US9039222B2 - Backlight module with light-guiding portions - Google Patents

Backlight module with light-guiding portions Download PDF

Info

Publication number
US9039222B2
US9039222B2 US13/926,084 US201313926084A US9039222B2 US 9039222 B2 US9039222 B2 US 9039222B2 US 201313926084 A US201313926084 A US 201313926084A US 9039222 B2 US9039222 B2 US 9039222B2
Authority
US
United States
Prior art keywords
light
backlight module
diffusion board
led
light diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US13/926,084
Other versions
US20140063849A1 (en
Inventor
Chao-Hsiung Chang
Pin-Chuan Chen
Li-Hsiang Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Optoelectronic Technology Inc
Original Assignee
Advanced Optoelectronic Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Optoelectronic Technology Inc filed Critical Advanced Optoelectronic Technology Inc
Assigned to ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. reassignment ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, CHAO-HSIUNG, CHEN, LI-HSIANG, CHEN, PIN-CHUAN
Publication of US20140063849A1 publication Critical patent/US20140063849A1/en
Application granted granted Critical
Publication of US9039222B2 publication Critical patent/US9039222B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133606Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED

Definitions

  • the disclosure generally relates to lighting sources, particularly, to a backlight module with light-guiding portions.
  • a typical backlight module includes a substrate, a plurality of light emitting diode (LED) packages arranged on the substrate, and a light diffusion board spaced and over the LED packages.
  • the light diffusion board includes a flat light incident surface facing toward the LED packages and a flat light output surface opposite to the flat incident surface. Light emitted from the LED packages emits into the light diffusion board from the flat incident surface of the diffusion board, and then, the light can be diffused by the light diffusion board to emit out from the flat light output surface.
  • each LED package generates a smooth round light field, and the light emitted from the LED package is mainly concentrated at a center thereof.
  • the light at a periphery of the LED package is relatively poor to illuminate. Therefore, the light emitted from the LED packages can not be uniformly emitted into the light diffusion board. When this happens, the performance of the backlight module deteriorates.
  • the LED packages are made to be more and more powerful. If the light diffusion board and the LED packages are located too close to each other, white spot mura may appear in the LCD which is lightened by the backlight module. If the distance between the light diffusion board and the LED packages is increased, a bulk of the backlight module must be increased accordingly, which is opposite the trend of compact design.
  • FIG. 1 is a schematic, assembled view of a backlight module in accordance with a first embodiment of the present disclosure.
  • FIG. 2 is a perspective view of a diffusion board with light-guiding portions of the backlight module of FIG. 1 .
  • FIG. 3 is a front side view of the backlight module wherein light path of the backlight module is shown.
  • FIG. 4 is a schematic, assembled view of a backlight module in accordance with a second embodiment of the present disclosure.
  • FIG. 5 is a top plan view of a lens of the backlight module of FIG. 4 .
  • FIG. 6 is a cross-sectional view of the lens of FIG. 5 , taken along a line VI-VI thereof.
  • FIG. 7 shows light paths of the backlight module of FIG. 4 .
  • a backlight module 100 in accordance with a first exemplary embodiment is provided.
  • the backlight module is used for illuminating a liquid crystal display (LCD, not shown).
  • the backlight module 100 includes a substrate 10 , a plurality of separate LED packages 20 mounted on a top surface of the substrate 10 , and a light diffusion board 30 located over the LED packages 20 .
  • the substrate 10 is a flat plate.
  • a circuit (not shown) is arranged on the top surface of the substrate 10 .
  • the substrate 10 is made of electrically insulating materials, such as silicone, epoxy or ceramic.
  • the LED packages 20 are electrically connected to the circuit on the substrate 10 .
  • the LED packages 20 are equidistantly spaced from each other.
  • the LED package 20 includes a metal base 21 , an LED chip 23 mounted on the base 21 , and an encapsulant layer 25 encapsulating the LED chip 23 therein.
  • the metal base 21 is arranged directly on the top surface of the substrate 10 .
  • the light diffusion board 30 is a rectangular board.
  • the light diffusion board 30 has a top surface 301 and a bottom surface 303 opposite to the top surface 301 .
  • the top surface 301 of the light diffusion board 30 is far away from the LED packages 20 , and the bottom surface 303 faces toward the LED packages 20 .
  • the top surface 301 of the light diffusion board 30 functions as a light outputting surface, and the bottom surface 303 functions as a light incident surface.
  • a light diffusion film 32 is coated on the top surface 301 of the light diffusion board 30 to enhance a diffusing efficiency of the light diffusion board 30 .
  • the light diffusion board 30 is made of material with a high refractive index.
  • a plurality of light-guiding portions 31 extends downwardly from the light incident surface of the light diffusion board 30 .
  • Each light-guiding portion 31 is aligned with and spaced from the corresponding LED package 20 .
