US9446539B2 - Conductive adhesive and method of forming same - Google Patents
Conductive adhesive and method of forming same Download PDFInfo
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- US9446539B2 US9446539B2 US13/309,845 US201113309845A US9446539B2 US 9446539 B2 US9446539 B2 US 9446539B2 US 201113309845 A US201113309845 A US 201113309845A US 9446539 B2 US9446539 B2 US 9446539B2
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- carbon nanotubes
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- conductive adhesive
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 70
- 239000000853 adhesive Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 52
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 233
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 139
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 139
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000005304 joining Methods 0.000 claims abstract description 19
- 229920000642 polymer Polymers 0.000 claims description 36
- 239000002243 precursor Substances 0.000 claims description 26
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 18
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 18
- 238000005406 washing Methods 0.000 claims description 11
- 239000004952 Polyamide Substances 0.000 claims description 10
- 229920002647 polyamide Polymers 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 6
- 238000005411 Van der Waals force Methods 0.000 description 9
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000003993 interaction Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 150000001470 diamides Chemical class 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 238000012643 polycondensation polymerization Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000008430 aromatic amides Chemical class 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
- B29C39/006—Monomers or prepolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- C01B31/022—
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23907—Pile or nap type surface or component
- Y10T428/23979—Particular backing structure or composition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Definitions
- the present disclosure generally relates to conductive adhesives and methods of forming a conductive adhesive.
- Conductive adhesives are often useful for joining conductive surfaces of electrically- and/or thermally-conductive applications.
- a conductive adhesive may be useful for joining two surfaces of a semiconductor.
- Such conductive adhesives not only adhere two surfaces together, but also readily conduct electrical and/or thermal energy.
- a method of forming a conductive adhesive for removably joining a first surface and a second surface includes condensation-polymerizing a carrier onto a plurality of carbon nanotubes each disposed on a substrate.
- Each of the plurality of carbon nanotubes has a first end and a second end spaced opposite the first end.
- the carrier is spaced apart from the substrate so that each of the plurality of carbon nanotubes extends continuously through the carrier such that the first end and the second end are spaced apart from the carrier.
- the method includes removing the substrate from the plurality of carbon nanotubes without removing the carrier from the plurality of carbon nanotubes to thereby form the conductive adhesive.
- the method includes applying a dicarboxylic acid onto the plurality of carbon nanotubes each disposed on the substrate to form a first layer adjacent to the substrate.
- the method also includes applying a diamide onto the first layer to form a second layer, wherein the first layer is sandwiched between the second layer and the substrate.
- the method includes condensation-polymerizing the carrier onto the plurality of carbon nanotubes.
- the carrier is spaced apart from the substrate so that each of the plurality of carbon nanotubes extends continuously through the carrier such that the first end and the second end are spaced apart from the carrier.
- the method includes washing the diamide from the carrier without removing the carrier from the plurality of carbon nanotubes.
- the method further includes, after washing, removing the substrate from the plurality of carbon nanotubes without removing the carrier from the plurality of carbon nanotubes. After removing, the method includes washing the dicarboxylic acid from the carrier without removing the carrier from the plurality of carbon nanotubes to thereby form the conductive adhesive.
- a conductive adhesive for removably joining a first surface and a second surface includes a plurality of carbon nanotubes, and a carrier formed from a condensation polymer.
- Each of the plurality of carbon nanotubes has a first end and a second end spaced opposite the first end, and each of the plurality of carbon nanotubes extends continuously through the carrier such that the first end and the second end are spaced apart from the carrier.
