US9738072B2 - Actuator, ink-jet head, and ink-jet device - Google Patents
Actuator, ink-jet head, and ink-jet device Download PDFInfo
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- US9738072B2 US9738072B2 US15/205,501 US201615205501A US9738072B2 US 9738072 B2 US9738072 B2 US 9738072B2 US 201615205501 A US201615205501 A US 201615205501A US 9738072 B2 US9738072 B2 US 9738072B2
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- vibration plate
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- 238000006722 reduction reaction Methods 0.000 claims abstract description 47
- 230000005764 inhibitory process Effects 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 8
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 158
- 239000010409 thin film Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 14
- 239000010949 copper Substances 0.000 description 12
- 239000011651 chromium Substances 0.000 description 10
- 238000004925 denaturation Methods 0.000 description 10
- 230000036425 denaturation Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 238000005323 electroforming Methods 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
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- 229920001721 polyimide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
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- 239000000203 mixture Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
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- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
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- H01L41/0533—
-
- H01L41/0815—
-
- H01L41/0973—
-
- H01L41/18—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Definitions
- the present disclosure relates to an actuator using a piezoelectric thin film, and an ink-jet head and an ink-jet device that use the actuator.
- An ink-jet device performs printing and drawing on a print surface by ejecting ink from an ink-jet head.
- the ink-jet head mounted on the ink-jet device includes a pressure chamber to be filled with ink, a flow path for guiding the ink to the pressure chamber, a nozzle communicated with the pressure chamber, and an actuator configured to apply pressure to the ink filled in the pressure chamber.
- the actuator is driven to increase pressure within the pressure chamber and eject the ink filled in the pressure chamber from the nozzle.
- the ink-jet head configured as described above can include a piezoelectric thin film as a drive source of the actuator.
- the piezoelectric thin film is formed opposite to the nozzle with the pressure chamber interposed between the piezoelectric thin film and the nozzle.
- the piezoelectric thin film deforms when voltage is applied on the piezoelectric thin film, and the volume of the pressure chamber decreases accordingly. This increases the pressure within the pressure chamber, so that the ink is ejected from the nozzle.
- Unexamined Japanese Patent Publication No. 2002-252390 discloses a method of forming a Ni alloy electrode for applying voltage to a piezoelectric body.
- a first aspect of the present disclosure relates to an actuator using a piezoelectric thin film.
- the actuator according to the first aspect includes a piezoelectric layer, a vibration plate, and a reduction inhibition layer.
- the piezoelectric layer includes an oxide material.
- the vibration plate is disposed below the piezoelectric layer, and configured to deform when the piezoelectric layer deforms.
- the reduction inhibition layer is disposed between the piezoelectric layer and the vibration plate, and configured to inhibit reduction reaction in the piezoelectric layer.
- the reduction inhibition layer inhibits reduction reaction in the piezoelectric layer. This prevents denaturation of the piezoelectric layer such as leakage current flowing in the piezoelectric layer even when the actuator is continuously used at high temperature. Accordingly, the characteristic of the actuator can be reliably maintained.
- the first aspect includes the “reduction inhibition layer disposed between the piezoelectric layer and the vibration plate”.
- Such a configuration also includes a configuration in which the reduction inhibition layer is disposed separately from the vibration plate, and a configuration in which the reduction inhibition layer is included in the vibration plate.
- a second aspect of the present disclosure relates to an ink-jet head.
- the ink-jet head according to the second aspect includes the actuator according to the first aspect, a pressure chamber, and a nozzle.
- the pressure chamber is filled with ink and configured to change the pressure of the ink when the actuator is driven.
- the nozzle is configured to eject the ink filled in the pressure chamber when the actuator is driven.
- a third aspect of the present disclosure relates to an ink-jet device.
- the ink-jet device according to the third aspect includes the ink-jet head according to the second aspect, and an ink supplying unit.
- the ink supplying unit is configured to supply ink to the ink-jet head.
- the second and third aspects can achieve the ink-jet head and the ink-jet device that are capable of preventing denaturation of the piezoelectric thin film even when used at high temperature.