  • Light travelling to the light-guiding portion 31 is adjusted by the light-guiding portion 31 to be evenly emitted out therefrom.
  • the light-guiding portions 31 are extending from the bottom surface 303 , and are oriented toward the LED packages 20 correspondingly.
  • the light-guiding portions 31 are spaced from each other with the same distance therebetween.
  • Each light-guiding portion 31 is funnel shaped, and is symmetrical about an axis II-II′.
  • the axis II-II′ of the light-guiding portion 31 is coincided with the optical axis I-I′ of the corresponding LED package 20 .
  • the axis II-II′ extends through a bottom tip and a center of the light-guiding portion 31 .
  • the axis I-I′ extends through a center of the LED chip 23 .
  • a diameter of the light-guiding portion 31 is decreased from a top end connecting the light incident surface of the light diffusion board 30 to the bottom tip oriented toward the LED package 20 .
  • Each light-guiding portion 31 includes a concave surface 311 .
  • the concave surface 311 is recessed inwardly from an outer periphery of the light-guiding portion 31 .
  • the curvature of the concave surface 311 is varied from 0.5 mm ⁇ 1 to 1.5 mm ⁇ 1 .
  • a part of light emitted from each LED package 20 and located near the center of each LED package 20 is emitted into the corresponding light-guiding portion 31 , and then, this part of light can be divergently refracted by the concave surfaces 311 to reach a periphery of the top end of the light-guiding portion 31 , whereby the radiation angle of this part of light into the light diffusion board 30 can be enlarged.
  • Another part of light at a periphery of the LED package 20 is directly emitted into and mixed in the region of the light diffusion board 30 between adjacent light-guiding portions 31 and beside the corresponding light-guiding portion 31 .
  • the overall light emitted from the LED packages 20 is uniformly and divergently emitted into the light diffusion board 30 .
  • the backlight module 100 ′ further includes a plurality of covers 40 covering the LED packages 20 respectively, and a plurality of optical lens 50 arranged on the covers 40 respectively.
  • light emitted from the LED packages 20 can be further divergently refracted by the cover 40 and the optical lens 50 successively before emitted into the light diffusion board 30 .
  • Each cover 40 is made of transparent material, such as epoxy.
  • the cover 40 defines a cavity 401 therein, and the cavity 401 is recessed from a bottom surface of the cover 40 which connects the substrate 10 to a top end thereof away from the substrate 10 .
  • the cavity 401 is arc-shaped, and the cavity 401 receives the corresponding LED package 20 therein.
  • An inner surface of the cavity 401 is spaced from the LED package 20 . In this embodiment, the inner surface of the cavity 401 refracts light emitted from the LED package 20 into the lens 50 uniformly.
  • the lens 50 is located on the top surface of the cover 40 , and light emitted into the lens 50 can be further refracted and diverged into the light diffusion board 30 .
  • the lens is a Fresnel lens.
  • the lens 50 is sustainably a circular plate, and is symmetrical about an axis O-O′.
  • the lens 50 includes a main body 51 and a light-diverging part 53 formed on a top end of the main body 51 .
  • the main body 51 is disk-shaped, and a size of a bottom surface thereof equals to a top surface of the cover 40 . As such, an outer periphery of the main body 51 is coplanar with an outer periphery of the cover 40 .
  • the light-diverging part 53 includes a plurality of protruding portions 531 radiating outwardly from a center of the top end of the lens 50 .
  • the protruding portions 531 are a series of continuous concentric rings. An inner diameter of the protruding portions 531 are gradually increased outwardly from the axis O-O′.
  • each circular protruding portion 531 includes a first surface 5311 perpendicular to the main body 51 , and a second surface 5313 inclined from a top of the first surface 5313 toward the main body 51 .
  • the second surface 5313 is inclined downwardly and inwardly toward the axis O-O′.
  • a distance between the bottom surface 303 of the light diffusion board 30 and the LED chip 23 is varied from 15 millimeters (mm) to 40 millimeters (mm).
  • the distance between the bottom surface 303 and the LED chip 23 is 30 millimeters (mm).
  • light emitted from the LED packages 20 travels into the inner surface of the cover 40 , and the light is refracted divergently by the inner surface of the cover 40 into the lens 50 uniformly. And then, the light emitted into the lens 50 is refracted divergently and uniformly by the light-diverging part 53 into the light diffusion board 30 .
  • a part of light emitted from the lens 50 and located near the center of the lens 50 is further uniformly refracted by the corresponding light-guiding portion 31 to reach a periphery of a top end of the corresponding light-guiding portion 31 , whereby the radiation angle of this part of light into the light diffusion board 30 can be enlarged.
  • Another part of the light emitted from the lens 50 and located at a periphery of the lens 50 directly transmits into and is mixed in the regions of the light diffusion board 30 between adjacent light-guiding portions 31 and beside the corresponding light-guiding portion 31 .
  • the light emitted from the LED packages 20 are uniformly and divergently emitted into the light diffusion board 30 , which increases the performance of the backlight module.