- FIG. 1A is a schematic illustration of a cross-sectional view of a plurality of carbon nanotubes disposed on a substrate;
- FIG. 1B is a schematic illustration of a cross-sectional view of a first layer formed from a first polymer precursor and disposed on the substrate of FIG. 1A ;
- FIG. 1C is a schematic illustration of a cross-sectional view of a second layer formed from a second polymer precursor and disposed on the first layer of FIG. 1B ;
- FIG. 1D is a schematic illustration of a cross-sectional view of a carrier formed by condensation-polymerizing the first polymer precursor of FIG. 1B and the second polymer precursor of FIG. 1C ;
- FIG. 1E is a schematic illustration of a cross-sectional view of the carrier of FIG. 1D , wherein unreacted second polymer precursor of FIG. 1C has been removed from the plurality of carbon nanotubes;
- FIG. 1F is a schematic illustration of a cross-sectional view of the carrier of FIG. 1D , wherein the substrate of FIG. 1A has been removed from the plurality of carbon nanotubes;
- FIG. 2 is a schematic illustration of a cross-sectional view of a conductive adhesive including the carrier of FIG. 1D formed between adjacent ones of the plurality of carbon nanotubes of FIG. 1A , wherein unreacted first polymer precursor of FIG. 1B has been removed from the plurality of carbon nanotubes;
- FIG. 3 is a schematic magnified perspective illustration of the conductive adhesive of FIG. 2 ;
- FIG. 4A is a schematic illustration of a cross-sectional view of the conductive adhesive of FIGS. 2 and 3 attached to a first surface;
- FIG. 4B is a schematic illustration of a cross-sectional view of the conductive adhesive of FIGS. 2 and 3 attached to the first surface of FIG. 4A and a second surface;
- FIG. 4C is a schematic illustration of a cross-sectional view of the conductive adhesive of FIGS. 2 and 3 separated from the first surface of FIG. 4A ;
- FIG. 4D is a schematic illustration of a cross-sectional view of the conductive adhesive of FIG. 4C reattached to the first surface of FIG. 4A .
- a conductive adhesive for removably joining a first surface 12 ( FIGS. 4A-4D ) and a second surface 14 ( FIGS. 4B-4D ) is shown generally at 10 in FIGS. 2-4D .
- the conductive adhesive 10 may be useful for electrically- and/or thermally-conductive applications requiring removable joining of the first surface 12 and the second surface 14 .
- the conductive adhesive 10 may be useful for joining two battery tabs (not shown) of a lithium ion battery (not shown) for an automotive vehicle (not shown).
- the conductive adhesive 10 may be useful for joining conduits or hoses (not shown) to receptacles (not shown) for automotive applications.
- the conductive adhesive 10 may replace solder or other forms of mechanical attachment, e.g., clamps, welds, or screws, for electrically- and/or thermally-conductive automotive applications.
- the conductive adhesive 10 may also be useful for non-automotive applications such as, but not limited to, removably joining surfaces 12 , 14 for aviation, rail, and marine applications.
- the terminology removably joining refers to joining the first surface 12 and the second surface 14 such that the first and second surfaces 12 , 14 may be sequentially and repeatedly attached to one another, separated or removed from one another, and reattached to one another, e.g., for repositioning the first surface 12 and/or the second surface 14 .
- a method of forming the conductive adhesive 10 is also disclosed.
- the conductive adhesive 10 includes a plurality of carbon nanotubes 16 each having a first end 18 and a second end 20 spaced opposite the first end 18 .
- Each of the plurality of carbon nanotubes 16 may be selected from the group including single-walled carbon nanotubes, multi-walled carbon nanotubes, and combinations thereof.
- the plurality of carbon nanotubes 16 may exhibit excellent mechanical properties such as Young's modulus and tensile strength.
- the plurality of carbon nanotubes 16 may exhibit an adhesion force in a shear direction (denoted generally by arrow 40 in FIG.
- the plurality of carbon nanotubes 16 may have a tensile strength of from about 25 GPa to about 35 GPa.
- the plurality of carbon nanotubes 16 may have a Young's modulus of greater than or equal to about 1,000 GPa, e.g., about 1 TPa.
- the plurality of carbon nanotubes 16 may exhibit electrical- and/or thermal-conductivity. That is, each of the plurality of carbon nanotubes 16 may transmit electrical and/or thermal energy between the first end 18 and the second end 20 .
- each of the plurality of carbon nanotubes 16 may have a generally tubular shape and may continuously extend between the first end 18 and the second end 20 .
- the first end 18 may be configured for removably attaching to the first surface 12 ( FIG. 4A ) and the second end 20 may be configured for removably attaching to the second surface 14 ( FIG. 4B ).
- each of the plurality of carbon nanotubes 16 may have a length 22 .
- the length 22 of each of the plurality of carbon nanotubes 16 may be from about 5 ⁇ m to about 15 ⁇ m, e.g., from about 8 ⁇ m to about 12 ⁇ m, wherein 1 ⁇ m is equal to 1 ⁇ 10 ⁇ 6 m.
