USB319339I5 - - Google Patents

Info

Publication number
USB319339I5
USB319339I5 US31933972A USB319339I5 US B319339 I5 USB319339 I5 US B319339I5 US 31933972 A US31933972 A US 31933972A US B319339 I5 USB319339 I5 US B319339I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US319339A priority Critical patent/US3916056A/en
Priority to IT31563/73A priority patent/IT1001870B/en
Priority to CA188,005A priority patent/CA987789A/en
Priority to GB5855573A priority patent/GB1452116A/en
Priority to DE2363516A priority patent/DE2363516A1/en
Priority to JP49004888A priority patent/JPS4999481A/ja
Priority to FR7346517A priority patent/FR2212445B1/fr
Publication of USB319339I5 publication Critical patent/USB319339I5/en
Application granted granted Critical
Publication of US3916056A publication Critical patent/US3916056A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • ing And Chemical Polishing (AREA)
US319339A 1972-12-29 1972-12-29 Photomask bearing a pattern of metal plated areas Expired - Lifetime US3916056A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US319339A US3916056A (en) 1972-12-29 1972-12-29 Photomask bearing a pattern of metal plated areas
IT31563/73A IT1001870B (en) 1972-12-29 1973-11-21 METHOD OF DEPOSIT OF A CONFIGU RATION OF METALLIC AREAS
CA188,005A CA987789A (en) 1972-12-29 1973-12-12 Method of depositing a pattern of metal plated areas
GB5855573A GB1452116A (en) 1972-12-29 1973-12-18 Method of depositing a pattern of metal areas
DE2363516A DE2363516A1 (en) 1972-12-29 1973-12-20 METHOD OF MAKING A PATTERN WITH PARTIALLY PLATED AREAS
JP49004888A JPS4999481A (en) 1972-12-29 1973-12-25
FR7346517A FR2212445B1 (en) 1972-12-29 1973-12-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US319339A US3916056A (en) 1972-12-29 1972-12-29 Photomask bearing a pattern of metal plated areas

Publications (2)

Publication Number Publication Date
USB319339I5 true USB319339I5 (en) 1975-01-28
US3916056A US3916056A (en) 1975-10-28

Family

ID=23241833

Family Applications (1)

Application Number Title Priority Date Filing Date
US319339A Expired - Lifetime US3916056A (en) 1972-12-29 1972-12-29 Photomask bearing a pattern of metal plated areas

Country Status (7)

Country Link
US (1) US3916056A (en)
JP (1) JPS4999481A (en)
CA (1) CA987789A (en)
DE (1) DE2363516A1 (en)
FR (1) FR2212445B1 (en)
GB (1) GB1452116A (en)
IT (1) IT1001870B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1557064A (en) * 1976-09-09 1979-12-05 Mullard Ltd Masks suitable for use in electron image projectors
US4178403A (en) * 1977-08-04 1979-12-11 Konishiroku Photo Industry Co., Ltd. Mask blank and mask
US4284678A (en) * 1978-09-18 1981-08-18 Rockwell International Corporation High resolution mask and method of fabrication thereof
JPS55129347A (en) * 1979-03-28 1980-10-07 Chiyou Lsi Gijutsu Kenkyu Kumiai Photomask
US4411972A (en) * 1981-12-30 1983-10-25 International Business Machines Corporation Integrated circuit photomask
JPS5950443A (en) * 1982-09-16 1984-03-23 Hitachi Ltd X-ray mask
DE3435178A1 (en) * 1983-09-26 1985-04-04 Canon K.K., Tokio/Tokyo OBJECT WITH MASK STRUCTURE FOR LITHOGRAPHY
JP4556422B2 (en) * 2003-12-02 2010-10-06 パナソニック株式会社 Electronic component and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443915A (en) * 1965-03-26 1969-05-13 Westinghouse Electric Corp High resolution patterns for optical masks and methods for their fabrication
US3639143A (en) * 1969-02-19 1972-02-01 Ibm Electroless nickel plating on nonconductive substrates

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443915A (en) * 1965-03-26 1969-05-13 Westinghouse Electric Corp High resolution patterns for optical masks and methods for their fabrication
US3639143A (en) * 1969-02-19 1972-02-01 Ibm Electroless nickel plating on nonconductive substrates

Also Published As

Publication number Publication date
DE2363516A1 (en) 1974-07-04
FR2212445A1 (en) 1974-07-26
FR2212445B1 (en) 1979-04-27
JPS4999481A (en) 1974-09-19
US3916056A (en) 1975-10-28
GB1452116A (en) 1976-10-13
IT1001870B (en) 1976-04-30
CA987789A (en) 1976-04-20

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