- the present disclosure provides the actuator capable of preventing denaturation of the piezoelectric thin film even when used at high temperature, and the ink-jet head and the ink-jet device that include the actuator.
- FIG. 1A illustrates the configuration of an ink-jet head according to an exemplary embodiment
- FIG. 1B schematically illustrates a configuration in which an actuator and a structured body according to the exemplary embodiment are combined
- FIG. 2A is an enlarged view of part of the actuator and the structured body according to the exemplary embodiment
- FIG. 2B schematically illustrates a part including a main flow path and a pressure chamber
- FIG. 3A is a sectional view of the configuration of the actuator and the structured body according to a comparative example
- FIG. 3B is a sectional view of the configuration of the actuator and the structured body according to the comparative example
- FIG. 4A is a sectional view of the configuration of the actuator and the structured body according to Example 1;
- FIG. 4B is a sectional view of the configuration of the actuator and the structured body according to Example 1;
- FIG. 5 is a sectional view of the configuration of the actuator near the pressure chamber according to Example 1;
- FIG. 6A is a sectional view of the configuration of the actuator and the structured body according to Example 2;
- FIG. 6B is a sectional view of the configuration of the actuator and the structured body according to Example 2;
- FIG. 7 is a sectional view of the configuration of the actuator according to Example 2 near the pressure chamber;
- FIG. 8 illustrates a measurement result of leakage current in the actuator having each of the configurations of the comparative example and Examples 1 and 2;
- FIG. 9 is a block diagram of the configuration of an ink-jet device according to the exemplary embodiment.
- FIG. 10 is a sectional view of the configuration of the actuator according to a modification near the pressure chamber.
- the present disclosure provides an actuator capable of preventing denaturation of the piezoelectric thin film when used at high temperature, and an ink-jet head and an ink-jet device that use the actuator.
- each drawing includes mutually orthogonal X, Y, and Z axes.
- the Z-axis direction is aligned with the height direction of ink-jet head 1
- the positive Z-axis direction points the downward direction.
- the X-axis direction is aligned with the thickness direction of ink-jet head 1
- the Y-axis direction is aligned with the width direction of ink-jet head 1 .
- Ink-jet head 1 ejects ink in the positive Z-axis direction (downward direction).
- FIG. 1A illustrates the configuration of ink-jet head 1 according to an exemplary embodiment.
- FIG. 1B schematically illustrates a configuration in which actuator 30 and structured body 40 according to the exemplary embodiment are combined.
- ink-jet head 1 includes housing box 10 and head base 20 .
- Housing box 10 is detachably attached to head base 20 .
- Housing box 10 is a rectangular box with no lower surface. Notch 10 a communicated with the inside of housing box 10 is provided on upper surface of housing box 10 . Circuit board 11 is housed in housing box 10 through notch 10 a . Drive circuit for driving actuator 30 is mounted on circuit board 11 .
- Head base 20 is a frame having vertically penetrating rectangular opening 20 a at a central part. Circular holes 20 b continuous with opening 20 a are provided on positive and negative Y-axis sides of opening 20 a . Actuator 30 and structured body 40 illustrated in FIG. 1B are installed at the lower end of opening 20 a . Actuator 30 is electrically connected with circuit board 11 in opening 20 a . Holes 20 b are used to guide an ink-supplying tube (not illustrated) to the inside of opening 20 a.
- actuator 30 is a plate having a rectangular outline. Actuator 30 is placed on the upper surface of structured body 40 .
- Structured body 40 is a plate having a rectangular outline. Structured body 40 is provided with four main flow paths 51 arranged side by side in the X-axis direction.
- ink supply inlets 31 are formed side by side in the X-axis direction at each of end parts of actuator 30 on the positive and negative Y-axis sides. Each pair of ink supply inlets 31 opposite to each other in the Y-axis direction is connected with corresponding main flow path 51 .
- a groove is formed on the back surface of actuator 30 .
- Actuator 30 is placed on plate-shape structured body 40 to form pressure chamber 52 between the upper surface of structured body 40 and the groove on the back surface of actuator 30 .