- the conductive adhesive 10 also includes a carrier 24 formed from a condensation polymer.
- the carrier 24 may serve as a backing for the conductive adhesive 10 and may allow manual handling of the conductive adhesive 10 .
- the carrier 24 may be flexible.
- condensation polymer refers to a polymer formed by a condensation reaction, i.e., a chemical reaction in which two or more reactants yield a single main product with accompanying formation of water or some other small molecule such as ammonia, ethanol, acetic acid, or hydrogen sulfide.
- a condensation reaction is a chemical reaction in which two molecules or functional groups combine to form a single molecule and cast off a comparatively smaller molecule.
- Non-limiting examples of suitable condensation polymers may include polyamides, polyacetals, and polyesters.
- the carrier 24 is formed from a polyamide.
- polyamide refers to a polymer formed by the linkage of an amino group of one molecule and a carboxylic acid group of another molecule. That is, a polyamide refers to a polymer including monomers of amides joined by peptide bonds.
- each of the plurality of carbon nanotubes 16 extends continuously through the carrier 24 such that the first end 18 and the second end 20 of each of the plurality of carbon nanotubes 16 is spaced apart from the carrier 24 . That is, each of the plurality of carbon nanotubes 16 may extend continuously from the first end 18 to the second end 20 through the carrier 24 . Stated differently, each of the plurality of carbon nanotubes 16 may extend uninterruptedly through the carrier 24 .
- the carrier 24 may be disposed between adjacent ones of the plurality of carbon nanotubes 16 . That is, the carrier 24 may infiltrate between adjacent ones of the plurality of carbon nanotubes 16 to thereby fill spaces between each of the plurality of carbon nanotubes 16 .
- the carrier 24 may surround each of the plurality of carbon nanotubes 16 at only about a midpoint 26 ( FIG. 2 ) of the length 22 ( FIG. 2 ). That is, the carrier 24 may not surround the entire length 22 of each of the plurality of carbon nanotubes 16 , but may rather be disposed at about the midpoint 26 of each of the plurality of carbon nanotubes 16 .
- the plurality of carbon nanotubes 16 may also be vertically-aligned. That is, with continued reference to FIG. 2 , adjacent ones of the plurality of carbon nanotubes 16 may be aligned substantially parallel to one another, and may be disposed substantially perpendicular to the carrier 24 . As such, although illustrated schematically in FIGS. 2 and 3 , the plurality of carbon nanotubes 16 may extend “vertically” through the carrier 24 , i.e., in a plane (not shown) substantially perpendicular to the carrier 24 , to form a forest of carbon nanotubes 16 . Therefore, each of the plurality of carbon nanotubes 16 may have a pillar-like or tower shape and may extend through the carrier 24 so as to be disposed orthogonal to the carrier 24 .
- the conductive adhesive 10 may be characterized as dry, and as such, may not require curing or evaporation of volatile organic components.
- the conductive adhesive 10 may also be characterized as a two-sided conductive adhesive 10 , as set forth in more detail below. As such, the conductive adhesive 10 may be useful for joining at least two surfaces, e.g., the first and second surfaces 12 , 14 ( FIGS. 4B-4D ).
- the conductive adhesive 10 may be useful for removably joining the first surface 12 and the second surface 14 , wherein the first surface 12 and the second surface 14 are formed from different materials.
- the first surface 12 may be formed from a first material such as aluminum
- the second surface 14 may be formed from a second material that is different from the first material, such as steel.
- a method of forming the conductive adhesive 10 includes condensation-polymerizing the carrier 24 (FIGS. 2 and 3 ) onto the plurality of carbon nanotubes 16 each disposed on a substrate 28 ( FIGS. 1A-1E ).
- the substrate 28 may be formed from any suitable material, such as, but not limited to, polymer, metal, and fibrous underlayment.
- the method may further include, before condensation-polymerizing, depositing the plurality of carbon nanotubes 16 onto the substrate 28 .
- the plurality of carbon nanotubes 16 may be deposited onto the substrate 28 in any manner.
- the plurality of carbon nanotubes 16 may be deposited onto the substrate 28 by chemical vapor deposition, plasma enhanced chemical vapor deposition, arc discharge, and laser ablation.
