US9270506B2 - Methods for bypassing faulty connections - Google Patents
Methods for bypassing faulty connections Download PDFInfo
- Publication number
- US9270506B2 US9270506B2 US14/308,122 US201414308122A US9270506B2 US 9270506 B2 US9270506 B2 US 9270506B2 US 201414308122 A US201414308122 A US 201414308122A US 9270506 B2 US9270506 B2 US 9270506B2
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- die
- bit symbol
- transferring
- vertical connectors
- data bits
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/38—Synchronous or start-stop systems, e.g. for Baudot code
- H04L25/40—Transmitting circuits; Receiving circuits
- H04L25/49—Transmitting circuits; Receiving circuits using code conversion at the transmitter; using predistortion; using insertion of idle bits for obtaining a desired frequency spectrum; using three or more amplitude levels ; Baseband coding techniques specific to data transmission systems
- H04L25/4917—Transmitting circuits; Receiving circuits using code conversion at the transmitter; using predistortion; using insertion of idle bits for obtaining a desired frequency spectrum; using three or more amplitude levels ; Baseband coding techniques specific to data transmission systems using multilevel codes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L1/00—Arrangements for detecting or preventing errors in the information received
- H04L1/22—Arrangements for detecting or preventing errors in the information received using redundant apparatus to increase reliability
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/308,122 US9270506B2 (en) | 2008-11-25 | 2014-06-18 | Methods for bypassing faulty connections |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/323,241 US8259461B2 (en) | 2008-11-25 | 2008-11-25 | Apparatus for bypassing faulty connections |
US13/588,728 US8792247B2 (en) | 2008-11-25 | 2012-08-17 | Apparatus for bypassing faulty connections |
US14/308,122 US9270506B2 (en) | 2008-11-25 | 2014-06-18 | Methods for bypassing faulty connections |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/588,728 Division US8792247B2 (en) | 2008-11-25 | 2012-08-17 | Apparatus for bypassing faulty connections |
Publications (2)
Publication Number | Publication Date |
---|---|
US20140301499A1 US20140301499A1 (en) | 2014-10-09 |
US9270506B2 true US9270506B2 (en) | 2016-02-23 |
Family
ID=42195662
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/323,241 Active 2031-02-22 US8259461B2 (en) | 2008-11-25 | 2008-11-25 | Apparatus for bypassing faulty connections |
US13/588,728 Active 2028-12-21 US8792247B2 (en) | 2008-11-25 | 2012-08-17 | Apparatus for bypassing faulty connections |
US14/308,122 Active US9270506B2 (en) | 2008-11-25 | 2014-06-18 | Methods for bypassing faulty connections |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/323,241 Active 2031-02-22 US8259461B2 (en) | 2008-11-25 | 2008-11-25 | Apparatus for bypassing faulty connections |
US13/588,728 Active 2028-12-21 US8792247B2 (en) | 2008-11-25 | 2012-08-17 | Apparatus for bypassing faulty connections |
Country Status (1)
Country | Link |
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US (3) | US8259461B2 (en) |
Cited By (6)
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WO2019070459A1 (en) * | 2017-10-02 | 2019-04-11 | Micron Technology, Inc. | Communicating data with stacked memory dies |
US10355893B2 (en) | 2017-10-02 | 2019-07-16 | Micron Technology, Inc. | Multiplexing distinct signals on a single pin of a memory device |
US10446198B2 (en) | 2017-10-02 | 2019-10-15 | Micron Technology, Inc. | Multiple concurrent modulation schemes in a memory system |
US10490245B2 (en) | 2017-10-02 | 2019-11-26 | Micron Technology, Inc. | Memory system that supports dual-mode modulation |
US10725913B2 (en) | 2017-10-02 | 2020-07-28 | Micron Technology, Inc. | Variable modulation scheme for memory device access or operation |
US11971820B2 (en) | 2022-07-13 | 2024-04-30 | Lodestar Licensing Group Llc | Variable modulation scheme for memory device access or operation |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PE20110072A1 (en) * | 2005-06-27 | 2011-02-04 | Glaxosmithkline Biolog Sa | IMMUNOGENIC COMPOSITION |
US8259461B2 (en) | 2008-11-25 | 2012-09-04 | Micron Technology, Inc. | Apparatus for bypassing faulty connections |
WO2012134932A2 (en) | 2011-03-25 | 2012-10-04 | Adc Telecommunications, Inc. | Event-monitoring in a system for automatically obtaining and managing physical layer information using a reliable packet-based communication protocol |
US8832503B2 (en) * | 2011-03-25 | 2014-09-09 | Adc Telecommunications, Inc. | Dynamically detecting a defective connector at a port |
ES2553090T3 (en) | 2011-03-25 | 2015-12-04 | Adc Telecommunications, Inc. | Identifier coding scheme for use with multipath connectors |
TW201318086A (en) | 2011-10-17 | 2013-05-01 | Ind Tech Res Inst | Testing and repairing apparatus of through silicon via in stacked-chip |
DE112011106030B4 (en) | 2011-12-23 | 2019-10-02 | Intel Corporation | Auto repair logic for a stack architecture |
US8587340B2 (en) | 2012-03-27 | 2013-11-19 | Micron Technology, Inc. | Apparatuses including scalable drivers and methods |
WO2014003793A1 (en) * | 2012-06-29 | 2014-01-03 | Intel Corporation | Charge sharing testing of through-body-vias |
KR20140020418A (en) * | 2012-08-08 | 2014-02-19 | 에스케이하이닉스 주식회사 | Semiconductor apparatus and test method thereof |
TWI469286B (en) | 2012-11-28 | 2015-01-11 | Ind Tech Res Inst | Through silicon via repair circuit of semiconductor apparatus |
TWI501361B (en) | 2012-12-27 | 2015-09-21 | Ind Tech Res Inst | Through silicon via repair circuit |
TWI496256B (en) | 2012-12-28 | 2015-08-11 | Ind Tech Res Inst | Through silicon via repair circuit of semiconductor apparatus |
US9136843B2 (en) | 2013-04-21 | 2015-09-15 | Industrial Technology Research Institute | Through silicon via repair circuit of semiconductor device |
US9213358B2 (en) * | 2013-10-31 | 2015-12-15 | Qualcomm Incorporated | Monolithic three dimensional (3D) integrated circuit (IC) (3DIC) cross-tier clock skew management systems, methods and related components |
KR101573628B1 (en) * | 2014-09-04 | 2015-12-01 | 성균관대학교산학협력단 | Three-dimensional integrated circuit and tsv repairing method thereof |
EP3217291B1 (en) * | 2016-03-11 | 2020-06-17 | Socionext Inc. | Integrated circuitry systems |
JP6570498B2 (en) * | 2016-09-27 | 2019-09-04 | インテル・コーポレーション | Apparatus, system, method, program, and computer-readable storage medium |
US11842894B2 (en) | 2019-12-23 | 2023-12-12 | Adeia Semiconductor Bonding Technologies Inc. | Electrical redundancy for bonded structures |
US11721653B2 (en) | 2019-12-23 | 2023-08-08 | Adeia Semiconductor Bonding Technologies Inc. | Circuitry for electrical redundancy in bonded structures |
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Also Published As
Publication number | Publication date |
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US8792247B2 (en) | 2014-07-29 |
US8259461B2 (en) | 2012-09-04 |
US20120306668A1 (en) | 2012-12-06 |
US20140301499A1 (en) | 2014-10-09 |
US20100127758A1 (en) | 2010-05-27 |
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