USB437450I5 - - Google Patents

Info

Publication number
USB437450I5
USB437450I5 US43745074A USB437450I5 US B437450 I5 USB437450 I5 US B437450I5 US 43745074 A US43745074 A US 43745074A US B437450 I5 USB437450 I5 US B437450I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US437450*A priority Critical patent/US3922479A/en
Publication of USB437450I5 publication Critical patent/USB437450I5/en
Application granted granted Critical
Publication of US3922479A publication Critical patent/US3922479A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
US437450*A 1971-09-15 1974-01-28 Coaxial circuit construction and method of making Expired - Lifetime US3922479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US437450*A US3922479A (en) 1971-09-15 1974-01-28 Coaxial circuit construction and method of making

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18088671A 1971-09-15 1971-09-15
US437450*A US3922479A (en) 1971-09-15 1974-01-28 Coaxial circuit construction and method of making

Publications (2)

Publication Number Publication Date
USB437450I5 true USB437450I5 (en) 1975-01-28
US3922479A US3922479A (en) 1975-11-25

Family

ID=26876710

Family Applications (1)

Application Number Title Priority Date Filing Date
US437450*A Expired - Lifetime US3922479A (en) 1971-09-15 1974-01-28 Coaxial circuit construction and method of making

Country Status (1)

Country Link
US (1) US3922479A (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153988A (en) * 1977-07-15 1979-05-15 International Business Machines Corporation High performance integrated circuit semiconductor package and method of making
US4157407A (en) * 1978-02-13 1979-06-05 E. I. Du Pont De Nemours And Company Toning and solvent washout process for making conductive interconnections
US4576900A (en) * 1981-10-09 1986-03-18 Amdahl Corporation Integrated circuit multilevel interconnect system and method
US4888450A (en) * 1981-12-11 1989-12-19 At&T Bell Laboratories Circuit board fabrication leading to increased capacity
EP0096701B1 (en) * 1981-12-11 1989-08-30 Western Electric Company, Incorporated Circuit board fabrication leading to increased capacity
US4706167A (en) * 1983-11-10 1987-11-10 Telemark Co., Inc. Circuit wiring disposed on solder mask coating
US4566186A (en) * 1984-06-29 1986-01-28 Tektronix, Inc. Multilayer interconnect circuitry using photoimageable dielectric
US4665468A (en) * 1984-07-10 1987-05-12 Nec Corporation Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
US4876322A (en) * 1984-08-10 1989-10-24 Siemens Aktiengesselschaft Irradiation cross-linkable thermostable polymer system, for microelectronic applications
ATE43924T1 (en) * 1984-08-10 1989-06-15 Siemens Ag THERMO-STABLE POLYMER SYSTEM CROSS-LINKABLE BY RADIATION FOR MICROELECTRONIC APPLICATIONS.
US4729510A (en) * 1984-11-14 1988-03-08 Itt Corporation Coaxial shielded helical delay line and process
US4673904A (en) * 1984-11-14 1987-06-16 Itt Corporation Micro-coaxial substrate
US4647882A (en) * 1984-11-14 1987-03-03 Itt Corporation Miniature microwave guide
US4647878A (en) * 1984-11-14 1987-03-03 Itt Corporation Coaxial shielded directional microwave coupler
EP0204292B1 (en) * 1985-06-05 1991-05-29 Siemens Aktiengesellschaft Process for the production of printed circuits using a photopolymerisable system
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
US5302494A (en) * 1985-06-10 1994-04-12 The Foxboro Company Multilayer circuit board having microporous layers and process for making same
US4816616A (en) * 1987-12-10 1989-03-28 Microelectronics Center Of North Carolina Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes
US4889962A (en) * 1988-08-19 1989-12-26 Northern Telecom Limited Circuit board with coaxial circuit and method therefor
JP2840271B2 (en) * 1989-01-27 1998-12-24 キヤノン株式会社 Recording head
US5219669A (en) * 1990-04-26 1993-06-15 International Business Machines Corporation Layer thin film wiring process featuring self-alignment of vias
JPH05226833A (en) * 1992-02-17 1993-09-03 Toshiba Corp Manufacture of printed circuit board
US5363550A (en) * 1992-12-23 1994-11-15 International Business Machines Corporation Method of Fabricating a micro-coaxial wiring structure
FI106585B (en) * 1997-10-22 2001-02-28 Nokia Mobile Phones Ltd Coaxial cable, a method for making a coaxial cable, and wireless communication
US6387810B2 (en) * 1999-06-28 2002-05-14 International Business Machines Corporation Method for homogenizing device parameters through photoresist planarization
JP2001332859A (en) * 2000-05-22 2001-11-30 Murata Mfg Co Ltd Laminate type ceramic electronic component and its manufacturing method, as well as electronic device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3366519A (en) * 1964-01-20 1968-01-30 Texas Instruments Inc Process for manufacturing multilayer film circuits
US3391454A (en) * 1965-03-10 1968-07-09 Litton Systems Inc Shielded etched circuit conductor
US3508325A (en) * 1965-01-25 1970-04-28 Texas Instruments Inc Method of making insulation structures for crossover leads in integrated circuitry

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3366519A (en) * 1964-01-20 1968-01-30 Texas Instruments Inc Process for manufacturing multilayer film circuits
US3508325A (en) * 1965-01-25 1970-04-28 Texas Instruments Inc Method of making insulation structures for crossover leads in integrated circuitry
US3391454A (en) * 1965-03-10 1968-07-09 Litton Systems Inc Shielded etched circuit conductor

Also Published As

Publication number Publication date
US3922479A (en) 1975-11-25

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Legal Events

Date Code Title Description
AS Assignment

Owner name: ALLIED CORPORATION COLUMBIA ROAD AND PARK AVENUE,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:BUNKER RAMO CORPORATION A CORP. OF DE;REEL/FRAME:004149/0365

Effective date: 19820922

AS Assignment

Owner name: EATON CORPORATION AN OH CORP

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:ALLIED CORPORATION A NY CORP;REEL/FRAME:004261/0983

Effective date: 19840426