- depositing may include aligning adjacent ones of the plurality of carbon nanotubes 16 substantially parallel to one another and substantially perpendicular to the substrate 28 . That is, each of the plurality of carbon nanotubes 16 may extend orthogonally from the substrate 28 so that the plurality of carbon nanotubes 16 form a forest or array of carbon nanotubes 16 on the substrate 28 .
- the first end 18 of each of the plurality of carbon nanotubes 16 may be disposed adjacent and in contact with the substrate 28 .
- the second end 20 of each of the plurality of carbon nanotubes 16 may be disposed adjacent and in contact with the substrate 28 .
- the plurality of carbon nanotubes 16 may be tightly packed on the substrate 28 .
- the plurality of carbon nanotubes 16 may be deposited on the substrate 28 in the forest or array configuration having a density of from about 1 ⁇ 10 10 carbon nanotubes 16 per cm 2 to about 1 ⁇ 10 11 carbon nanotubes 16 per cm 2 .
- the aforementioned density is merely exemplary, and fewer or more carbon nanotubes 16 may be deposited on the substrate 28 .
- condensation-polymerizing may include forming the carrier 24 between adjacent ones of the plurality of carbon nanotubes 16 . That is, condensation-polymerizing may include surrounding a portion 30 ( FIG. 2 ) of each of the plurality of carbon nanotubes 16 with the carrier 24 . More specifically, as illustrated generally in FIGS. 1D-1F and 2 , condensation-polymerizing may include forming the carrier 24 at about the midpoint 26 ( FIG. 2 ) of the length 22 ( FIG. 2 ) so that the carrier 24 does not contact the substrate 28 ( FIGS. 1D and 1E ). Therefore, the carrier 24 is spaced apart from the substrate 28 so that each of the plurality of carbon nanotubes 16 extends continuously through the carrier 24 such that the first end 18 and the second end 20 are spaced apart from the carrier 24 .
- condensation-polymerizing may include reacting a first polymer precursor 32 and a second polymer precursor 34 that is reactive with the first polymer precursor 32 .
- the first polymer precursor 32 may be a dicarboxylic acid and the second polymer precursor 34 may be a diamide, as set forth in more detail below.
- Condensation-polymerizing may include forming the carrier 24 from any suitable first polymer precursor 32 and any suitable second polymer precursor 34 to form any suitable condensation polymer.
- condensation-polymerizing may include forming the carrier 24 from a polyamide between adjacent ones of the plurality of carbon nanotubes 16 .
- condensation-polymerizing may include forming the carrier 24 from a polyacetal between adjacent ones of the plurality of carbon nanotubes 16 .
- condensation-polymerizing may include forming the carrier 24 from a polyester between adjacent ones of the plurality of carbon nanotubes 16 .
- the method also includes, after condensation-polymerizing, removing the substrate 28 ( FIG. 1E ) from the plurality of carbon nanotubes 16 without removing the carrier 24 from the plurality of carbon nanotubes 16 to thereby form the conductive adhesive 10 ( FIG. 2 ).
- the substrate 28 may be peeled from the first end 18 of each of the plurality of carbon nanotubes 16 to thereby remove the substrate 28 without removing the carrier 24 from the plurality of carbon nanotubes 16 . That is, for the method, only the substrate 28 is removed from the plurality of carbon nanotubes 16 .
- the carrier 24 is not removed, but rather remains disposed at about the midpoint 26 ( FIG. 2 ) of the length 22 ( FIG. 2 ) of each of the plurality of carbon nanotubes 16 .
- the method may further include attaching the conductive adhesive 10 to the first surface 12 , wherein the first end 18 of each of the plurality of carbon nanotubes 16 is attached to the first surface 12 . That is, the first end 18 of each of the plurality of carbon nanotubes 16 may be disposed adjacent and in contact with the first surface 12 , and the first end 18 may adhere to the first surface 12 by van der Waals forces to thereby hold the conductive adhesive 10 to the first surface 12 . Stated differently, the interaction of van der Waals forces between the first end 18 of each of the plurality of carbon nanotubes 16 and the first surface 12 may operate to bond or join the first surface 12 to the conductive adhesive 10 .