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

A backlight module includes a substrate, a plurality of LED packages mounted on the substrate and a light diffusion board located above the LED packages. The light diffusion board includes a light incident surface facing toward the LED packages and a light output surface. A plurality of light-guiding portions is configured extending from the incident surface of the light diffusion board toward the LED package. Each light-guiding portion comprises a concave surface at an outer periphery thereof. A diameter of each light-guiding portion decreases gradually from light diffusion board toward the LED packages. The concave surface of each light-guiding portion is recessed inwardly from the outer periphery of the light-guiding portion. Light from the LED packages and emitting into the light-guiding potions is divergently and uniformly adjusted into the light diffusion board by the concave surfaces of the light-guiding portions.

Description

BACKGROUND
1. Technical Field
The disclosure generally relates to lighting sources, particularly, to a backlight module with light-guiding portions.
2. Description of Related Art
A typical backlight module includes a substrate, a plurality of light emitting diode (LED) packages arranged on the substrate, and a light diffusion board spaced and over the LED packages. The light diffusion board includes a flat light incident surface facing toward the LED packages and a flat light output surface opposite to the flat incident surface. Light emitted from the LED packages emits into the light diffusion board from the flat incident surface of the diffusion board, and then, the light can be diffused by the light diffusion board to emit out from the flat light output surface.
However, each LED package generates a smooth round light field, and the light emitted from the LED package is mainly concentrated at a center thereof. The light at a periphery of the LED package is relatively poor to illuminate. Therefore, the light emitted from the LED packages can not be uniformly emitted into the light diffusion board. When this happens, the performance of the backlight module deteriorates. Particularly, the LED packages are made to be more and more powerful. If the light diffusion board and the LED packages are located too close to each other, white spot mura may appear in the LCD which is lightened by the backlight module. If the distance between the light diffusion board and the LED packages is increased, a bulk of the backlight module must be increased accordingly, which is opposite the trend of compact design.
What is needed, therefore, is a backlight module with light-guiding portions which can overcome the described-above shortcomings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic, assembled view of a backlight module in accordance with a first embodiment of the present disclosure.
FIG. 2 is a perspective view of a diffusion board with light-guiding portions of the backlight module of FIG. 1.
FIG. 3 is a front side view of the backlight module wherein light path of the backlight module is shown.
FIG. 4 is a schematic, assembled view of a backlight module in accordance with a second embodiment of the present disclosure.
FIG. 5 is a top plan view of a lens of the backlight module of FIG. 4.
FIG. 6 is a cross-sectional view of the lens of FIG. 5, taken along a line VI-VI thereof.
FIG. 7 shows light paths of the backlight module of FIG. 4.
DETAILED DESCRIPTION
Embodiments of backlight modules in accordance with the present disclosure will now be described in detail below and with reference to the drawings.
Referring to FIG. 1, a backlight module 100 in accordance with a first exemplary embodiment is provided. The backlight module is used for illuminating a liquid crystal display (LCD, not shown). The backlight module 100 includes a substrate 10, a plurality of separate LED packages 20 mounted on a top surface of the substrate 10, and a light diffusion board 30 located over the LED packages 20.
The substrate 10 is a flat plate. A circuit (not shown) is arranged on the top surface of the substrate 10. In this embodiment, the substrate 10 is made of electrically insulating materials, such as silicone, epoxy or ceramic.
The LED packages 20 are electrically connected to the circuit on the substrate 10. The LED packages 20 are equidistantly spaced from each other. The LED package 20 includes a metal base 21, an LED chip 23 mounted on the base 21, and an encapsulant layer 25 encapsulating the LED chip 23 therein. The metal base 21 is arranged directly on the top surface of the substrate 10.
The light diffusion board 30 is a rectangular board. The light diffusion board 30 has a top surface 301 and a bottom surface 303 opposite to the top surface 301. The top surface 301 of the light diffusion board 30 is far away from the LED packages 20, and the bottom surface 303 faces toward the LED packages 20. The top surface 301 of the light diffusion board 30 functions as a light outputting surface, and the bottom surface 303 functions as a light incident surface. A light diffusion film 32 is coated on the top surface 301 of the light diffusion board 30 to enhance a diffusing efficiency of the light diffusion board 30. In this embodiment, the light diffusion board 30 is made of material with a high refractive index.
A plurality of light-guiding portions 31 extends downwardly from the light incident surface of the light diffusion board 30. Each light-guiding portion 31 is aligned with and spaced from the corresponding LED package 20. Light travelling to the light-guiding portion 31 is adjusted by the light-guiding portion 31 to be evenly emitted out therefrom.
Also referring to FIG. 2, the light-guiding portions 31 are extending from the bottom surface 303, and are oriented toward the LED packages 20 correspondingly. The light-guiding portions 31 are spaced from each other with the same distance therebetween.
