50977274 A US 50977274A US B509772 I5 USB509772 I5 US B509772I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US05/509,772 priority Critical patent/US3999004A/en
Priority to GB22911/75A priority patent/GB1488301A/en
Priority to JP50099846A priority patent/JPS5153509A/ja
Priority to FR7526331A priority patent/FR2286580A1/en
Priority to DE19752538454 priority patent/DE2538454A1/en
Publication of USB509772I5 publication Critical patent/USB509772I5/en
Application granted granted Critical
Publication of US3999004A publication Critical patent/US3999004A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
US05/509,772 1974-09-27 1974-09-27 Multilayer ceramic substrate structure Expired - Lifetime US3999004A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US05/509,772 US3999004A (en) 1974-09-27 1974-09-27 Multilayer ceramic substrate structure
GB22911/75A GB1488301A (en) 1974-09-27 1975-05-23 Methods of forming electrical conductors
JP50099846A JPS5153509A (en) 1974-09-27 1975-08-19
FR7526331A FR2286580A1 (en) 1974-09-27 1975-08-19 SINGLE AND MULTI-LAYER CERAMIC SUPPORT STRUCTURE AND ITS MANUFACTURING PROCESS
DE19752538454 DE2538454A1 (en) 1974-09-27 1975-08-29 METHOD FOR PRODUCING A MULTI-LAYER CERAMIC SUBSTRATE STRUCTURE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/509,772 US3999004A (en) 1974-09-27 1974-09-27 Multilayer ceramic substrate structure

Publications (2)

Publication Number Publication Date
USB509772I5 true USB509772I5 (en) 1976-03-16
US3999004A US3999004A (en) 1976-12-21

Family

ID=24028031

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/509,772 Expired - Lifetime US3999004A (en) 1974-09-27 1974-09-27 Multilayer ceramic substrate structure

Country Status (5)

Country Link
US (1) US3999004A (en)
JP (1) JPS5153509A (en)
DE (1) DE2538454A1 (en)
FR (1) FR2286580A1 (en)
GB (1) GB1488301A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5657811A (en) * 1993-06-04 1997-08-19 Pcc Composites, Inc. Cast-in hermetic electrical feed-throughs

