US964096A - Process for electroplating. - Google Patents
Process for electroplating. Download PDFInfo
- Publication number
- US964096A US964096A US30678106A US1906306781A US964096A US 964096 A US964096 A US 964096A US 30678106 A US30678106 A US 30678106A US 1906306781 A US1906306781 A US 1906306781A US 964096 A US964096 A US 964096A
- Authority
- US
- United States
- Prior art keywords
- chlorin
- hydrogen
- time
- plating
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009713 electroplating Methods 0.000 title description 5
- 238000000034 method Methods 0.000 title description 3
- SURLGNKAQXKNSP-DBLYXWCISA-N chlorin Chemical compound C\1=C/2\N/C(=C\C3=N/C(=C\C=4NC(/C=C\5/C=CC/1=N/5)=CC=4)/C=C3)/CC\2 SURLGNKAQXKNSP-DBLYXWCISA-N 0.000 description 14
- 229910052739 hydrogen Inorganic materials 0.000 description 12
- 239000001257 hydrogen Substances 0.000 description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Definitions
- My object is to provide an imprloved process of electroplating, whereby I very largely eliminate the occlusion of hydrogen, as well as the formation of hydrogen bubbles on the deposited surfaces, and in consequence I am enabled to carry on a plating operation at a much higher rate than is now possible, and
- the invention resides in the fact that by maintaining in the plating bath a small quantity of material which will combine with the hydrogen, for example, free chlorin, the latter will combine with any hydrogen set free by the electrolytic action, or otherwise, thereby preventing the formation of metallic hydrates as well as the occlusion of thegas, and eliminating also the appearance of microscopic bubbles thereof, which cling to the deposited surfaces with the objections-pointed out.
- free chlorin When free chlorin is thus presentinthe bath, it combines with any hydrogen generated therein to form hydrochloric acid, although it is possible that other favorablereactions may be brought about by the presenceof free chlorin.
- the chlorin may be added to the plating bath in anysuitable way, such, for example, as by passing the gas continuously, or at suitable intervals, through the bath; by adding to thebath, watersaturatedwith chlorin, or by adding from time-"t0 time fresh-quantities of'the electrolyte saturatedwith chlorin.
- the chlorin can be added by chlorinating a suitable quantity of .-the solution, which can be added from time to time in small amounts to the solution as the chlordn becomes exhausted. In practice, the solution should have alslightly acid re.- action.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
THOMAS A. EDISON, OF LLEWELLYN PARK, ORANGE, NEW JERSEY.
'rnocnss or nLEcTnorLA'iING.
aeaoaa No Drawing.
Specification of-I etters Patent. Application filed March 19, 1906. Serial No. 306,781.-
Patented July 12, 1910.
To all whom it may concern:
' Be it known that 1,1IKO1WIAS A. EDISON, a
citizen of the United States, residing at Llewellyn Park, Orange, county of Essex,-
and State'of New Jersey, have invented a certain new and useful Process of Electroplating, of which the following is a description.
In carrying on experimental and commercial operations in connection with electro= plating, I find that the occlusion of hydrogen tends to make the deposit somewhat brittle and more or lessporous, and that hydrogen gas clings to the surfaces of the deposited metal in the form of very fine bubbles, thereby making the surfaces more or. less warty and rough. The presence of occluded hydrogen, aswell as of the hydrogen bubbles referred to, prevents the deposition at a high rate, and also results in Streaky and uneven deposits.
My object is to provide an imprloved process of electroplating, whereby I very largely eliminate the occlusion of hydrogen, as well as the formation of hydrogen bubbles on the deposited surfaces, and in consequence I am enabled to carry on a plating operation at a much higher rate than is now possible, and
at the same time with the production of a better quality of deposit, less brittle in character, practically free of pores, andwith a smooth and uniform surface.
' The invention resides in the fact that by maintaining in the plating bath a small quantity of material which will combine with the hydrogen, for example, free chlorin, the latter will combine with any hydrogen set free by the electrolytic action, or otherwise, thereby preventing the formation of metallic hydrates as well as the occlusion of thegas, and eliminating also the appearance of microscopic bubbles thereof, which cling to the deposited surfaces with the objections-pointed out. When free chlorin is thus presentinthe bath, it combines with any hydrogen generated therein to form hydrochloric acid, although it is possible that other favorablereactions may be brought about by the presenceof free chlorin. The chlorin may be added to the plating bath in anysuitable way, such, for example, as by passing the gas continuously, or at suitable intervals, through the bath; by adding to thebath, watersaturatedwith chlorin, or by adding from time-"t0 time fresh-quantities of'the electrolyte saturatedwith chlorin. For.instance, if copper is to be plated from a. solution of sulfate of copper, the chlorin can be added by chlorinating a suitable quantity of .-the solution, which can be added from time to time in small amounts to the solution as the chlordn becomes exhausted. In practice, the solution should have alslightly acid re.- action. I find that the eflect of the chlorin thus introduced into the bathlasts for several hours, when a fresh quantity must be added. In the case of a. chlorid bath (for carbon anode of very small surface can be connected to the metallic anode and made to continuously ehlorinate thesolution, as will be understood; Practically all of the chlorin,is utilized in combining with 'the hydrogen developed, there being very little loss of chlorin by its combination with either the anode or cathode. "Free bromin may also be employed, but with results that are far inferior to those secured when chlorin is used. The use of chlorin in cobalt plating baths is especially beneficial, and this is particularly true when cobalt-chlorid solutions are employed.
Having now described my invention, wha't I claim as newand desire to secure by Letters Patent is as follows 1. That improvement in the art of electroplating which consists in chlorinating a suitable quantity of copper sulfate solution, and adding from time to time in small amounts to thesolution in a copper. plating bath, 'as'the chlorin becomes exhausted by reaction with the hydrogen developed upon the cathode, substantially as set forth.
, 2. That improvement in the art of electro-plating which consists in chlorinating asuitable quantity of copper 'sulfate solution and addlng from time to time in small amounts to thmsolution in a copper'plating bath,;as the chlorin becomes exhausted by reaction with the hydrogen developed upbn slightly acid, substantially as set forth. the cathode, substantially as set forth. 10 3. That improvement in the art of elec- This specification signed and witnessed tro lating which consists in halogenizing a this 24th day of Febry 1906. 5 suitable quantity of copper sulfate solution, THOMAS A. EDISON. and addlng from time to time in small Witnesses: amounts to the solution in a cop er plating FRANK L. DYER,
bath, as the ,halogen becomes ex austed by ANNA R. KLEH the cathode, the solution being maintained reaction with the hydrogen developed upon
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30678106A US964096A (en) | 1906-03-19 | 1906-03-19 | Process for electroplating. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30678106A US964096A (en) | 1906-03-19 | 1906-03-19 | Process for electroplating. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US964096A true US964096A (en) | 1910-07-12 |
Family
ID=3032493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US30678106A Expired - Lifetime US964096A (en) | 1906-03-19 | 1906-03-19 | Process for electroplating. |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US964096A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2602774A (en) * | 1948-05-11 | 1952-07-08 | John F Beaver | Method of plating copper |
| US5181770A (en) * | 1989-04-19 | 1993-01-26 | Olin Corporation | Surface topography optimization through control of chloride concentration in electroformed copper foil |
-
1906
- 1906-03-19 US US30678106A patent/US964096A/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2602774A (en) * | 1948-05-11 | 1952-07-08 | John F Beaver | Method of plating copper |
| US5181770A (en) * | 1989-04-19 | 1993-01-26 | Olin Corporation | Surface topography optimization through control of chloride concentration in electroformed copper foil |
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