Each light-guiding portion 31 is funnel shaped, and is symmetrical about an axis II-II′. The axis II-II′ of the light-guiding portion 31 is coincided with the optical axis I-I′ of the corresponding LED package 20. The axis II-II′ extends through a bottom tip and a center of the light-guiding portion 31. The axis I-I′ extends through a center of the LED chip 23. A diameter of the light-guiding portion 31 is decreased from a top end connecting the light incident surface of the light diffusion board 30 to the bottom tip oriented toward the LED package 20. Each light-guiding portion 31 includes a concave surface 311. The concave surface 311 is recessed inwardly from an outer periphery of the light-guiding portion 31. Preferably, the curvature of the concave surface 311 is varied from 0.5 mm−1 to 1.5 mm−1.
Referring to FIG. 3, according to the backlight module 100 of the first embodiment of the disclosure, a part of light emitted from each LED package 20 and located near the center of each LED package 20 is emitted into the corresponding light-guiding portion 31, and then, this part of light can be divergently refracted by the concave surfaces 311 to reach a periphery of the top end of the light-guiding portion 31, whereby the radiation angle of this part of light into the light diffusion board 30 can be enlarged. Another part of light at a periphery of the LED package 20 is directly emitted into and mixed in the region of the light diffusion board 30 between adjacent light-guiding portions 31 and beside the corresponding light-guiding portion 31. Thus the overall light emitted from the LED packages 20 is uniformly and divergently emitted into the light diffusion board 30.
Referring to FIG. 4, another backlight module 100′ in accordance with a second embodiment is provided. The backlight module 100′ further includes a plurality of covers 40 covering the LED packages 20 respectively, and a plurality of optical lens 50 arranged on the covers 40 respectively. In this embodiment, light emitted from the LED packages 20 can be further divergently refracted by the cover 40 and the optical lens 50 successively before emitted into the light diffusion board 30.
Each cover 40 is made of transparent material, such as epoxy. The cover 40 defines a cavity 401 therein, and the cavity 401 is recessed from a bottom surface of the cover 40 which connects the substrate 10 to a top end thereof away from the substrate 10. The cavity 401 is arc-shaped, and the cavity 401 receives the corresponding LED package 20 therein. An inner surface of the cavity 401 is spaced from the LED package 20. In this embodiment, the inner surface of the cavity 401 refracts light emitted from the LED package 20 into the lens 50 uniformly.
The lens 50 is located on the top surface of the cover 40, and light emitted into the lens 50 can be further refracted and diverged into the light diffusion board 30.
Also referring to FIGS. 5-6, the lens is a Fresnel lens. The lens 50 is sustainably a circular plate, and is symmetrical about an axis O-O′. The lens 50 includes a main body 51 and a light-diverging part 53 formed on a top end of the main body 51. The main body 51 is disk-shaped, and a size of a bottom surface thereof equals to a top surface of the cover 40. As such, an outer periphery of the main body 51 is coplanar with an outer periphery of the cover 40.
The light-diverging part 53 includes a plurality of protruding portions 531 radiating outwardly from a center of the top end of the lens 50. The protruding portions 531 are a series of continuous concentric rings. An inner diameter of the protruding portions 531 are gradually increased outwardly from the axis O-O′.
A width of each circular protruding portion 531 is gradually increased from the outer end far away from the main body 51 to the inner end connecting the main body 51. Each circular protruding portion 531 includes a first surface 5311 perpendicular to the main body 51, and a second surface 5313 inclined from a top of the first surface 5313 toward the main body 51. In this embodiment, the second surface 5313 is inclined downwardly and inwardly toward the axis O-O′.
In this embodiment, a distance between the bottom surface 303 of the light diffusion board 30 and the LED chip 23 is varied from 15 millimeters (mm) to 40 millimeters (mm). Preferably, the distance between the bottom surface 303 and the LED chip 23 is 30 millimeters (mm).
Referring to FIG. 7, according to the backlight module 100′, light emitted from the LED packages 20 travels into the inner surface of the cover 40, and the light is refracted divergently by the inner surface of the cover 40 into the lens 50 uniformly. And then, the light emitted into the lens 50 is refracted divergently and uniformly by the light-diverging part 53 into the light diffusion board 30. A part of light emitted from the lens 50 and located near the center of the lens 50 is further uniformly refracted by the corresponding light-guiding portion 31 to reach a periphery of a top end of the corresponding light-guiding portion 31, whereby the radiation angle of this part of light into the light diffusion board 30 can be enlarged. Another part of the light emitted from the lens 50 and located at a periphery of the lens 50 directly transmits into and is mixed in the regions of the light diffusion board 30 between adjacent light-guiding portions 31 and beside the corresponding light-guiding portion 31. As a result, the light emitted from the LED packages 20 are uniformly and divergently emitted into the light diffusion board 30, which increases the performance of the backlight module.
It is to be understood that the above-described embodiments are intended to illustrate rather than limit the disclosure. Variations may be made to the embodiments without departing from the spirit of the disclosure as claimed. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.