- Pressure chamber 52 is connected with main flow path 51 through communicating flow path 53 (refer to FIG. 2B ) formed in structured body 40 .
- FIG. 2A is an enlarged view of an end part of the configuration in FIG. 1B on the positive Y-axis side.
- each main flow path 51 is connected with corresponding ink supply inlets 31 at its ends.
- a large number of pressure chambers 52 are arranged along main flow path 51 , each pressure chamber 52 being connected with main flow path 51 through communicating flow path 53 .
- ink supply inlets 31 are each fitted with a pipe (not illustrated) to which the ink-supplying tube (not illustrated) is connected.
- the pipe is supported by a support disposed in opening 20 a , and the tube connected with the pipe extends to the outside through one of holes 20 b .
- Ink is supplied to each ink supply inlet 31 through the ink-supplying tube and the pipe. Then, the ink is supplied to pressure chamber 52 through main flow path 51 and communicating flow path 53 .
- Ink of the same color is supplied to two ink supply inlets 31 opposite to each other in the Y-axis direction, and ink of mutually different colors is supplied to four ink supply inlets 31 arranged side by side in X-axis direction.
- ink of four colors is supplied to actuator 30 . Accordingly, ink of the same color fills pressure chambers 52 disposed opposite to each other in the Y-axis direction, and ink of mutually different colors fills pressure chambers 52 arranged side by side in the X-axis direction.
- FIG. 2B is a sectional view schematically illustrating part of a section of the configuration in FIG. 2A along a plane parallel to the X-Z plane at a central position of pressure chamber 52 in the Y-axis direction.
- Ink 60 flowed into main flow path 51 passes through communicating flow path 53 to fill pressure chamber 52 .
- Structured body 40 has upper member 40 a including main flow path 51 and communicating flow path 53 , and lower member 40 b including nozzle 41 .
- Lower member 40 b is provided with a circular hole serving as nozzle 41 on a flow path extending in the positive Z-axis direction from pressure chamber 52 .
- Nozzle 41 has a diameter that gradually decreases toward the positive Z-axis direction but is constant near the exit.
- Actuator 30 is provided with, above pressure chamber 52 , piezoelectric drive unit 32 that is deformable in the vertical direction (Z-axis direction).
- piezoelectric drive unit 32 When piezoelectric drive unit 32 deforms downward, the volume of pressure chamber 52 decreases and the pressure of ink 60 filled in pressure chamber 52 increases. Accordingly, droplet 61 of ink 60 is ejected from nozzle 41 . Piezoelectric drive unit 32 is individually provided to each pressure chamber 52 shown in FIG. 1B .
- piezoelectric drive unit 32 includes a piezoelectric layer made of a piezoelectric thin film, and a vibration plate configured to deform when the piezoelectric layer deforms.
- FIGS. 3A and 3B are each a sectional view schematically illustrating the configuration of actuator 30 and structured body 40 according to the comparative example.
- FIGS. 3A and 3B are each a sectional view of the configuration of the comparative example along a plane parallel to the Y-Z plane at a position corresponding to plane IVA-IVA in FIG. 2A .
- FIG. 3A illustrates a state before actuator 30 is placed on structured body 40
- FIG. 3B illustrates a state after actuator 30 is placed on structured body 40 .
- actuator 30 has a structure stacking electrode 101 , insulating layer 102 , piezoelectric layer 103 , vibration plate 104 , and flow-path forming layer 105 .
- Electrode 101 is an upper electrode for applying voltage to piezoelectric layer 103 .
- Insulating layer 102 is a layer for insulating electrode 101 from piezoelectric layer 103 .
- Piezoelectric layer 103 is a piezoelectric thin film that vertically deforms when voltage is applied to the piezoelectric thin film, and piezoelectric layer 103 is made of, for example, material including oxide such as lead zirconate titanate (PZT).
- PZT lead zirconate titanate
- Vibration plate 104 is a layer that deforms when piezoelectric layer 103 deforms, and includes a stack of a layer containing chromium (Cr) and a layer containing copper (Cu). Vibration plate 104 is also used as a lower electrode for applying voltage to piezoelectric layer 103 .