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
US4096626A (en) * 1976-12-27 1978-06-27 International Business Machines Corporation Method of making multi-layer photosensitive glass ceramic charge plate
US4327247A (en) * 1978-10-02 1982-04-27 Shin-Kobe Electric Machinery Co., Ltd. Printed wiring board
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US4336088A (en) * 1980-06-30 1982-06-22 International Business Machines Corp. Method of fabricating an improved multi-layer ceramic substrate
US4302625A (en) * 1980-06-30 1981-11-24 International Business Machines Corp. Multi-layer ceramic substrate
US4340618A (en) * 1981-03-20 1982-07-20 International Business Machines Corporation Process for forming refractory metal layers on ceramic substrate
GB2096502B (en) * 1981-04-09 1985-06-26 Rolls Royce Making refractory articles eg casting moulds and cases
US4441075A (en) * 1981-07-02 1984-04-03 International Business Machines Corporation Circuit arrangement which permits the testing of each individual chip and interchip connection in a high density packaging structure having a plurality of interconnected chips, without any physical disconnection
US4503386A (en) * 1982-04-20 1985-03-05 International Business Machines Corporation Chip partitioning aid (CPA)-A structure for test pattern generation for large logic networks
GB2176942A (en) * 1983-11-10 1987-01-07 Donald Fort Sullivan Making printed circuit boards
US4510000A (en) * 1983-11-30 1985-04-09 International Business Machines Corporation Method for palladium activating molybdenum metallized features on a ceramic substrate
FR2556503B1 (en) * 1983-12-08 1986-12-12 Eurofarad ALUMINA INTERCONNECTION SUBSTRATE FOR ELECTRONIC COMPONENT
US4660150A (en) * 1984-02-16 1987-04-21 Hewlett-Packard Company Spectrum analyzer with improved data analysis and display features
JPS6179570U (en) * 1984-10-31 1986-05-27
FR2575331B1 (en) * 1984-12-21 1987-06-05 Labo Electronique Physique HOUSING FOR ELECTRONIC COMPONENT
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
US5234641A (en) * 1988-05-06 1993-08-10 Avx Corporation Method of making varistor or capacitor
US5091218A (en) * 1989-03-06 1992-02-25 Motorola, Inc. Method for producing a metallized pattern on a substrate
US5132879A (en) * 1990-10-01 1992-07-21 Hewlett-Packard Company Secondary board for mounting of components having differing bonding requirements
US5283104A (en) * 1991-03-20 1994-02-01 International Business Machines Corporation Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
US5302219A (en) * 1991-04-03 1994-04-12 Coors Electronic Package Company Method for obtaining via patterns in ceramic sheets
JP2767670B2 (en) * 1992-09-03 1998-06-18 株式会社村田製作所 Electronic component chip holder and electronic component chip electrode forming method using the same
DE4240812A1 (en) * 1992-12-04 1994-06-09 Bosch Gmbh Robert Heater arrangement for a sensor for determining components in gases
US5456942A (en) * 1993-09-29 1995-10-10 Motorola, Inc. Method for fabricating a circuit element through a substrate
US5459287A (en) * 1994-05-18 1995-10-17 Dell Usa, L.P. Socketed printed circuit board BGA connection apparatus and associated methods
JP2891875B2 (en) * 1994-06-09 1999-05-17 日本電気株式会社 Liquid crystal display
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5827386A (en) * 1996-06-14 1998-10-27 International Business Machines Corporation Method for forming a multi-layered circuitized substrate member
US6103992A (en) * 1996-11-08 2000-08-15 W. L. Gore & Associates, Inc. Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
US5731047A (en) * 1996-11-08 1998-03-24 W.L. Gore & Associates, Inc. Multiple frequency processing to improve electrical resistivity of blind micro-vias
US6016005A (en) * 1998-02-09 2000-01-18 Cellarosi; Mario J. Multilayer, high density micro circuit module and method of manufacturing same
US7480988B2 (en) 2001-03-30 2009-01-27 Second Sight Medical Products, Inc. Method and apparatus for providing hermetic electrical feedthrough
KR20030074582A (en) * 2003-09-03 2003-09-19 학교법인 한국정보통신학원 Method for manufacturing multi chip module and multi chip module structure
DE102004020329A1 (en) * 2004-04-26 2005-11-10 Epcos Ag Electrical functional unit and method for its production
CN101351855B (en) * 2006-04-05 2011-08-31 株式会社村田制作所 Method for manufacturing laminated ceramic electronic component and laminated ceramic electronic component
JP5511557B2 (en) * 2010-07-08 2014-06-04 セイコーインスツル株式会社 Glass substrate manufacturing method and electronic component manufacturing method
JP2012019108A (en) * 2010-07-08 2012-01-26 Seiko Instruments Inc Method for manufacturing glass substrate and method for manufacturing electronic component
DE102018122940A1 (en) * 2018-09-19 2020-03-19 HELLA GmbH & Co. KGaA Sensor arrangement for measuring the temperature of a pane

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1386216A (en) * 1963-04-25 1965-01-22 Rca Corp Multilayer electrical circuits
DE1301378B (en) * 1966-03-30 1969-08-21 Ibm Process for the production of multilayer electrical circuit elements on a ceramic basis
US3852877A (en) * 1969-08-06 1974-12-10 Ibm Multilayer circuits
US3661638A (en) * 1970-05-26 1972-05-09 Photocircuits Corp Process for uniformly coating printed circuit board through holes
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
US3699919A (en) * 1971-03-16 1972-10-24 Chemcut Corp Apparatus for leveling solder in holes of printed circuit boards
DE2243432A1 (en) * 1972-09-04 1974-03-14 Schneider METHOD FOR ESTABLISHING A CONTACT CONNECTION BETWEEN ELECTRICAL CONDUCTORS ON BOTH SIDES OF A DIELECTRIC

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5657811A (en) * 1993-06-04 1997-08-19 Pcc Composites, Inc. Cast-in hermetic electrical feed-throughs

Also Published As

Publication number Publication date
FR2286580B1 (en) 1978-04-07
GB1488301A (en) 1977-10-12
FR2286580A1 (en) 1976-04-23
DE2538454A1 (en) 1976-04-15
JPS5153509A (en) 1976-05-12
US3999004A (en) 1976-12-21

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