Claims (16)

What is claimed is:
1. A backlight module comprising:
a substrate;
a plurality of separate light emitting diode (LED) packages mounted on the substrate; and
a light diffusion board located above the LED packages, the light diffusion board comprising a light incident surface oriented toward the LED packages and a light outputting surface opposite to the light incident surface, a plurality of light-guiding portions being configured extending from the incident surface of the light diffusion board, the light-guiding portions facing toward and aligned with the LED packages, respectively, each light-guiding portion comprising a concave surface, light emitting into the light-guiding portions being divergently refracted by the concave surfaces of the light-guiding portions into the light diffusion board;
wherein each light-guiding portion is funnel shaped, and a diameter of the light-guiding portion is decreasing gradually from a top end connecting the light diffusion board to a bottom end facing toward a corresponding LED package.
2. The backlight module of claim 1, wherein the concave surface is recessed inwardly from an outer periphery of the light-guiding portion.
3. The backlight module of claim 2, wherein a curvature of the concave surface is varied from 0.5 mm-1 to 1.5 mm-1.
4. The backlight module of claim 1, wherein a light diffusion film is coated on the light output surface of the light diffusion board.
5. The backlight module of claim 1 further comprising covers covering the LED packages respectively, wherein each cover defines a cavity therein, and the cavity receives a corresponding LED therein.
6. The backlight module of claim 5, wherein light emitted from the corresponding LED package and into an inner surface of each cover defining the cavity is refracted divergently by the inner surface into the light diffusion board.
7. The backlight module of claim 6, wherein the cavity is arc-shaped, and is recessed from a bottom surface connecting the substrate toward a top surface far away from the substrate.
8. The backlight module of claim 6, wherein the distance between the LED chip and the light incident surface of the light diffusion board is 30 millimeters.
9. The backlight module of claim 5, wherein optical lenses are located on the covers respectively, light emitted from each cover and into a corresponding optical lens is refracted divergently by the corresponding optical lens into the light diffusion board.
10. The backlight module of claim 9, wherein each optical lens comprises a main body and a light-diverging part formed on a top end of the main body, and light emitted into the optical lens is refracted divergently into the light diffusion board by the light-diverging part.
11. The backlight module of claim 10, wherein each light-diverging part comprises a plurality of circular protruding portions radiating outwardly from a center of a corresponding optical lens.
12. The backlight module of claim 11, wherein each light-diverging part comprise a first surface perpendicular to the main body of the light-diverging part and a second surface inclined downwardly from a top of the first surface toward the main body.
13. The backlight module of claim 12, wherein the second surface is inclined inwardly from the top of the first surface toward the center of the corresponding optical lens.
14. The backlight module of claim 9, wherein each optical lens is a Fresnel lens.
15. The backlight module of claim 5, wherein each LED package comprises a metal base mounted on the substrate and an LED chip arranged on the metal base, and a distance between the LED chip and the light incident surface of the light diffusion board is varied from 15 millimeters to 40 millimeters.
16. A backlight module comprising:
a substrate;
a plurality of separate light emitting diode (LED) packages mounted on the substrate; and
a light diffusion board located above the LED packages, the light diffusion board comprising a light incident surface oriented toward the LED packages and a light outputting surface opposite to the light incident surface, a plurality of light-guiding portions being configured extending from the incident surface of the light diffusion board, the light-guiding portions facing toward and aligned with the LED packages, respectively, each light-guiding portion comprising a concave surface, light emitting into the light-guiding portions being divergently refracted by the concave surfaces of the light-guiding portions into the light diffusion board;
wherein the concave surface is recessed inwardly from an outer periphery of the light-guiding portion;
wherein a curvature of the concave surface is varied from 0.5 mm-1 to 1.5 mm-1;
wherein each light-guiding portion is funnel shaped, and a diameter of the light-guiding portion is decreasing gradually from a top end connecting the light diffusion board to a bottom end facing toward a corresponding LED package; and
wherein the backlight module further comprising covers covering the LED packages respectively, each cover defines a cavity therein, and the cavity receives a corresponding LED therein.
US13/926,084 2012-09-04 2013-06-25 Backlight module with light-guiding portions Expired - Fee Related US9039222B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN2012103217105 2012-09-04
CN201210321710 2012-09-04
CN201210321710.5A CN103672568A (en) 2012-09-04 2012-09-04 Direct type backlight module

Publications (2)

Publication Number Publication Date
US20140063849A1 US20140063849A1 (en) 2014-03-06
US9039222B2 true US9039222B2 (en) 2015-05-26

Family

ID=50187358

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/926,084 Expired - Fee Related US9039222B2 (en) 2012-09-04 2013-06-25 Backlight module with light-guiding portions

Country Status (3)

Country Link
US (1) US9039222B2 (en)
CN (1) CN103672568A (en)
TW (1) TW201411033A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190277476A1 (en) * 2016-09-29 2019-09-12 Lumileds Llc Lighting assembly with diffusor