- Flow-path forming layer 105 is a layer for forming groove 105 a on the back surface of actuator 30 , and is made of, for example, Ni. As illustrated in FIG. 3B , actuator 30 is placed on structured body 40 so that groove 105 a of flow-path forming layer 105 is blocked by structured body 40 . This forms pressure chamber 52 as described above.
- ink-jet head 1 a need for use of ink-jet head 1 at various temperatures has been increasing. For example, a higher temperature of ink-jet head 1 enables use of ink having a viscosity higher than normal ink. Such a need, however, requires ink-jet head 1 to be usable with no degradation in its characteristic under various environments.
- the occurrence of reduction reaction in piezoelectric layer 103 causes denaturation of piezoelectric layer 103 and generates a current flowing path in piezoelectric layer 103 . Accordingly, leakage current flows in piezoelectric layer 103 , which causes reduction in the drive power of piezoelectric layer 103 from a desired drive power.
- the inventors of the present application assumed that the reduction reaction described above is caused by movement of oxygen in piezoelectric layer 103 when attracted by a metal layer such as the copper (Cu) layer, which is easily oxidized, included in vibration plate 104 .
- FIG. 4A is a sectional view schematically illustrating the configuration of actuator 30 and structured body 40 according to Example 1.
- FIG. 4A is a sectional view of actuator 30 along a plane parallel to the Y-Z plane at a position of IVA-IVA in FIG. 2A .
- the configuration shown in FIG. 4A has a configuration, differing from the configuration of the comparative example, in which insulating layer 106 and reduction inhibition layer 107 are disposed between piezoelectric layer 103 and vibration plate 104 .
- Insulating layer 106 is a layer for insulation in the same manner as insulating layer 102 .
- the material of insulating layer 106 may be composite oxide of PZT added with Nb, La, Sb, Sr, Mn, Mg, or Ni, for example, or may be metallic oxide (magnesium oxide, aluminum oxide, or titanium oxide). This is the same for the material of insulating layer 102 .
- Reduction inhibition layer 107 is a layer for preventing movement of oxygen from piezoelectric layer 103 to the Cu layer of vibration plate 104 .
- Reduction inhibition layer 107 is made of, for example, material mainly containing Ni.
- the material of reduction inhibition layer 107 may be any other material that enables the prevention of the movement of oxygen from piezoelectric layer 103 to the Cu layer of vibration plate 104 .
- Reduction inhibition layer 107 only needs to be disposed closer to piezoelectric layer 103 than the Cu layer of vibration plate 104 , and thus, for example, reduction inhibition layer 107 may be included in vibration plate 104 .
- the configuration in FIG. 4A may further include any other layer.
- FIG. 4B illustrates an exemplary configuration where the configuration in FIG. 4A additionally includes adhesion layer 108 , ink stopping layer 109 , and electroforming foundation layer 110 .
- Adhesion layer 108 is a layer for achieving more excellent formation of the Cr layer located closer to insulating layer 106 within vibration plate 104 .
- Ink stopping layer 109 is a layer for preventing ink from reaching vibration plate 104 from pressure chamber 52 , and is made of acrylic resin or polyimide.
- Electroforming foundation layer 110 is a foundation layer for facilitating formation of flow-path forming layer 105 by electroforming, and is made of, for example, Ni.
- FIG. 5 illustrates a specific exemplary configuration of actuator 30 according to Example 1.
- actuator 30 has a structure stacking electrode 101 , insulating layer 102 , piezoelectric layer 103 , vibration plate 104 , flow-path forming layer 105 , insulating layer 106 , reduction inhibition layer 107 , ink stopping layer 109 , electroforming foundation layer 110 , and interlayer insulating layer 111 .
- Vibration plate 104 includes Cr layer 104 a mainly containing Cr and Cu layer 104 b mainly containing Cu. Reduction inhibition layer 107 is disposed between Cr layer 104 a and Cu layer 104 b .