- the method may include attaching the second end 20 of each of the plurality of carbon nanotubes 16 to the second surface 14 . That is, the second end 20 of each of the plurality of carbon nanotubes 16 may be disposed adjacent and in contact with the second surface 14 , and the second end 20 may adhere to the second surface 14 by van der Waals forces to thereby hold the conductive adhesive 10 to the second surface 14 . Stated differently, the interaction of van der Waals forces between the second end 20 of each of the plurality of carbon nanotubes 16 and the second surface 14 may operate to bond or join the second surface 14 to the conductive adhesive 10 .
- the method may further include separating at least one of the first surface 12 and the second surface 14 from the conductive adhesive 10 .
- the method may include detaching the first end 18 of each of the plurality of carbon nanotubes 16 from the first surface 12 .
- the method may include detaching the second end 20 of each of the plurality of carbon nanotubes 16 from the second surface 14 .
- the conductive adhesive 10 may be separated from the at least one of the first surface 12 and the second surface 14 by any technique.
- the conductive adhesive 10 may be peeled from at least one of the first surface 12 and the second surface 14 so as to interrupt the van der Waals forces between the first end 18 of each of the plurality of carbon nanotubes 16 and the first surface 12 and/or the second end 20 of each of the plurality of carbon nanotubes 16 and the second surface 14 .
- the method may also include, after separating, reattaching the at least one of the first surface 12 and the second surface 14 to the conductive adhesive 10 to thereby removably join the first surface 12 and the second surface 14 . That is, as set forth above, reattaching may include attaching the first end 18 of each of the plurality of carbon nanotubes 16 to the first surface 12 . As such, the first end 18 of each of the plurality of carbon nanotubes 16 may be disposed adjacent and in contact with the first surface 12 , and the first end 18 may adhere to the first surface 12 by van der Waals forces to thereby hold the conductive adhesive 10 to the first surface 12 .
- the interaction of van der Waals forces between the first end 18 of each of the plurality of carbon nanotubes 16 and the first surface 12 may operate to bond or join the first surface 12 to the conductive adhesive 10 .
- reattaching may include attaching the second end 20 of each of the plurality of carbon nanotubes 16 to the second surface 14 .
- the second end 20 of each of the plurality of carbon nanotubes 16 may be disposed adjacent and in contact with the second surface 14 , and the second end 20 may adhere to the second surface 14 by van der Waals forces to thereby hold the conductive adhesive 10 to the second surface 14 .
- the interaction of van der Waals forces between the second end 20 of each of the plurality of carbon nanotubes 16 and the second surface 14 may operate to bond the second surface 14 to the conductive adhesive 10 .
- the conductive adhesive 10 may be repeatedly removably joined to the first surface 12 and/or the second surface 14 .
- the method includes condensation-polymerizing the carrier 24 formed from a polyamide onto the plurality of carbon nanotubes 16 .
- the method may include applying a dicarboxylic acid onto the plurality of carbon nanotubes 16 disposed on the substrate 28 to form a first layer 36 ( FIGS. 1B-1F ) adjacent to the substrate 28 . That is, the first layer 36 may be disposed in contact with the substrate 28 .
- the dicarboxylic acid may be applied onto the plurality of carbon nanotubes 16 by dispensing the dicarboxylic acid onto the plurality of carbon nanotubes 16 under controlled pressure so as to infiltrate the plurality of carbon nanotubes 16 .
- the plurality of carbon nanotubes 16 may be pretreated prior to applying the dicarboxylic acid to the plurality of carbon nanotubes 16 .
- Suitable dicarboxylic acids include two carboxyl groups and may be characterized by the chemical formula HOOC—R—COOH, wherein R may be an alkyl group, alkenyl group, alkynyl group, or aryl group.
- Non-limiting examples of dicarboxylic acids include, but are not limited to, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, and pimelic acid, (ortho-)phthalic acid, isophthalic acid, and terephthalic acid.
- the method may also include applying a diamide onto the first layer 36 to form a second layer 38 , wherein the first layer 36 is sandwiched between the second layer 38 and the substrate 28 . That is, the second layer 38 may be disposed in contact with the first layer 36 so that the first layer 36 contacts both the substrate 28 and the second layer 38 . Since the first layer 36 may be formed from the dicarboxylic acid, the first layer 36 may include polar functional groups and may generally have a comparatively lower viscosity than the second layer 38 . As such, the first layer 36 may be formed adjacent to the substrate 28 while the second layer 38 is formed adjacent to the first layer 36 .