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105065942B (en) * 2012-06-26 2017-09-26 扬升照明股份有限公司 Light source module
TWI575268B (en) * 2012-12-21 2017-03-21 鴻海精密工業股份有限公司 Backlight module
CN104696780B (en) * 2013-12-05 2017-04-26 富泰华精密电子(郑州)有限公司 Backlight module and light source assembly thereof
CN106773323A (en) * 2017-02-23 2017-05-31 惠州市华阳多媒体电子有限公司 A kind of efficiency of light energy utilization backing structure high
CN108287438B (en) * 2018-03-30 2020-11-27 京东方科技集团股份有限公司 Backlight module and display device
CN110456564A (en) * 2019-07-30 2019-11-15 武汉华星光电技术有限公司 Backlight module and display device
CN112083603A (en) * 2020-09-21 2020-12-15 深圳市聚飞光电股份有限公司 Backlight module and electronic equipment
CN114609826A (en) * 2022-03-11 2022-06-10 Tcl华星光电技术有限公司 Backlight module and liquid crystal display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020181222A1 (en) * 2001-04-06 2002-12-05 Boyd Gary T. Linear illumination source
US20090213571A1 (en) * 2008-02-22 2009-08-27 Min Ji Jin Back light unit
US8675149B2 (en) * 2010-04-13 2014-03-18 Lg Electronics Inc. Backlight unit and display apparatus comprising the same
US8684549B2 (en) * 2009-03-05 2014-04-01 Seiko Epson Corporation Illumination device and display apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6974229B2 (en) * 2003-05-21 2005-12-13 Lumileds Lighting U.S., Llc Devices for creating brightness profiles
CN2725938Y (en) * 2004-07-19 2005-09-14 颖台科技股份有限公司 Direct falling type backlight module tructure of high uniformity illuminating
KR100657284B1 (en) * 2004-11-03 2006-12-14 삼성전자주식회사 Back light unit and liquid display apparatus employing it
CN2829098Y (en) * 2005-03-04 2006-10-18 东贝光电科技股份有限公司 Improved structure of side solid semiconductor light-emitting element
KR100665222B1 (en) * 2005-07-26 2007-01-09 삼성전기주식회사 Led package with diffusing material and method of manufacturing the same
CN101201496A (en) * 2006-12-12 2008-06-18 钰瀚科技股份有限公司 Backlight module with fluorescent layer and display panel
JP2009283438A (en) * 2007-12-07 2009-12-03 Sony Corp Lighting device, display device, and manufacturing method of lighting device
CN101936489A (en) * 2010-09-03 2011-01-05 深圳市华星光电技术有限公司 Backlight module and optical assembly thereof
CN102537755A (en) * 2010-12-14 2012-07-04 上海蓝光科技有限公司 Direct type backlight source module
CN102221169B (en) * 2011-06-27 2012-10-03 友达光电(苏州)有限公司 Straight down type LED (light-emitted diode) backlight module and LED structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020181222A1 (en) * 2001-04-06 2002-12-05 Boyd Gary T. Linear illumination source