- Interlayer insulating layer 111 is an insulating layer for wiring and is made of light-sensitive polyimide. The same materials as described above are used for electrode 101 , insulating layer 102 , piezoelectric layer 103 , flow-path forming layer 105 , insulating layer 106 , reduction inhibition layer 107 , ink stopping layer 109 , and electroforming foundation layer 110 .
- electrode 101 In manufacturing of actuator 30 , electrode 101 , insulating layer 102 , piezoelectric layer 103 , the layers of vibration plate 104 , insulating layer 106 , reduction inhibition layer 107 , ink stopping layer 109 , and electroforming foundation layer 110 are formed by a sputtering process.
- Interlayer insulating layer 111 is formed by, for example, applying light-sensitive polyimide to be cured.
- Flow-path forming layer 105 is formed by electroforming.
- FIGS. 6A and 6B are each a sectional view schematically illustrating the configuration of actuator 30 and structured body 40 according to Example 2.
- FIGS. 6A and 6B are each a sectional view of actuator 30 along a plane parallel to the Y-Z plane at a position corresponding to plane IVA-IVA in FIG. 2A .
- the configuration shown in FIGS. 6A and 6B does not have insulating layer 106 , which is included in the configuration shown in FIGS. 4A and 4B according to Example 1.
- the configuration shown in FIGS. 6A and 6B is the same as the configuration shown in FIGS. 4A and 4B according to Example 1 except for insulating layer 106 .
- FIG. 7 illustrates a specific exemplary configuration of actuator 30 according to Example 2.
- the exemplary configuration shown in FIG. 7 does not have insulating layer 106 , which is included in the configuration shown in FIG. 5 according to Example 1.
- the configuration shown in FIG. 7 is the same as the configuration shown in FIG. 5 according to Example 1 except for insulating layer 106 .
- the process of manufacturing actuator 30 according to Example 2 does not have the forming process of insulating layer 106 , which is included in the manufacturing process according to Example 1.
- the inventors of the present application measured leakage current flowing in piezoelectric layer 103 when actuators 30 according to the comparative example and Examples 1 and 2 are continuously driven.
- actuators 30 according to Examples 1 and 2 had the configurations shown in FIGS. 5 and 7 .
- Actuator 30 according to the comparative example did not have insulating layer 106 and reduction inhibition layer 107 , which are included in the configuration shown in FIG. 5 according to Example 1.
- Voltage at 35 V was continuously applied to 800 electrodes 101 associated with 800 pressure chambers 52 to measure leakage current flowing in each electrode 101 .
- Actuator 30 was subjected to a temperature of 50° C. in an accelerated test to shorten experiment time.
- FIG. 8 is a graph illustrating an experiment result.
- the horizontal axis represents a time (driving time) in which the voltage was continuously applied to each electrode 101
- the vertical axis represents current (leakage current) flowing in electrodes 101 .
- the leakage current on the vertical axis is an average current flowing in electrodes 101 .
- the leakage current started flowing in piezoelectric layer 103 in a driving time no longer than 100 hours.
- the leakage current started flowing in piezoelectric layer 103 in a driving time just exceeding 300 hours, which is significantly long as compared to the driving time in the comparative example. This indicates that reduction inhibition layer 107 is effective in preventing the leakage current.
- Example 1 the leakage current did not flow in piezoelectric layer 103 in a driving time exceeding 1000 hours, which indicates that the characteristic of piezoelectric layer 103 was excellently maintained. This confirms that insulating layer 106 together with reduction inhibition layer 107 provide a significant effect in the prevention of the leakage current.
- FIG. 9 is a block diagram of the configuration of an ink-jet device according to the exemplary embodiment.
- the ink-jet device includes ink-jet head 1 configured as described above, ink supplying unit 2 , controller 3 , and interface 4 .
- Ink supplying unit 2 includes the above-described tube for supplying ink to ink-jet head 1 , an ink tank connected with the tube, and a pump for supplying ink from the ink tank to the tube.
- Controller 3 includes a CPU and a memory, and controls ink-jet head 1 and ink supplying unit 2 in accordance with a computer program stored in the memory.
- Interface 4 receives an input of drawing information such as characters and figures to be printed, and outputs this drawing information to controller 3 .