- the diamide may be applied onto the plurality of carbon nanotubes 16 by wiping the diamide onto the first layer 36 under controlled pressure and speed so as to form the second layer 38 .
- the polyamide i.e., the carrier 24
- the polyamide is formed via condensation-polymerization as set forth above.
- Suitable diamides include two amide groups and may be characterized by the chemical formula RCONR 2 , wherein R may be an alkyl group, alkenyl group, alkynyl group, or aryl group.
- R may be an alkyl group, alkenyl group, alkynyl group, or aryl group.
- suitable diamides include acetamide, heaxamide, and aromatic amides such as cycloheaxanecarboxamide.
- the method also includes, after applying the diamide, condensation-polymerizing the carrier 24 onto the plurality of carbon nanotubes 16 . Therefore, for the specific embodiment set forth above, the method includes, after applying the diamide, condensation-polymerizing the carrier 24 formed from a polyamide. That is, the carrier 24 condenses and polymerizes at an interface between the first polymer precursor 32 and the second polymer precursor 34 .
- condensation-polymerizing includes reacting the first polymer precursor 32 , i.e., the dicarboxylic acid, and the second polymer precursor 34 , i.e., the diamide, to form the carrier 24 , i.e., the polyamide.
- the carrier 24 is spaced apart from the substrate 28 so that each of the plurality of carbon nanotubes 16 extends continuously through the carrier 24 such that the first end 18 and the second end 20 are spaced apart from the carrier 24 . That is, condensation-polymerizing the carrier 24 forms the carrier 24 at about the midpoint 26 ( FIG. 2 ) of the length 22 ( FIG. 2 ) of each of the plurality of carbon nanotubes 16 .
- the method includes washing the diamide from the carrier 24 without removing the carrier 24 from the plurality of carbon nanotubes 16 .
- any unreacted or excess diamide may be removed from the formed carrier 24 by diluting, flushing, and/or washing the diamide from the carrier 24 .
- only the unreacted or excess diamide is removed, and the carrier 24 is not removed from the plurality of carbon nanotubes 16 .
- the method includes removing the substrate 28 from the plurality of carbon nanotubes 16 without removing the carrier 24 from the plurality of carbon nanotubes 16 .
- the substrate 28 may be peeled from the second end 20 of each of the plurality of carbon nanotubes 16 to thereby remove the substrate 28 without removing the carrier 24 from the plurality of carbon nanotubes 16 . That is, for the method, only the substrate 28 is removed from the plurality of carbon nanotubes 16 .
- the carrier 24 is not removed, but rather remains disposed at about the midpoint 26 ( FIG. 2 ) of the length 22 ( FIG. 2 ) of each of the plurality of carbon nanotubes 16 .
- the method may include washing the dicarboxylic acid from the carrier 24 without removing the carrier 24 from the plurality of carbon nanotubes 16 to thereby form the conductive adhesive 10 .
- any unreacted or excess dicarboxylic acid may be removed from the formed carrier 24 by diluting, flushing, and/or washing the dicarboxylic acid from the carrier 24 .
- the carrier 24 is not removed from the plurality of carbon nanotubes 16 . Therefore, since the carrier 24 is not removed, each of the plurality of carbon nanotubes 16 extends continuously through the carrier 24 . Further, the first end 18 and the second end 20 of each of the plurality of carbon nanotubes 16 is spaced apart from the carrier 24 .
- the conductive adhesive 10 exhibits excellent adhesive properties and electrical- and/or thermal-conductivity through the entire length 22 ( FIG. 2 ) of each of the plurality of carbon nanotubes 16 .
- the conductive adhesive 10 is reversibly removable from the first and second surfaces 12 , 14 ( FIG. 4D ), and is therefore configured for removably joining the first surface 12 and the second surface 14 .
- the conductive adhesive 10 may be useful for electrically- and/or thermally-conductive applications such as battery tab joining, and may eliminate waste from otherwise destructive separation of battery tabs during battery maintenance operations.
- the method of forming the conductive adhesive 10 is economical and allows for continuous formation or production of the conductive adhesive 10 .
- the method of joining the first surface 12 to the second surface 14 allows for repetitious separation and reattachment of surfaces 12 , 14 without detrimentally affecting the adhesive properties and electrical- and/or thermal-conductivity of the conductive adhesive 10 .
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