US20090213571A1 (en) * 2008-02-22 2009-08-27 Min Ji Jin Back light unit
US8684549B2 (en) * 2009-03-05 2014-04-01 Seiko Epson Corporation Illumination device and display apparatus
US8675149B2 (en) * 2010-04-13 2014-03-18 Lg Electronics Inc. Backlight unit and display apparatus comprising the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190277476A1 (en) * 2016-09-29 2019-09-12 Lumileds Llc Lighting assembly with diffusor
US10845025B2 (en) * 2016-09-29 2020-11-24 Lumileds Llc Lighting assembly with diffusor

Also Published As

Publication number Publication date
CN103672568A (en) 2014-03-26
TW201411033A (en) 2014-03-16
US20140063849A1 (en) 2014-03-06

Similar Documents

Publication Publication Date Title
US9039222B2 (en) Backlight module with light-guiding portions
JP5325639B2 (en) Light emitting device
JP5797393B2 (en) Light emitting device package
US20140092584A1 (en) Light-emitting device, illuminating apparatus, and display apparatus
US9169991B2 (en) Lens and backlight module having the lens
US9182099B2 (en) Lens and LED light module having the same
JP2012234906A (en) Light-emitting device and luminaire using the same
WO2011084001A2 (en) Aspheric led lens and a light emitting device including the same
US20120243224A1 (en) Light emitting device and surface light source apparatus using same
CN111129258A (en) Light emitting device and light emitting module
US10678036B2 (en) Optical device and light source module including the same
US20130234183A1 (en) Led module
KR101028316B1 (en) Lgiht emitting diode package
TW201704683A (en) Lens and light-emitting element having same
KR20140129749A (en) Light source unit and display device having the same
US20140293607A1 (en) Lens module and led lighting module having the same
US20140177207A1 (en) Backlight module
KR101802997B1 (en) Light emitting module and lens
TW201708847A (en) Lens and light-emitting device having same
US9966413B2 (en) Light-emitting diode module and lamp using the same
US20130088851A1 (en) Lighting module and lighting device thereof
KR20180039787A (en) LED module with lens
CN107957010B (en) Light source device
JP2014022489A (en) Semiconductor light-emitting device with optical member
US20120175656A1 (en) Light emitting diode package

Legal Events

Date Code Title Description
AS Assignment

Owner name: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHANG, CHAO-HSIUNG;CHEN, PIN-CHUAN;CHEN, LI-HSIANG;REEL/FRAME:030684/0311

Effective date: 20130619

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20230526