- Controller 3 controls ink-jet head 1 in accordance with the input drawing information so as to perform printing and drawing on a print surface.
- Reduction inhibition layer 107 inhibits reduction reaction in piezoelectric layer 103 . As illustrated in FIG. 8 , this prevents denaturation of piezoelectric layer 103 such as leakage current flowing in piezoelectric layer 103 even when actuator 30 is continuously used at high temperature. Thus, the characteristic of actuator 30 can be reliably maintained.
- insulating layer 106 is disposed between vibration plate 104 and piezoelectric layer 103 . As illustrated in FIG. 8 , this can prevent the denaturation of piezoelectric layer 103 more significantly. Thus, the characteristic of actuator 30 can be reliably maintained.
- Insulating layer 102 is disposed between piezoelectric layer 103 and electrode 101 disposed above piezoelectric layer 103 . This can prevent the movement of oxygen from piezoelectric layer 103 to electrode 101 , thereby effectively preventing the denaturation of piezoelectric layer 103 .
- Vibration plate 104 also serves as an electrode disposed below piezoelectric layer 103 . This eliminates the need to provide an additional electrode, thereby achieving a simplified configuration of actuator 30 .
- reduction inhibition layer 107 made of Ni is disposed between Cr layer 104 a and Cu layer 104 b .
- the same effect illustrated in FIG. 8 is also expected, when reduction inhibition layer 107 made of Ni is disposed between Cr layer 104 a and insulating layer 106 as illustrated in FIG. 10 .
- reduction inhibition layer 107 made of Ni is disposed between Cr layer 104 a and Cu layer 104 b .
- the same effect illustrated in FIG. 8 is also expected, when reduction inhibition layer 107 made of Ni is disposed between Cr layer 104 a and piezoelectric layer 103 .
- FIGS. 4B and 6B may be additionally provided to the exemplary configurations in FIGS. 5 and 7 as appropriate.
- any layer may be omitted from the exemplary configurations in FIGS. 5 and 7 as appropriate.
- the same effect illustrated in FIG. 8 is expected also in these cases.
- the number of layers in vibration plate 104 and the composition of each layer are changeable as appropriate.
- the configuration and composition of piezoelectric layer 103 are changeable as appropriate.
- Ink is supplied from two ink supply inlets 31 disposed opposite to each other in Y-axis direction in the configuration in FIG. 1B .
- one ink supply inlet 31 may be provided for one main flow path, or a flow path and an ink ejection outlet may be provided for ejecting ink flowing from ink supply inlet 31 through pressure chamber 52 .
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2015149009A JP6520526B2 (en) | 2015-07-28 | 2015-07-28 | Actuator, inkjet head and inkjet apparatus |
JP2015-149009 | 2015-07-28 |
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US20170028727A1 US20170028727A1 (en) | 2017-02-02 |
US9738072B2 true US9738072B2 (en) | 2017-08-22 |
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US15/205,501 Active US9738072B2 (en) | 2015-07-28 | 2016-07-08 | Actuator, ink-jet head, and ink-jet device |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002252390A (en) | 2001-02-27 | 2002-09-06 | Murata Mfg Co Ltd | Electrode-forming method for piezoelectric component |
US20110228015A1 (en) * | 2010-03-18 | 2011-09-22 | Seiko Epson Corporation | Droplet-ejecting head, method for manufacturing droplet-ejecting head, and droplet-ejecting apparatus |
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JP2008041921A (en) * | 2006-08-07 | 2008-02-21 | Matsushita Electric Ind Co Ltd | Piezoelectric thin film element and its manufacturing method, as well as ink jet head and ink jet-type recorder |
JP2008105216A (en) * | 2006-10-24 | 2008-05-08 | Matsushita Electric Ind Co Ltd | Inkjet head and inkjet recording apparatus |
JP5707907B2 (en) * | 2010-12-06 | 2015-04-30 | 株式会社リコー | Piezoelectric actuator, droplet discharge head, and droplet discharge device |
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2015
- 2015-07-28 JP JP2015149009A patent/JP6520526B2/en active Active
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